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BTS141E3064NKSA1

Infineon Technologies

BTS141E3064NKSA1 by Infineon Technologies

BTS141E3064NKSA1 by Infineon Technologies is a MOS peripheral driver with 3 terminals, operating at a nominal voltage of 12V. Its package body material is PLASTIC/EPOXY, and it has a terminal pitch of 2.54mm. This component is commonly used in applications requiring precise power control and switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 4,762 parts In-Stock

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Vyrian

USA . 4,256 parts In-Stock

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Digiode

USA . 815 parts In-Stock

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Lakeland Logistics Inc

USA . 55 parts In-Stock

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Bristol Electronics

USA . 55 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 2,864 parts In-Stock

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$1.545

100+ parts

$1.483

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$1.421

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2,864

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Corohmni

South Africa . 968 parts In-Stock

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$1.545

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Aztec Data Supply Inc.

USA . 153 parts In-Stock

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$5.565

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Semicontronic

India . 199 parts In-Stock

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$10.500

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$10.238

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$10.185

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199

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$10.185

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AZTECH Wire

Italy . 855 parts In-Stock

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$17.410

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855

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Ampacity Inc.

Singapore . 875 parts In-Stock

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$31.500

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Argo Parts USA

USA . 2,312 parts In-Stock

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Continental Prestige Electronics

USA . 1,787 parts In-Stock

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Corphita

USA . 866 parts In-Stock

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Microchip USA

USA . 117 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the BTS141E3064NKSA1 by Infineon Technologies. Manufactured with precision and reliability, this peripheral driver offers seamless integration and high performance in a compact design. Ideal for a wide range of applications, from automotive to industrial, this product provides customers with the value and benefits they need for their projects. Upgrade your systems with ease and efficiency using the BTS141E3064NKSA1 and experience the quality and reliability that only Infineon Technologies can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection of the internal components, making the product long-lasting and reliable.

Power Supplies (V): 12

Operating at a power supply voltage of 12V ensures compatibility with a wide range of devices and systems, making it versatile and easy to integrate.

No. of Terminals: 3

Having 3 terminals allows for easy connection to other components or circuits, enhancing the flexibility and functionality of the product.

Terminal Position: SINGLE

The single terminal position simplifies the installation process and reduces the chances of errors, making it user-friendly and convenient to use.

Technology: MOS

The MOS technology used in this product offers high efficiency and performance, ensuring optimal functionality and reliability in various applications.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12V ensures stable and consistent performance, making it suitable for a wide range of electrical systems and devices.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy connection and compatibility with standard connectors, ensuring seamless integration and ease of use.

Technical Specifications

Peripheral Drivers BTS141E3064NKSA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Driver No. of Bits:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.1TB

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Technology:

MOS

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

BTS141E3064NKSA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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