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BSM200GB60DLCHOSA1

Infineon Technologies

BSM200GB60DLCHOSA1 by Infineon Technologies

Infineon's BSM200GB60DLCHOSA1 is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements, featuring a toff of 326ns and ton of 229ns. With a max voltage of 600V and current of 230A, it is ideal for high-power applications like industrial motor drives and renewable energy systems.

Median Price

$74.990

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 165 parts In-Stock

1+ parts

-

100+ parts

$74.990

1k+ parts

$67.100

10k+ parts

$63.150

165

-

$74.990

$67.100

$63.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 42 parts In-Stock

1+ parts

$77.534

100+ parts

-

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42

$77.534

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-

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Digiode

USA . 834 parts In-Stock

1+ parts

$79.354

100+ parts

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834

$79.354

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Vyrian

USA . 3,459 parts In-Stock

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3,459

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VNN

France . 650 parts In-Stock

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650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,893 parts In-Stock

1+ parts

$1.124

100+ parts

$1.079

1k+ parts

$1.034

10k+ parts

-

3,893

$1.124

$1.079

$1.034

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AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$7.354

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384

$7.354

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Corphita

USA . 631 parts In-Stock

1+ parts

$75.177

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631

$75.177

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Continental Prestige Electronics

USA . 2,262 parts In-Stock

1+ parts

$77.534

100+ parts

-

1k+ parts

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10k+ parts

$75.983

2,262

$77.534

-

-

$75.983

Netroflash

USA . 50 parts In-Stock

1+ parts

$77.534

100+ parts

$75.983

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-

10k+ parts

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50

$77.534

$75.983

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Ampacity Inc.

Singapore . 255 parts In-Stock

1+ parts

$154.530

100+ parts

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255

$154.530

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Microchip USA

USA . 5,496 parts In-Stock

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5,496

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Argo Parts USA

USA . 2,188 parts In-Stock

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2,188

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Perfect Parts

USA . 34 parts In-Stock

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34

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Overview

Unleash the power of cutting-edge technology with the BSM200GB60DLCHOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT) like no other. With a unique configuration of series connected elements and built-in diode, this N-CHANNEL transistor offers unmatched performance and efficiency. Ideal for a wide range of applications, this product is designed to provide maximum value, benefits, and advantages to our customers. Upgrade your systems with the BSM200GB60DLCHOSA1 and experience the difference today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have higher electron mobility and faster switching speeds, making them suitable for high performance applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for better voltage handling capability and efficient circuit design in power electronics applications.

Nominal Turn Off Time (toff): 326 ns

The fast turn-off time of 326 ns helps in reducing switching losses and improving overall efficiency of the device.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage rating of 600 V allows for handling higher voltage levels in power electronics applications.

Maximum Collector Current (IC): 230 A

With a high maximum collector current rating of 230 A, this IGBT can handle large amounts of current, making it suitable for high power applications.

Nominal Turn On Time (ton): 229 ns

The fast turn-on time of 229 ns ensures quick switching speeds, contributing to improved performance and efficiency of the device.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) BSM200GB60DLCHOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

326 ns

Nominal Turn On Time (ton):

229 ns

Trade Compliance

BSM200GB60DLCHOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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