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BPX89

Infineon Technologies

BPX89 by Infineon Technologies

Infineon Technologies' BPX89 is a phototransistor with max operating temp of 85°C and min of -40°C. It features max dark current of 200nA and response time of 0.000008s. Ideal for applications requiring THROUGH HOLE MOUNT, such as light sensing in various electronic devices.

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VNN

France . 1,591 parts In-Stock

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Digiode

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Vyrian

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Nova Conductors

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Holdelec - ElecDif-Pro

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Aztec Data Supply Inc.

USA . 3,410 parts In-Stock

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Modulus Dynamics

Lithuania . 2,065 parts In-Stock

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$0.682

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Ampacity Inc.

Singapore . 1,573 parts In-Stock

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AZTECH Wire

Italy . 877 parts In-Stock

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Kepictronics

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Continental Prestige Electronics

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Aranea Global

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Argo Parts USA

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Corphita

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Overview

Experience the next level of performance with the BPX89 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and reliability in their products. The BPX89 is a versatile phototransistor that offers unparalleled sensitivity and precision in various applications. From industrial automation to medical devices, this phototransistor delivers exceptional value and benefits to customers seeking cutting-edge technology. Upgrade your systems with the BPX89 and experience the difference Infineon Technologies can make for you.

Feature Benefit Bullets

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this phototransistor can withstand a wide range of temperatures without any performance degradation, making it suitable for various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that this phototransistor can function efficiently even in extremely cold conditions, expanding its applicability to different industrial settings.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and allows for easy integration into electronic circuits, simplifying the assembly process for manufacturers.

Maximum Dark Current: 200 nA

With a low maximum dark current, this phototransistor exhibits minimal leakage current in the absence of light, leading to improved accuracy and performance in light detection applications.

Maximum Response Time: 0.000008 s

The fast response time of this phototransistor ensures quick detection and transmission of light signals, making it ideal for high-speed applications where rapid response is critical.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature offers secure and reliable mechanical support, ensuring stable and long-lasting operation of the phototransistor in various electronic devices and systems.

Technical Specifications

Phototransistors BPX89 attributes and parameters. Explore more Phototransistors devices from Infineon Technologies

Specs

Maximum Dark Current:

200 nA

JESD-609 Code:

e0

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Response Time:

.000008 s

Sub-Category:

Photo Transistors

Terminal Finish:

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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