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AD9993BBCZRL

Analog Devices

AD9993BBCZRL by Analog Devices

AD9993BBCZRL by Analog Devices is a telecom interface IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85 °C and has a supply voltage of 1.8V. Ideal for telecom circuits, it features a square plastic/epoxy body and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,880 parts In-Stock

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Digiode

USA . 605 parts In-Stock

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605

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Northwest PG Solutions

USA . 553 parts In-Stock

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$2.742

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$2.742

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AZTECH Wire

Italy . 461 parts In-Stock

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$10.606

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Parana Technologies

USA . 4,710 parts In-Stock

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$12.374

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$11.507

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$12.374

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IDEA Electronic Components Group

UK . 682 parts In-Stock

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$13.305

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$12.640

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$12.640

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DigiPath Technology Company

USA . 593 parts In-Stock

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$20.756

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$19.926

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$19.926

593

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$19.926

Component Stockers USA

USA . 523 parts In-Stock

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$99.990

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$99.990

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One Stop Electronics

USA . 1,147 parts In-Stock

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$423.000

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Semicontronic

India . 568 parts In-Stock

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$661.000

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$644.475

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$641.170

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QUARKTWIN TECHNOLOGY LTD

USA . 22,067 parts In-Stock

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Vigor

Singapore . 1,051 parts In-Stock

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Corphita

USA . 680 parts In-Stock

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Native Components

USA . 461 parts In-Stock

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Microchip USA

USA . 318 parts In-Stock

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Overview

Enhance your telecommunications projects with the top-notch quality of Analog Devices' AD9993BBCZRL. This innovative Other Function Telecom Interface IC offers unmatched reliability and performance, making it a must-have for your applications. With Analog Devices' reputation for excellence and cutting-edge technology, you can trust that this product will exceed your expectations. Experience seamless integration, superior functionality, and unparalleled value when you choose the AD9993BBCZRL. Elevate your projects to the next level with this exceptional telecom circuit.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the PCB.

No. of Terminals: 196

With a high number of terminals, this product provides a wide range of connectivity options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connections on the PCB.

Maximum Seated Height: 1.4 mm

The low seated height helps in reducing the overall profile of the product in compact designs.

Width: 12 mm

Compact width allows for efficient PCB layout and integration into various systems.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with a short time at peak temperature for quick and reliable soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures strong and reliable solder connections.

Length: 12 mm

Compact length contributes to space-saving design and layout flexibility on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can withstand harsh operating conditions.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and mechanical strength.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage for efficient power consumption and operation in low-power applications.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high density and precise connections on the PCB.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product can withstand standard moisture exposure during handling and storage.

Technical Specifications

Other Function Telecom Interface ICs AD9993BBCZRL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B196

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

AD9993BBCZRL Telecommunications trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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