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BSS670S2LH6327

Infineon Technologies

BSS670S2LH6327 by Infineon Technologies

BSS670S2LH6327 by Infineon Technologies is a N-CHANNEL FET for SWITCHING applications. It features a 55V DS Breakdown Voltage, 0.54A Drain Current, and 0.825 ohm On Resistance. With a PLASTIC/EPOXY body and GULL WING terminals, it operates in ENHANCEMENT MODE at up to 150°C.

Median Price

$0.210

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 13,745 parts In-Stock

1+ parts

$0.390

100+ parts

$0.170

1k+ parts

$0.094

10k+ parts

$0.055

13,745

$0.390

$0.170

$0.094

$0.055

Avnet

USA . 300,000 parts In-Stock

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$0.029

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$0.029

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Maritex

Poland . 369 parts In-Stock

1+ parts

$0.097

100+ parts

$0.052

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$0.049

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$0.044

369

$0.097

$0.052

$0.049

$0.044

Digiode

USA . 601 parts In-Stock

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$0.352

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601

$0.352

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Vyrian

USA . 189,432 parts In-Stock

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Rutronik

Germany . 126,000 parts In-Stock

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$0.041

Cyclops Electronics Ltd

UK . 61,525 parts In-Stock

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Bristol Electronics

USA . 27,000 parts In-Stock

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VNN

France . 3,882 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Electronics Depot

USA . 890 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 387 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 180,752 parts In-Stock

1+ parts

$0.025

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180,752

$0.025

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Semicontronic

India . 173,873 parts In-Stock

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$0.025

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$0.024

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$0.024

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173,873

$0.025

$0.024

$0.024

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Corphita

USA . 973 parts In-Stock

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$0.333

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973

$0.333

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Corohmni

South Africa . 368 parts In-Stock

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$0.945

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368

$0.945

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Modulus Dynamics

Lithuania . 9,993 parts In-Stock

1+ parts

$1.446

100+ parts

$1.388

1k+ parts

$1.330

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9,993

$1.446

$1.388

$1.330

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Infinite Electronics LLP (Excess)

. 680,017 parts In-Stock

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Formix International (Excess)

India . 203,000 parts In-Stock

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Perfect Parts

USA . 119,936 parts In-Stock

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Kepictronics

USA . 30,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 29,321 parts In-Stock

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Futuretech Components

Singapore . 20,000 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 4,737 parts In-Stock

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Lixinc

USA . 4,446 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,767 parts In-Stock

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Computer Components Inc. - USA

USA . 2,949 parts In-Stock

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Glotronic Ltd.

UK . 2,340 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,802 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$4.865

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$4.865

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$4.865

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$4.865

$4.865

Bastille Electronics

Australia . 100 parts In-Stock

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Advanced Electronics

New Zealand . 94 parts In-Stock

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Overview

Unlock the power of high-quality technology with the BSS670S2LH6327 by Infineon Technologies. This N-CHANNEL Small Signal Field Effect Transistor (FET) offers unparalleled performance in switching applications, providing customers with a reliable and efficient solution. With a maximum drain current of 0.54 A and a breakdown voltage of 55 V, this transistor is designed to meet your needs. Trust in Infineon Technologies, a leader in semiconductor manufacturing, and elevate your projects to new heights with the BSS670S2LH6327. Experience the value and benefits this product brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher electron mobility, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse voltage protection, preventing damage to the transistor in case of reverse polarity.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and fast operation in electronic circuits.

Surface Mount: YES

Makes it easy to mount the transistor directly onto a circuit board, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 55 V

Can withstand higher voltage levels, making it suitable for a variety of applications where higher voltages are required.

Maximum Drain Current (Abs): 0.54 A

Capable of handling relatively high current levels, allowing for use in circuits that require significant current flow.

Maximum Power Dissipation (Abs): 0.36 W

Efficient power dissipation ensures that the transistor stays within safe operating temperatures, reducing the risk of overheating.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without any significant performance degradation, suitable for industrial or automotive applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS670S2LH6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

.54 A

Maximum Drain Current (ID):

.54 A

Maximum Drain-Source On Resistance:

.825 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS670S2LH6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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