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XC56L307VL160

Freescale Semiconductor

XC56L307VL160 by Freescale Semiconductor

DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

Median Price

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Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

< 1k

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Microchip USA

USA . 144 parts In-Stock

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$7.965

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144

$7.965

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Ampacity Inc.

Singapore . 568 parts In-Stock

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$25.000

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568

$25.000

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One Stop Electronics

USA . 969 parts In-Stock

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$30.000

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969

$30.000

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Corohmni

South Africa . 1,984 parts In-Stock

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$55.050

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1,984

$55.050

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Technical Specifications

Digital Signal Processors (DSPs) XC56L307VL160 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Freescale Semiconductor

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

18

Barrel Shifter:

YES

Bit Size:

24

Boundary Scan:

YES

Maximum Clock Frequency:

160 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

XC56L307VL160 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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