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BSS606NH6327

Infineon Technologies

BSS606NH6327 by Infineon Technologies

BSS606NH6327 by Infineon is a N-CHANNEL FET with 60V DS breakdown voltage and 3.2A max drain current. It's used in small outline packages for enhancement mode operation, ideal for automotive applications meeting AEC-Q101 standards.

Median Price

$0.920

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,139 parts In-Stock

1+ parts

$0.920

100+ parts

$0.411

1k+ parts

$0.238

10k+ parts

$0.170

4,139

$0.920

$0.411

$0.238

$0.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 1,328 parts In-Stock

1+ parts

$0.260

100+ parts

$0.136

1k+ parts

$0.118

10k+ parts

-

1,328

$0.260

$0.136

$0.118

-

Digiode

USA . 899 parts In-Stock

1+ parts

$0.475

100+ parts

-

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899

$0.475

-

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Vyrian

USA . 7,272 parts In-Stock

1+ parts

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7,272

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HZD GmbH

Germany . 3,700 parts In-Stock

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3,700

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VNN

France . 1,400 parts In-Stock

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1,400

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LIBRA Elektronik GmbH

Germany . 293 parts In-Stock

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293

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Nova Conductors

Japan . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 836 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

-

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836

$0.450

-

-

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Ampacity Inc.

Singapore . 7,324 parts In-Stock

1+ parts

$0.500

100+ parts

-

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7,324

$0.500

-

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Semicontronic

India . 7,203 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

7,203

$0.500

$0.488

$0.485

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Decca Corp

Germany . 7,170 parts In-Stock

1+ parts

$0.500

100+ parts

$0.490

1k+ parts

$0.485

10k+ parts

-

7,170

$0.500

$0.490

$0.485

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Modulus Dynamics

Lithuania . 17,895 parts In-Stock

1+ parts

$0.590

100+ parts

$0.566

1k+ parts

$0.543

10k+ parts

-

17,895

$0.590

$0.566

$0.543

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Corohmni

South Africa . 855 parts In-Stock

1+ parts

$1.272

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855

$1.272

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Perfect Parts

USA . 111,987 parts In-Stock

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111,987

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Futuretech Components

Singapore . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,317 parts In-Stock

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Argo Parts USA

USA . 4,832 parts In-Stock

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4,832

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Alle Elektronik GmbH

Germany . 4,211 parts In-Stock

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4,211

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Advanced Electronics

New Zealand . 3,952 parts In-Stock

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3,952

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Infinite Electronics LLP (Excess)

. 1,004 parts In-Stock

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1,004

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GreenTree Electronics

Israel . 410 parts In-Stock

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410

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Bastille Electronics

Australia . 59 parts In-Stock

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59

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Continental Prestige Electronics

USA . 45 parts In-Stock

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Overview

Experience the superior quality and performance of the BSS606NH6327 by Infineon Technologies. This small signal Field Effect Transistor (FET) boasts a single configuration with a built-in diode, making it perfect for a wide range of applications. With a minimum DS breakdown voltage of 60V and maximum drain current of 3.2A, this Enhancement Mode transistor offers reliability and efficiency like no other. Trust in Infineon Technologies to deliver cutting-edge technology and unmatched value with the BSS606NH6327. Elevate your projects with this top-of-the-line component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and insulation for the transistor, ensuring reliable performance and longevity.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow in the channel, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode offers added functionality and flexibility in circuit design.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this transistor can withstand higher voltages, making it versatile and reliable.

Surface Mount: YES

Enables easy and efficient PCB mounting, saving space and facilitating automated assembly processes.

Maximum Drain Current (ID): 3.2 A

Capable of handling high currents, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.06 ohm

Low on-resistance leads to minimal power loss and improved efficiency in circuit operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides good performance characteristics, such as high input impedance and low power consumption.

Transistor Element Material: SILICON

Silicon material ensures good thermal stability and reliability in various operating conditions.

Package Style (Meter): SMALL OUTLINE

Compact package design saves space on the PCB and allows for high-density circuit integration.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS606NH6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

15.3 pF

JESD-30 Code:

R-PSSO-F3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

BSS606NH6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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