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AD99988BBPZ-4D4AC

Analog Devices

AD99988BBPZ-4D4AC by Analog Devices

TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,305 parts In-Stock

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4,305

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Digiode

USA . 610 parts In-Stock

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610

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Distributors (Availability)

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Native Components

USA . 746 parts In-Stock

1+ parts

$5.954

100+ parts

-

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746

$5.954

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AZTECH Wire

Italy . 438 parts In-Stock

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$10.510

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438

$10.510

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Parana Technologies

USA . 76 parts In-Stock

1+ parts

$13.133

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$12.213

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76

$13.133

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$12.213

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IDEA Electronic Components Group

UK . 1,436 parts In-Stock

1+ parts

$14.121

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$13.415

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$13.415

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1,436

$14.121

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DigiPath Technology Company

USA . 588 parts In-Stock

1+ parts

$22.029

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$21.148

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$21.148

588

$22.029

$21.148

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$21.148

Semicontronic

India . 922 parts In-Stock

1+ parts

$112.000

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$109.200

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$108.640

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922

$112.000

$109.200

$108.640

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One Stop Electronics

USA . 150 parts In-Stock

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$564.000

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$564.000

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Northwest PG Solutions

USA . 886 parts In-Stock

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$5.835

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$5.835

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Corphita

USA . 741 parts In-Stock

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Technical Specifications

Other Function Telecom Interface ICs AD99988BBPZ-4D4AC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

No. of Functions:

1

No. of Terminals:

324

Maximum Operating Temperature:

120 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

1.72 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Trade Compliance

AD99988BBPZ-4D4AC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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