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196 Other Function Telecom Interface ICs 16

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
AD9993BBCZ by Analog Devices

AD9993BBCZ

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

ADRV9009BBCZ-REEL by Analog Devices

ADRV9009BBCZ-REEL

Analog Devices

ADRV9009BBCZ-REEL by Analog Devices is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.

S-PBGA-B196

e1

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-1REEL by Analog Devices

ADRV9008BBCZ-1REEL

Analog Devices

Analog Devices ADRV9008BBCZ-1REEL is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuit applications requiring fine pitch and bottom terminal position.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-2REEL by Analog Devices

ADRV9008BBCZ-2REEL

Analog Devices

Analog Devices ADRV9008BBCZ-2REEL is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

AD6679BBPZ-500 by Analog Devices

AD6679BBPZ-500

Analog Devices

AD6679BBPZ-500 by Analog Devices is a GRID ARRAY IC with 196 terminals, operating b/w -40 to 85 °C. It has a nominal voltage of 1.25V and terminal pitch of 0.8mm. Ideal for TELECOM CIRCUITS, it features TIN SILVER COPPER finish and is suitable for industrial temperature grades.

S-PBGA-B196

e1

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

1.49 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

12 mm

AD6679BBPZRL7-500 by Analog Devices

AD6679BBPZRL7-500

Analog Devices

AD6679BBPZRL7-500 by Analog Devices is a SQUARE GRID ARRAY IC with 196 terminals. It operates b/w -40 to 85 °C, suitable for TELECOM CIRCUITS. With a supply voltage of 1.25 V and terminal pitch of 0.8 mm, it's ideal for industrial applications requiring high performance telecom interface solutions.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

1.49 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

ADRV9009BBCZ by Analog Devices

ADRV9009BBCZ

Analog Devices

Analog Devices ADRV9009BBCZ is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a fine pitch terminal style and tin silver copper finish.

S-PBGA-B196

e1

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-1 by Analog Devices

ADRV9008BBCZ-1

Analog Devices

ADRV9008BBCZ-1 by Analog Devices is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom applications requiring precise signal processing and connectivity in industrial environments.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-2 by Analog Devices

ADRV9008BBCZ-2

Analog Devices

Analog Devices' ADRV9008BBCZ-2 is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a bottom terminal position and plastic/epoxy body material.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

VSC8490YJU-17 by Microchip Technology

VSC8490YJU-17

Microchip Technology

VSC8490YJU-17 by Microchip Technology is a telecom IC with 196 terminals in a low-profile grid array package. It operates b/w -40 to 110°C, supporting data rates up to 10 Gbps. Ideal for industrial applications requiring high-speed telecom circuitry in compact form factors.

10000 Mbps

S-PBGA-B196

15 mm

1

196

110 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

BGA196,14X14,40

SQUARE

GRID ARRAY, LOW PROFILE

1.4 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

1 mm

BOTTOM

15 mm

VSC8491YJU-17 by Microchip Technology

VSC8491YJU-17

Microchip Technology

Microchip Technology's VSC8491YJU-17 is a telecom IC with data rate of 10 Gbps. It operates in industrial temperature range (-40 to 110°C) and has 196 terminals in a low profile grid array package. Ideal for telecom applications requiring high-speed data transmission.

10000 Mbps

S-PBGA-B196

15 mm

1

196

110 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

BGA196,14X14,40

SQUARE

GRID ARRAY, LOW PROFILE

1.4 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

1 mm

BOTTOM

15 mm

VSC8491YJU-13 by Microchip Technology

VSC8491YJU-13

Microchip Technology

VSC8491YJU-13 by Microchip is a telecom IC with 196 terminals in a low profile grid array package. Operating from -40 to 110°C, it has a nominal voltage of 1V. Ideal for telecom applications, this IC features bottom terminal position and ball-shaped terminals.

S-PBGA-B196

15 mm

1

196

110 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

1.4 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

1 mm

BOTTOM

15 mm

ADRV9002BBCZ-RL by Analog Devices

ADRV9002BBCZ-RL

Analog Devices

ADRV9002BBCZ-RL by Analog Devices is a telecom IC with 1 function. It has a package style of grid array, thin profile, and fine pitch. With an operating temperature range of -40 to 110 °C, it is suitable for industrial applications.

S-PBGA-B196

12 mm

3

1

196

110 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.19 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

ADRV9002BBCZ by Analog Devices

ADRV9002BBCZ

Analog Devices

Analog Devices ADRV9002BBCZ is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 110°C, with a nominal voltage of 1V. Ideal for telecom circuits, it has a thin profile and fine pitch design for surface mounting applications.

S-PBGA-B196

12 mm

3

1

196

110 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.19 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

ADRV9004BBCZ-RL by Analog Devices

ADRV9004BBCZ-RL

Analog Devices

Analog Devices ADRV9004BBCZ-RL is a telecom IC with 2 functions, operating b/w -40 to 85°C. It has 196 terminals in a square grid array package style, suitable for telecom circuit applications. With a nominal voltage of 1V and terminal pitch of 0.8mm, it offers high performance in a compact form factor.

S-PBGA-B196

12 mm

3

2

196

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

1.25 mm

1 V

YES

TELECOM CIRCUIT

BALL

.8 mm

BOTTOM

30

12 mm

ADRV9004BBCZ by Analog Devices

ADRV9004BBCZ

Analog Devices

Analog Devices ADRV9004BBCZ is a telecom IC with 2 functions, operating b/w -40 to 85°C. It features a grid array package with 196 terminals and 0.8mm pitch, suitable for telecom interface applications. The PLASTIC/EPOXY body material and bottom terminal position make it ideal for surface mount assembly.

S-PBGA-B196

12 mm

3

2

196

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

1.25 mm

1 V

YES

TELECOM CIRCUIT

BALL

.8 mm

BOTTOM

30

12 mm