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BPX84

Infineon Technologies

BPX84 by Infineon Technologies

Infineon's BPX84 phototransistor operates b/w -40°C to 85°C with max dark current of 200nA. It has a fast response time of 0.000008s and features tin/lead terminal finish. Ideal for through hole mounting, it is commonly used in light sensing applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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VNN

France . 1,843 parts In-Stock

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Vyrian

USA . 660 parts In-Stock

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660

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Digiode

USA . 151 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Modulus Dynamics

Lithuania . 5,969 parts In-Stock

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$0.306

100+ parts

$0.294

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$0.282

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5,969

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Aztec Data Supply Inc.

USA . 37 parts In-Stock

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$0.340

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Ampacity Inc.

Singapore . 413 parts In-Stock

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$6.100

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AZTECH Wire

Italy . 660 parts In-Stock

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$6.890

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660

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Kepictronics

USA . 13,000 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,999 parts In-Stock

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Corphita

USA . 911 parts In-Stock

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FE SAS

France . 124 parts In-Stock

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Argo Parts USA

USA . 108 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Assy Fe

Spain . 57 parts In-Stock

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Corohmni

South Africa . 38 parts In-Stock

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Overview

Experience the superior quality of the BPX84 phototransistor by Infineon Technologies, a trusted manufacturer known for innovation and reliability. Ideal for a wide range of applications, this product offers customers unbeatable value with its fast response time, low dark current, and durable construction. Whether you're in the automotive, industrial, or consumer electronics industry, the BPX84 is sure to meet your needs and exceed your expectations. Upgrade to the best with Infineon Technologies today!

Feature Benefit Bullets

Maximum Operating Temperature: 85 °C

This phototransistor can operate in high temperature environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this phototransistor can also function in cold environments, increasing its versatility.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures good solderability and reliability in electronic assemblies.

Maximum Dark Current: 200 nA

The low maximum dark current of 200 nA indicates the phototransistor's sensitivity to light, making it suitable for light sensing applications.

Maximum Response Time: 0.000008 s

With a fast response time of 0.000008 seconds, this phototransistor can quickly react to changes in light levels, making it ideal for high-speed applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides secure and stable placement of the phototransistor on a circuit board, ensuring reliable performance.

Technical Specifications

Phototransistors BPX84 attributes and parameters. Explore more Phototransistors devices from Infineon Technologies

Specs

Maximum Dark Current:

200 nA

JESD-609 Code:

e0

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Response Time:

.000008 s

Sub-Category:

Photo Transistors

Terminal Finish:

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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