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DMP6110SSSQ-13

Diodes Incorporated

DMP6110SSSQ-13 by Diodes Incorporated

DMP6110SSSQ-13 by Diodes Inc. is a P-channel FET with 60V DS breakdown voltage and 0.11 ohm RDS(on). Ideal for switching applications, it features 19A pulsed drain current, 15.4mJ avalanche energy rating, and operates in enhancement mode. This MOSFET comes in a small outline package with gull wing terminals and matte tin finish.

Median Price

$0.556

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2,460 parts In-Stock

1+ parts

$0.720

100+ parts

$0.344

1k+ parts

$0.276

10k+ parts

-

2,460

$0.720

$0.344

$0.276

-

Mouser Electronics

USA . 2,808 parts In-Stock

1+ parts

$0.780

100+ parts

$0.355

1k+ parts

$0.268

10k+ parts

$0.202

2,808

$0.780

$0.355

$0.268

$0.202

DigiKey

USA . 350 parts In-Stock

1+ parts

$0.800

100+ parts

$0.362

1k+ parts

$0.270

10k+ parts

$0.203

350

$0.800

$0.362

$0.270

$0.203

Verical

USA . 407,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.189

407,500

-

-

-

$0.189

Farnell

UK . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.373

1k+ parts

$0.223

10k+ parts

$0.222

2,500

-

$0.373

$0.223

$0.222

Element14

Singapore . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.393

1k+ parts

$0.247

10k+ parts

-

2,500

-

$0.393

$0.247

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.259

10,000

-

-

-

$0.259

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 180 parts In-Stock

1+ parts

$7.801

100+ parts

-

1k+ parts

-

10k+ parts

-

180

$7.801

-

-

-

Northwest PG Solutions

USA . 342 parts In-Stock

1+ parts

$8.581

100+ parts

$7.723

1k+ parts

-

10k+ parts

-

342

$8.581

$7.723

-

-

Metaverse IC Inc.

Canada . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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90,000

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 17,939 parts In-Stock

1+ parts

-

100+ parts

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17,939

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-

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RC Electronics

USA . 17,820 parts In-Stock

1+ parts

-

100+ parts

$0.280

1k+ parts

$0.260

10k+ parts

$0.260

17,820

-

$0.280

$0.260

$0.260

Eastek

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,500

-

-

-

-

Overview

Enhance your power management solutions with the DMP6110SSSQ-13 by Diodes Incorporated. Crafted with precision and quality, this P-Channel Power FET offers superior performance in switching applications. With a maximum pulsed drain current of 19A and a minimum DS breakdown voltage of 60V, this transistor provides reliability and efficiency. Its single configuration with built-in diode ensures seamless operation, while its small outline package makes it ideal for space-constrained designs. Elevate your projects with the trusted technology of Diodes Incorporated and experience the value and benefits this power FET brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

P-channel FETs typically have lower ON-resistance and higher conductivity compared to N-channel FETs, making them suitable for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects against reverse voltage spikes, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast response times and efficient power management.

Surface Mount: YES

Allows for easy integration into SMD PCB designs, saving space and facilitating automated manufacturing processes.

Minimum DS Breakdown Voltage: 60 V

Suitable for applications requiring a higher breakdown voltage to handle increased power levels.

Package Shape: RECTANGULAR

Compact rectangular design allows for efficient placement on PCBs and minimizes wasted space.

Terminal Form: GULL WING

Gull wing terminals provide improved mechanical strength and reliability during soldering and operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and turn on when a voltage is applied, allowing for better control over switching operations.

Maximum Pulsed Drain Current (IDM): 19 A

Capable of handling high peak currents, making it suitable for applications with temporary power spikes.

Avalanche Energy Rating (EAS): 15.4 mJ

Higher energy rating indicates better ruggedness and ability to withstand voltage spikes without failing.

No. of Terminals: 8

Provides multiple connection points for external components, enhancing versatility in circuit designs.

Package Style (Meter): SMALL OUTLINE

Compact and standardized small outline package makes it compatible with various PCB layouts and assembly processes.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low ON-resistance, and efficient power handling capabilities.

Transistor Element Material: SILICON

Silicon-based FETs are widely used for their reliability, high performance, and compatibility with modern electronics.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and good solderability for reliable electrical connections.

Maximum Drain-Source On Resistance: 0.11 ohm

Low ON-resistance minimizes power losses and improves efficiency in switching applications.

Terminal Position: DUAL

Dual terminal configuration allows for versatile mounting options and easier connection to external components.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during soldering processes without compromising performance.

Reference Standard: AEC-Q101

Meets automotive-grade quality and reliability standards, making it suitable for automotive applications requiring high performance and durability.

Technical Specifications

Power Field Effect Transistors (FET) DMP6110SSSQ-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

15.4 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

19 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMP6110SSSQ-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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