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BSS670S2LL6327

Infineon Technologies

BSS670S2LL6327 by Infineon Technologies

Infineon BSS670S2LL6327 is a N-CHANNEL FET with 55V DS Breakdown Voltage, 0.54A ID, and 0.825 ohm RDS. Ideal for SWITCHING applications in ENHANCEMENT MODE, it features a built-in DIODE and operates up to 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Chip Stock

USA . 410,500 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 6,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5,135 parts In-Stock

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ComSIT USA

USA . 5,135 parts In-Stock

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VNN

France . 1,930 parts In-Stock

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Vyrian

USA . 1,513 parts In-Stock

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Digiode

USA . 460 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Corohmni

South Africa . 176 parts In-Stock

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$0.809

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Aztec Data Supply Inc.

USA . 106 parts In-Stock

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$1.256

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Modulus Dynamics

Lithuania . 3,302 parts In-Stock

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$1.970

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$1.891

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$1.812

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AZTECH Wire

Italy . 884 parts In-Stock

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$13.288

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Ampacity Inc.

Singapore . 859 parts In-Stock

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Semicontronic

India . 1,590 parts In-Stock

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$20.524

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A-Z Elektronik GmbH

Germany . 13,373 parts In-Stock

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Continental Prestige Electronics

USA . 4,345 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,882 parts In-Stock

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Argo Parts USA

USA . 3,780 parts In-Stock

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Corphita

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

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Bastille Electronics

Australia . 89 parts In-Stock

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Overview

Enhance your electronic devices with the BSS670S2LL6327 by Infineon Technologies. Crafted with precision and expertise, this small signal field effect transistor offers superior quality and reliability. Ideal for switching applications, this N-Channel transistor provides seamless performance with its built-in diode. With a minimum DS breakdown voltage of 55V and a maximum drain current of 0.54A, this product ensures efficiency and durability. Trust in Infineon Technologies to deliver cutting-edge technology that meets your needs. Elevate your projects with the BSS670S2LL6327 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the transistor, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics compared to P-Channel transistors, making this product a reliable choice for various applications.

Minimum DS Breakdown Voltage: 55 V

With a high breakdown voltage, this transistor can handle higher voltages without failing, making it suitable for applications that require robustness.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this transistor to operate efficiently even in high-temperature environments, increasing its versatility.

Maximum Drain Current (ID): 0.54 A

With a high maximum drain current, this transistor can handle higher currents without overheating, making it suitable for applications with higher power requirements.

Maximum Drain-Source On Resistance: 0.825 ohm

The low on-resistance of this transistor results in lower power dissipation and improved efficiency, making it a cost-effective choice for energy-efficient applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS670S2LL6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (ID):

.54 A

Maximum Drain-Source On Resistance:

.825 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS670S2LL6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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