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DMP6110SVT-13

Diodes Incorporated

DMP6110SVT-13 by Diodes Incorporated

DMP6110SVT-13 by Diodes Inc. is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 24A IDM, 18mJ EAS, and 0.105 ohm RDS(ON). With a small outline package and -55 to 150 °C operating range, it's suitable for various power management designs.

Median Price

$0.294

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 10,000 parts In-Stock

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$0.294

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IBS Electronics

USA . 60,000 parts In-Stock

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$0.491

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NAC Semi

USA . 20,000 parts In-Stock

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Vyrian

USA . 8,971 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Ampacity Inc.

Singapore . 64,971 parts In-Stock

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$0.145

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Semicontronic

India . 64,627 parts In-Stock

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$0.141

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$0.141

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Corohmni

South Africa . 64 parts In-Stock

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$1.170

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Aztec Data Supply Inc.

USA . 4,869 parts In-Stock

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$1.390

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AZTECH Wire

Italy . 772 parts In-Stock

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$12.050

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Continental Prestige Electronics

USA . 6,008 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 85 parts In-Stock

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Overview

Boost your power management capabilities with the DMP6110SVT-13 by Diodes Incorporated. This high-quality P-channel FET offers reliable switching performance in a compact, surface-mount package. With a maximum drain current of 7.3A and a low on-resistance of 0.105 ohm, this transistor is ideal for a wide range of applications. Whether you're designing for automotive, industrial, or consumer electronics, this enhancement mode FET delivers exceptional value and performance. Upgrade your designs today with the DMP6110SVT-13 and experience the benefits of Diodes Incorporated's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the components inside, ensuring a long lifespan for the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs have lower conduction losses compared to N-channel FETs, making them more energy efficient.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, adding an extra level of safety to the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high currents and voltages efficiently.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages without failing, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and reducing assembly time.

Maximum Pulsed Drain Current (IDM): 24 A

The high pulsed current rating ensures that the FET can handle short duration high current spikes without overheating.

Maximum Power Dissipation (Abs): 1.8 W

With a high power dissipation rating, this FET can handle continuous high power applications without overheating.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures without degrading performance.

Minimum Operating Temperature: -55 °C

With a low operating temperature range, this FET can operate in harsh environments without issues.

Maximum Drain-Source On Resistance: 0.105 ohm

Low on-resistance ensures efficient power handling and minimal voltage drop across the FET.

Technical Specifications

Power Field Effect Transistors (FET) DMP6110SVT-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

18 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

7.3 A

Maximum Drain-Source On Resistance:

.105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

44 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

24 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMP6110SVT-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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