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ADF7023-JBCPZ-RL

Analog Devices

ADF7023-JBCPZ-RL by Analog Devices

Analog Devices ADF7023-JBCPZ-RL is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and supports surface mount installation. With a package style of chip carrier, it is ideal for industrial applications requiring reliable telecom circuit interfaces.

Median Price

$2.845

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.845

10,000

-

-

-

$2.845

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,044 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,044

-

-

-

-

Digiode

USA . 435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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435

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 227 parts In-Stock

1+ parts

$12.618

100+ parts

-

1k+ parts

-

10k+ parts

-

227

$12.618

-

-

-

Parana Technologies

USA . 4,331 parts In-Stock

1+ parts

$13.067

100+ parts

-

1k+ parts

$12.153

10k+ parts

-

4,331

$13.067

-

$12.153

-

IDEA Electronic Components Group

UK . 1,345 parts In-Stock

1+ parts

$14.051

100+ parts

$13.348

1k+ parts

$13.348

10k+ parts

-

1,345

$14.051

$13.348

$13.348

-

Aztec Data Supply Inc.

USA . 200 parts In-Stock

1+ parts

$14.426

100+ parts

-

1k+ parts

-

10k+ parts

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200

$14.426

-

-

-

DigiPath Technology Company

USA . 542 parts In-Stock

1+ parts

$21.920

100+ parts

$21.043

1k+ parts

-

10k+ parts

$21.043

542

$21.920

$21.043

-

$21.043

One Stop Electronics

USA . 1,134 parts In-Stock

1+ parts

$589.000

100+ parts

-

1k+ parts

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10k+ parts

-

1,134

$589.000

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Semicontronic

India . 1,044 parts In-Stock

1+ parts

$901.000

100+ parts

$878.475

1k+ parts

$873.970

10k+ parts

-

1,044

$901.000

$878.475

$873.970

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Corphita

USA . 670 parts In-Stock

1+ parts

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100+ parts

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670

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Northwest PG Solutions

USA . 586 parts In-Stock

1+ parts

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586

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Native Components

USA . 411 parts In-Stock

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100+ parts

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411

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Overview

Discover the cutting-edge ADF7023-JBCPZ-RL by Analog Devices, a top-tier manufacturer known for quality and reliability. This telecom interface IC is perfect for a wide range of applications, offering seamless connectivity and enhanced performance. With its surface mount design and industrial-grade temperature rating, this chip carrier package ensures optimal functionality in any environment. Experience the value and benefits of this innovative product, providing customers with unmatched advantages and superior results. Elevate your projects to new heights with the ADF7023-JBCPZ-RL.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, saving time and effort during production.

Package Shape: SQUARE

The square shape of the package provides a compact design, making it suitable for applications where space is limited.

Power Supplies (V): 2.5/3.3

The product supports multiple power supply options, offering flexibility in different system configurations.

No. of Terminals: 32

With a high number of terminals, the product allows for complex connectivity and functionality in telecom interfaces.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal performance and protection for the integrated circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product remains functional even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for efficient routing and connection of signals within the product.

Maximum Seated Height: 0.8 mm

The low maximum seated height enables a compact and streamlined design for the product, ideal for space-constrained applications.

Width: 5 mm

The narrow width of the product facilitates easy integration into tight spaces and crowded PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures proper soldering of the product during assembly, preventing damage or defects.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables robust and reliable soldering of the product onto the PCB.

Length: 5 mm

The short length of the product contributes to its compact form factor, suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in harsh industrial environments with varying temperature conditions.

Terminal Form: NO LEAD

The no lead terminal form complies with industry regulations on hazardous substances and promotes environmental sustainability.

Telecom IC Type: TELECOM CIRCUIT

The telecom circuit type indicates that the product is specifically designed for telecom applications, ensuring optimal performance and compatibility.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is commonly used in telecom systems, making the product compatible with existing infrastructure.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting of components, enabling more functionality in a limited space.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product has a moderate sensitivity to moisture, requiring proper handling and storage to prevent damage.

Technical Specifications

Other Function Telecom Interface ICs ADF7023-JBCPZ-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

ADF7023-JBCPZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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