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DMT6007LFGQ-13

Diodes Incorporated

DMT6007LFGQ-13 by Diodes Incorporated

DMT6007LFGQ-13 by Diodes Inc. is a N-channel Power FET with 60V DS breakdown voltage, ideal for switching applications. It features 80A max pulsed drain current and 0.006 ohm max drain-source resistance, operating in enhancement mode. This MOSFET has a small outline package style and can withstand temperatures up to 150°C, meeting AEC-Q101 and MIL-STD-202 standards.

Median Price

$0.416

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 342,000 parts In-Stock

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$0.421

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$0.421

Future Electronics

Canada . 12,000 parts In-Stock

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$0.410

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$0.410

Distributors (In-Stock)

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NAC Semi

USA . 315,000 parts In-Stock

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$0.583

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$0.583

Vyrian

USA . 89,907 parts In-Stock

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Q Components

USA . 20,170 parts In-Stock

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IBS Electronics

USA . 3,000 parts In-Stock

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$1.304

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Nova Conductors

Japan . 500 parts In-Stock

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500

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A2Z Electronics, Inc.

USA . 15 parts In-Stock

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Bristol Electronics

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Ampacity Inc.

Singapore . 90,092 parts In-Stock

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$0.348

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$0.348

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Aztec Data Supply Inc.

USA . 165 parts In-Stock

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$1.360

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Corohmni

South Africa . 50 parts In-Stock

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$1.873

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$1.873

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RC Electronics

USA . 21,000 parts In-Stock

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Lixinc

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Argo Parts USA

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Perfect Parts

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Bastille Electronics

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Overview

Upgrade your power system with the DMT6007LFGQ-13 from Diodes Incorporated, a leading manufacturer known for top-quality electronic components. This N-CHANNEL Power FET offers reliable performance in switching applications, featuring a built-in diode for added convenience. With a maximum pulsed drain current of 80A and an avalanche energy rating of 20mJ, this FET delivers exceptional power dissipation of 62.5W. Ideal for various industries, this small outline package FET is designed to enhance your system's efficiency and durability. Trust Diodes Incorporated to provide you with the best-in-class components for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient switching and control of power in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances the overall performance of the FET.

Transistor Application: SWITCHING

This FET is specifically designed for switching applications, ensuring reliable and efficient operation.

Surface Mount: YES

The surface mount design makes it easy to integrate this FET onto circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures the FET can handle high voltages safely and reliably.

Package Shape: SQUARE

The square shape of the package allows for efficient heat dissipation and easy mounting on circuit boards.

Terminal Form: NO LEAD

The no-lead terminal form streamlines the assembly process and reduces the risk of soldering errors.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation provides better control and efficiency in various applications.

Maximum Pulsed Drain Current (IDM): 80 A

The high pulsed drain current rating allows the FET to handle sudden surges of current without damage.

Avalanche Energy Rating (EAS): 20 mJ

The high avalanche energy rating ensures the FET can withstand voltage spikes and protect the circuit.

No. of Terminals: 8

With 8 terminals, this FET offers versatility in circuit connections and configurations.

Maximum Power Dissipation (Abs): 62.5 W

The high power dissipation rating ensures the FET can handle high power levels without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for dense circuit board layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology offers high efficiency and fast switching speeds for optimal performance.

Maximum Operating Temperature: 150 °C

The high operating temperature rating allows the FET to function reliably in various environmental conditions.

Transistor Element Material: SILICON

The silicon material of the FET ensures durability and stable performance over time.

Minimum Operating Temperature: -55 °C

The low operating temperature rating makes this FET suitable for use in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides a reliable and corrosion-resistant connection for the FET terminals.

Maximum Drain Current (ID): 15 A

The high drain current rating allows the FET to handle substantial power loads with ease.

Maximum Drain-Source On Resistance: 0.006 ohm

The low on-resistance of the FET reduces power loss and improves efficiency in circuit applications.

Terminal Position: DUAL

The dual terminal position allows for flexible and customizable connections in circuit designs.

Case Connection: DRAIN

The drain case connection simplifies the circuit layout and enhances the overall performance of the FET.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering and assembly of the FET onto circuit boards.

Maximum Feedback Capacitance (Crss): 38.5 pF

The low feedback capacitance minimizes signal distortion and improves stability in circuit applications.

Reference Standard: AEC-Q101; MIL-STD-202

This FET meets industry standards for quality and reliability, making it a trusted choice for various applications.

Technical Specifications

Power Field Effect Transistors (FET) DMT6007LFGQ-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

38.5 pF

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

AEC-Q101; MIL-STD-202

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMT6007LFGQ-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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