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XPC850DSLCZT50BU

Freescale Semiconductor

XPC850DSLCZT50BU by Freescale Semiconductor

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Format: FIXED POINT;

Median Price

$18.000

Lifecycle Status

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4

In-Stock Inventory

1k+

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Bristol Electronics

USA . 40 parts In-Stock

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$18.000

100+ parts

$17.307

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40

$18.000

$17.307

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Vyrian

USA . 3,692 parts In-Stock

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3,692

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Digiode

USA . 2,552 parts In-Stock

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Anansix

USA . 1,330 parts In-Stock

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One Stop Electronics

USA . 1,873 parts In-Stock

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$19.000

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Microchip USA

USA . 317 parts In-Stock

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$45.280

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317

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$50.734

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$46.168

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$41.602

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1,000

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Component Stockers USA

USA . 464 parts In-Stock

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$99.990

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464

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UNI Independent Distributors

Spain . 3,477 parts In-Stock

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Corphita

USA . 1,750 parts In-Stock

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Technical Specifications

Microprocessors XPC850DSLCZT50BU attributes and parameters. Explore more Microprocessors devices from Freescale Semiconductor

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Speed:

50 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XPC850DSLCZT50BU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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