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1ED020I12-F

Infineon Technologies

1ED020I12-F by Infineon Technologies

1ED020I12-F by Infineon Technologies is a MOSFET Gate Driver with 16 terminals, operating voltage range of 4.5V to 5.5V, and turn-on time of 0.75us. It is designed for industrial applications requiring high side driver functionality and features a small outline package style suitable for surface mount assembly.

Median Price

$6.060

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 446 parts In-Stock

1+ parts

$6.060

100+ parts

$3.970

1k+ parts

$3.370

10k+ parts

-

446

$6.060

$3.970

$3.370

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 796 parts In-Stock

1+ parts

$5.766

100+ parts

-

1k+ parts

-

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796

$5.766

-

-

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Vyrian

USA . 417 parts In-Stock

1+ parts

$6.070

100+ parts

-

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417

$6.070

-

-

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ComSIT Distribution GmbH

Germany . 595 parts In-Stock

1+ parts

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-

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595

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North Shore Components

USA . 259 parts In-Stock

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259

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Inventory MP

USA . 4 parts In-Stock

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4

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Bristol Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,964 parts In-Stock

1+ parts

$5.144

100+ parts

$4.938

1k+ parts

$4.732

10k+ parts

-

1,964

$5.144

$4.938

$4.732

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Corphita

USA . 689 parts In-Stock

1+ parts

$5.463

100+ parts

-

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689

$5.463

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Andel Nordic

Denmark . 467 parts In-Stock

1+ parts

$25.000

100+ parts

-

1k+ parts

$17.502

10k+ parts

$17.502

467

$25.000

-

$17.502

$17.502

Native Components

USA . 518 parts In-Stock

1+ parts

$28.120

100+ parts

-

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518

$28.120

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Northwest PG Solutions

USA . 242 parts In-Stock

1+ parts

$30.932

100+ parts

$27.839

1k+ parts

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242

$30.932

$27.839

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Lixinc

USA . 8,629 parts In-Stock

1+ parts

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8,629

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A-Z Elektronik GmbH

Germany . 2,990 parts In-Stock

1+ parts

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2,990

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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1,970

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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1,100

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Infinite Electronics LLP (Excess)

. 903 parts In-Stock

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903

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Kepictronics

USA . 60 parts In-Stock

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60

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Assy Fe

Spain . 12 parts In-Stock

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12

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Overview

Enhance the performance of your electronic devices with the 1ED020I12-F MOSFET gate driver by Infineon Technologies. Known for their top-notch quality and reliability, Infineon products are trusted by industry professionals worldwide. This gate driver is perfect for a wide range of applications, providing seamless power management and efficient operation. Experience the benefits of seamless integration, improved efficiency, and enhanced control with the 1ED020I12-F. Upgrade your systems today and see the difference Infineon can make!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and able to withstand various environmental conditions, ensuring a reliable performance.

Surface Mount: YES

Being surface mountable makes the product suitable for compact designs and easy PCB assembly, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, the device can handle a wide range of voltage inputs, providing flexibility and compatibility with different systems.

No. of Terminals: 16

Having 16 terminals allows for a greater level of control and connectivity options, enabling more advanced circuit configurations and applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures the product can withstand heat-intensive environments, improving its overall reliability and longevity.

Nominal Output Peak Current Limit: 2 A

With a nominal output peak current limit of 2 A, the device is capable of driving high power loads, making it suitable for applications requiring high current capabilities.

Technical Specifications

MOSFET Gate Drivers 1ED020I12-F attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.34 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-8,5,15

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.19 us

Turn-on Time:

.75 us

Width:

7.52 mm

Trade Compliance

1ED020I12-F Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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