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1ED020I12FA2

Infineon Technologies

1ED020I12FA2 by Infineon Technologies

1ED020I12FA2 by Infineon Technologies is a MOSFET Gate Driver with 20 terminals, operating temperature range of -40 to 105°C. It features a turn-on time of 0.195 us and turn-off time of 0.19 us, suitable for industrial applications requiring high side driver functionality. The driver has a max supply voltage of 20V and nominal output peak current limit of 2A, making it ideal for use in various power supply systems.

Median Price

$9.620

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,602 parts In-Stock

1+ parts

$9.620

100+ parts

$5.970

1k+ parts

$4.580

10k+ parts

-

3,602

$9.620

$5.970

$4.580

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 627 parts In-Stock

1+ parts

$7.000

100+ parts

-

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627

$7.000

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Digiode

USA . 124 parts In-Stock

1+ parts

$8.455

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124

$8.455

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Cyclops Electronics Ltd

UK . 22,126 parts In-Stock

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22,126

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Elcom Components

USA . 207 parts In-Stock

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207

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LIBRA Elektronik GmbH

Germany . 105 parts In-Stock

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105

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Distributors (Availability)

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Corphita

USA . 100 parts In-Stock

1+ parts

$8.010

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-

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100

$8.010

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Modulus Dynamics

Lithuania . 3,324 parts In-Stock

1+ parts

$13.996

100+ parts

$13.436

1k+ parts

$12.876

10k+ parts

-

3,324

$13.996

$13.436

$12.876

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Metaverse IC Inc.

Canada . 88,000 parts In-Stock

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88,000

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Perfect Parts

USA . 32,480 parts In-Stock

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A-Z Elektronik GmbH

Germany . 22,500 parts In-Stock

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22,500

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Lixinc

USA . 6,076 parts In-Stock

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6,076

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GreenTree Electronics

Israel . 6,008 parts In-Stock

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6,008

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Kepictronics

USA . 4,024 parts In-Stock

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4,024

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Northwest PG Solutions

USA . 2,070 parts In-Stock

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2,070

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Futuretech Components

Singapore . 980 parts In-Stock

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980

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Native Components

USA . 917 parts In-Stock

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917

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Overview

TDK and Infineon offer a wide portfolio of products that are suitable as electric vehicle powertrain solutions. These solutions include gate drivers, IGBT modules, common mode chokes, and pulse transformers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on a circuit board.

Maximum Supply Voltage: 5.5 V

Suitable for applications where a maximum voltage of 5.5V is required.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Power Supplies (V): -8,5,15

Supports various power supply voltages, providing flexibility in different application scenarios.

No. of Terminals: 20

More terminals allow for a greater connection options and versatility in circuit design.

Maximum Operating Temperature: 105 °C

Can operate in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, providing versatility in usage.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

The combination of finishes provides good electrical conductivity and resistance to corrosion.

High Side Driver: YES

Includes a high side driver which is essential for proper MOSFET gate driving in certain applications.

Nominal Output Peak Current Limit: 2 A

Supports a peak output current of 2A, ensuring reliable performance under load.

Technical Specifications

MOSFET Gate Drivers 1ED020I12FA2 attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-8 V

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

-8,5,15

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

20 V

Minimum Supply Voltage-1:

13 V

Nominal Supply Voltage-1:

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.19 us

Turn-on Time:

.195 us

Width:

7.62 mm

Trade Compliance

1ED020I12FA2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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