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PI6CBE33085ZLIEX

Diodes Incorporated

PI6CBE33085ZLIEX by Diodes Incorporated

PI6CBE33085ZLIEX clock driver by Diodes Inc. features 3 ns propagation delay, 48 terminals, and operates at -40 to 85°C. Ideal for applications requiring a differential mux input conditioning in a square package style with a very thin profile.

Median Price

$11.170

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 500 parts In-Stock

1+ parts

$11.170

100+ parts

$6.470

1k+ parts

$5.000

10k+ parts

-

500

$11.170

$6.470

$5.000

-

Overview

Enhance your electronic designs with the PI6CBE33085ZLIEX clock driver and buffer by Diodes Incorporated. With a reputation for top-quality components, Diodes Incorporated delivers reliability and performance in every product. This versatile chip carrier offers differential mux input conditioning and a very thin profile package style. Ideal for a range of applications, this clock driver boasts low propagation delay and high-speed operation, making it a valuable asset for any project. Upgrade your designs with the PI6CBE33085ZLIEX and experience the benefits of premium quality components from a trusted manufacturer.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and quick installation on circuit boards, saving time and effort in the assembly process.

Input Conditioning: DIFFERENTIAL MUX

Having a differential multiplexer input conditioning helps in accurately selecting and routing the input signals, ensuring reliable data transmission.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V offers compatibility with a wide range of electronic systems, making it versatile in various applications.

Propagation Delay (tpd): 3 ns

With a fast propagation delay of 3 nanoseconds, this clock driver ensures efficient and timely signal transmission, crucial for synchronous operations.

Maximum Operating Temperature: 85 °C

Being able to operate at temperatures up to 85°C makes this product suitable for use in environments with elevated heat levels without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to function at temperatures as low as -40°C ensures reliability and stability in cold conditions, making it suitable for a variety of operating environments.

No. of Terminals: 48

Having 48 terminals allows for a higher level of connectivity and integration with other components, enabling complex circuit designs and functionalities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style of chip carrier, heat sink/slug, and very thin profile enhances thermal management and space-saving characteristics, making it ideal for compact electronic devices.

Terminal Position: QUAD

Quad terminal positioning facilitates easy installation and connection in a circuit layout, simplifying the integration process and reducing the risk of errors.

Width: 6 mm

With a width of 6mm, this clock driver offers a compact footprint, ideal for applications where space constraints are a concern, without compromising on performance.

Technology: CMOS

Being based on CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it an efficient and reliable choice.

Maximum Supply Voltage (Vsup): 3.465 V

Operating within a maximum supply voltage of 3.465V provides additional margin for voltage fluctuations, enhancing the stability and reliability of the clock driver in various operating conditions.

Technical Specifications

Clock Drivers & Buffers PI6CBE33085ZLIEX attributes and parameters. Explore more Clock Drivers & Buffers devices from Diodes Incorporated

Specs

Family:

6C

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N48

Length:

6 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Propagation Delay (tpd):

3 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Minimum fmax:

400 MHz

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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