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AD9957BSVZ-REEL13

Analog Devices

AD9957BSVZ-REEL13 by Analog Devices

AD9957BSVZ-REEL13 by Analog Devices is a 48-terminal IC with 1.8-3.3V supplies, operating from -40 to 105°C. Ideal for telecom circuits, it features a square package style and matte tin finish, suitable for industrial applications requiring precise temperature control and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,871 parts In-Stock

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Digiode

USA . 217 parts In-Stock

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217

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Native Components

USA . 435 parts In-Stock

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$5.175

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435

$5.175

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Parana Technologies

USA . 2,351 parts In-Stock

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$9.740

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$9.058

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$9.740

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IDEA Electronic Components Group

UK . 2,268 parts In-Stock

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$10.473

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$9.949

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$9.949

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AZTECH Wire

Italy . 426 parts In-Stock

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$11.927

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DigiPath Technology Company

USA . 158 parts In-Stock

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$16.338

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$15.684

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$15.684

158

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$15.684

Semicontronic

India . 1,388 parts In-Stock

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$744.000

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$725.400

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$721.680

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1,388

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One Stop Electronics

USA . 496 parts In-Stock

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$961.000

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Northwest PG Solutions

USA . 985 parts In-Stock

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Corphita

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Overview

Unlock the potential of your telecom interface with the AD9957BSVZ-REEL13 by Analog Devices. Known for their top-notch quality and innovative technology, Analog Devices delivers superior telecom ICs that exceed industry standards. This versatile product is designed for a wide range of applications, offering customers unmatched performance and reliability. Experience the value and benefits of the AD9957BSVZ-REEL13 and elevate your projects to the next level with ease.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and quick assembly onto PCBs, making it a convenient choice for manufacturers.

Package Shape: SQUARE

The square package shape can provide better heat dissipation and more efficient use of board space compared to other shapes.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages allows for flexibility in system design and compatibility with various applications.

No. of Terminals: 48

Having a high number of terminals provides a wide range of connectivity options and allows for complex circuitry.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Multiple package styles offer versatility in design options and compatibility with different PCB layouts.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the reliability and longevity of the product.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connections, reducing the risk of errors during installation.

Maximum Seated Height: 1.2 mm

Low maximum seated height allows for a compact and space-saving design, ideal for applications where board real estate is limited.

Width: 14 mm

With a standard width size, it can easily fit into common PCB layouts and enclosures.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliable connections during the manufacturing process.

Length: 14 mm

Standard length helps in compatibility with typical PCB sizes and spacing requirements.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in demanding environments where temperature fluctuations are common.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of handling during assembly, improving overall product quality.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and functionality in telecommunications systems.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage of 1.8 V ensures consistent operation and compatibility with other components in the system.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting and increased flexibility in routing signals on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.

Technical Specifications

Other Function Telecom Interface ICs AD9957BSVZ-REEL13 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQFP-G48

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

AD9957BSVZ-REEL13 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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