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BPX81

Infineon Technologies

BPX81 by Infineon Technologies

BPX81 by Infineon Technologies is an 850nm phototransistor with a max operating temperature of 80°C and a min operating temperature of -40°C. It has a max power dissipation of 0.09W and a max dark current of 200nA. This phototransistor is commonly used in applications requiring through hole mounting and can handle a max on-state current of 0.05A.

Median Price

$0.930

Lifecycle Status

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8

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

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Fibra_Brandt Electronic GMBH

Germany . 540 parts In-Stock

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Vyrian

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Pegasus Components GmbH

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ECAB

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LittleDiode

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Modulus Dynamics

Lithuania . 4,295 parts In-Stock

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$0.668

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$0.641

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$0.615

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AZTECH Wire

Italy . 407 parts In-Stock

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Ampacity Inc.

Singapore . 932 parts In-Stock

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Metaverse IC Inc.

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Netroflash

USA . 1,000 parts In-Stock

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Corphita

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Overview

Discover the BPX81, brought to you by Infineon Technologies! As a leading manufacturer, Infineon is renowned for their commitment to quality, and the BPX81 is no exception. This phototransistor offers unparalleled performance in a variety of applications, thanks to its peak wavelength of 850nm and wide operating temperature range (-40°C to 80°C). With a maximum power dissipation of 0.09W and low dark current of 200nA, this little powerhouse delivers exceptional value and reliability. Whether you need precise sensing or reliable data transmission, the BPX81 is your go-to solution. Trust Infineon and experience the advantages that this remarkable product brings to your projects!

Feature Benefit Bullets

Peak Wavelength (nm): 850

This phototransistor operates at a peak wavelength of 850 nm, making it ideal for applications requiring infrared sensing or communication.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80°C, this phototransistor is suitable for use in environments with high temperature variations, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

Designed to withstand extreme conditions, this phototransistor has a minimum operating temperature of -40°C, enabling it to function in cold environments without compromising its effectiveness.

Maximum Power Dissipation: 0.09 W

With a maximum power dissipation of 0.09 W, this phototransistor can handle relatively high power levels, making it suitable for applications where power requirements are demanding.

Maximum Dark Current: 200 nA

Featuring a maximum dark current of 200 nA, this phototransistor has low noise characteristics even in low-light conditions, enabling accurate detection and measurement.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature of this phototransistor simplifies installation and increases stability, providing a secure and straightforward solution for PCB integration.

Maximum On State Current: 0.05 A

Capable of handling a maximum on-state current of 0.05 A, this phototransistor can withstand high currents, making it suitable for applications requiring robust and efficient switching capabilities.

Technical Specifications

Phototransistors BPX81 attributes and parameters. Explore more Phototransistors devices from Infineon Technologies

Specs

Maximum Dark Current:

200 nA

Mounting Feature:

Maximum On State Current:

.05 A

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-40 Cel

Peak Wavelength (nm):

850

Maximum Power Dissipation:

.09 W

Sub-Category:

Photo Transistors

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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