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BSS606NH6327TR

Infineon Technologies

BSS606NH6327TR by Infineon Technologies

Infineon BSS606NH6327TR is a N-CHANNEL FET with 60V DS breakdown voltage, 3.2A ID, and 0.06 ohm RDS(on). Ideal for small outline applications, it features a built-in diode, flat terminals, and AEC-Q101 standard compliance.

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VNN

France . 1,711 parts In-Stock

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Digiode

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Vyrian

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Nova Conductors

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Modulus Dynamics

Lithuania . 10,351 parts In-Stock

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$1.373

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AZTECH Wire

Italy . 760 parts In-Stock

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Semicontronic

India . 134 parts In-Stock

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$37.099

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$36.908

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Ampacity Inc.

Singapore . 1,228 parts In-Stock

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Continental Prestige Electronics

USA . 6,747 parts In-Stock

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Argo Parts USA

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Corphita

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Overview

Enhance your electronic devices with the BSS606NH6327TR by Infineon Technologies, a high-quality Small Signal Field Effect Transistor that offers exceptional performance and reliability. Manufactured by Infineon Technologies, a leader in semiconductor technology, this N-CHANNEL transistor provides superior efficiency and versatility for various applications. With its single configuration and built-in diode, this transistor is perfect for enhancing circuit design and functionality. Experience the value and benefits of Infineon's cutting-edge technology with the BSS606NH6327TR, delivering optimal results and unmatched quality for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow in the transistor, enhancing performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Offers additional functionality with the built-in diode, providing versatility in circuit design.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 60 V

Ensures reliable operation within specified voltage limits, preventing damage to the transistor.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit designs and PCB layouts.

Terminal Form: FLAT

Provides a stable connection point for easy soldering and secure electrical contact.

Operating Mode: ENHANCEMENT MODE

Allows for precise control of the transistor's conductivity, enhancing performance in various applications.

No. of Terminals: 3

Simplifies circuit connections and reduces complexity in the design.

Package Style (Meter): SMALL OUTLINE

Occupies minimal space on the PCB, ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and reliability in signal amplification and switching applications.

Transistor Element Material: SILICON

Provides high performance and durability, suitable for a wide range of operating conditions.

Maximum Drain Current (ID): 3.2 A

Can handle high current loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.06 ohm

Ensures low power dissipation and efficient operation of the transistor.

Terminal Position: SINGLE

Simplifies circuit connections and enhances ease of use during installation.

Case Connection: DRAIN

Provides a secure connection point for the drain terminal, ensuring reliable performance.

Maximum Feedback Capacitance (Crss): 15.3 pF

Reduces signal distortion and improves high-frequency performance in amplification circuits.

Reference Standard: AEC-Q101

Meets industry standards for quality and reliability, making it suitable for automotive applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS606NH6327TR attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

15.3 pF

JESD-30 Code:

R-PSSO-F3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

BSS606NH6327TR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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