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12 Other Function Telecom Interface ICs 24

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
MRF24J40MB-I/RM by Microchip Technology

MRF24J40MB-I/RM

Microchip Technology

MRF24J40MB-I/RM by Microchip: Operates at -40 to 85°C, with 2.5/3.3V power supplies and 12 terminals. Ideal for industrial applications requiring telecom interface ICs in plastic/epoxy packages.

12

85 Cel

-40 Cel

PLASTIC/EPOXY

MODULE,12LEAD,.9

2.5/3.3

Not Qualified

Other Telecom ICs

INDUSTRIAL

SX8651ICSTRT by Semtech

SX8651ICSTRT

Semtech

Semtech's SX8651ICSTRT is a 12-terminal IC with nickel palladium gold finish. It operates b/w -40 to 85°C, ideal for industrial telecom circuits at 1.8V supply voltage. The package style is grid array, very thin profile, fine pitch, suitable for surface mount applications.

R-PBGA-B12

e4

2 mm

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.625 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BALL

.5 mm

BOTTOM

1.5 mm

SX8651IWLTRT by Semtech

SX8651IWLTRT

Semtech

Semtech's SX8651IWLTRT is a telecom IC with 12 terminals, operating b/w -40 to 85°C. It has a small outline package style and nominal voltage of 1.8V, suitable for telecom circuit applications. The IC is surface mountable, with a terminal pitch of 0.45mm and moisture sensitivity level of 2.

S-PDSO-N12

e3

3 mm

2

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.45 mm

DUAL

3 mm

ALM-GP002-TR1G by Broadcom

ALM-GP002-TR1G

Broadcom

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N12

4.5 mm

3

1

12

85 Cel

-40 Cel

UNSPECIFIED

QCCN

RECTANGULAR

CHIP CARRIER

260

1.05 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

QUAD

2.2 mm

LM3291TME/NOPB by Texas Instruments

LM3291TME/NOPB

Texas Instruments

LM3291TME/NOPB by Texas Instruments is a 12-terminal IC with a rectangular package style. It operates b/w -30 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for telecom circuits due to its thin profile and fine pitch grid array package design.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3291TMX/NOPB by Texas Instruments

LM3291TMX/NOPB

Texas Instruments

LM3291TMX/NOPB by Texas Instruments is a telecom interface IC with 12 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30s. This very thin profile IC is ideal for telecom circuit applications due to its fine pitch and ball terminal form.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

AN7580 by Panasonic

AN7580

Panasonic

The Panasonic AN7580 is a telecom interface IC with 12 terminals, operating temperature range of -25 to 75°C. It features bipolar technology, nominal voltage of 12V, and is designed for telecom circuit applications. The package style is in-line rectangular made of plastic/epoxy material.

R-PSIP-T12

1

12

75 Cel

-25 Cel

PLASTIC/EPOXY

SIP

RECTANGULAR

IN-LINE

Not Qualified

12 V

NO

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

SINGLE

MRF24J40MDT-I/RM by Microchip Technology

MRF24J40MDT-I/RM

Microchip Technology

Microchip Technology's MRF24J40MDT-I/RM is a telecom IC with 12 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 2.54mm. Ideal for industrial applications requiring reliable wireless communication in compact spaces.

R-XDMA-N12

e3

33.02 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.3528 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

2.54 mm

DUAL

22.86 mm

ALM-GP001-BLKG by Broadcom

ALM-GP001-BLKG

Broadcom

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N12

3 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

QCCN

RECTANGULAR

CHIP CARRIER

1.1 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

QUAD

2.5 mm

ALM-GP001-TR1G by Broadcom

ALM-GP001-TR1G

Broadcom

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N12

3 mm

3

1

12

85 Cel

-40 Cel

UNSPECIFIED

QCCN

RECTANGULAR

CHIP CARRIER

260

1.1 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

QUAD

2.5 mm

ISO150AU/1K by Texas Instruments

ISO150AU/1K

Texas Instruments

ISO150AU/1K by Texas Instruments is a BICMOS technology telecom IC with 2 functions. It operates in industrial temperature range (-40 to 85°C) and has a supply voltage of 5V. This small outline package with gull wing terminals is suitable for telecom circuit applications.

R-PDSO-G12

e4

17.9 mm

3

2

12

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

Not Qualified

2.65 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

30

7.5 mm

ISO150AUG4 by Texas Instruments

ISO150AUG4

Texas Instruments

The Texas Instruments ISO150AUG4 is a BICMOS technology telecom IC with 2 functions, suitable for industrial applications. It operates b/w -40 to 85°C, with a supply voltage of 5V. The package is small outline, rectangular in shape, with Gull Wing terminals and nickel palladium gold finish.

R-PDSO-G12

e4

17.9 mm

3

2

12

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

Not Qualified

2.65 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

30

7.5 mm

HMC773ALC3BTR by Analog Devices

HMC773ALC3BTR

Analog Devices

Analog Devices' HMC773ALC3BTR is a telecom IC with 12 terminals in a square chip carrier package. Operating from -40 to 85°C, it features gold over nickel terminal finish and 0.5mm pitch. Ideal for industrial applications requiring very thin profile components.

S-CQCC-N12

e4

3 mm

3

1

12

85 Cel

-40 Cel

CERAMIC, METAL-SEALED COFIRED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.92 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD OVER NICKEL

NO LEAD

.5 mm

QUAD

3 mm

HMC773ALC3B by Analog Devices

HMC773ALC3B

Analog Devices

Analog Devices' HMC773ALC3B is a telecom IC with 12 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with TUNGSTEN NICKEL GOLD finish and 0.5mm terminal pitch. Ideal for industrial applications requiring very thin profile and surface mount compatibility.

S-CQCC-N12

3 mm

3

1

12

85 Cel

-40 Cel

CERAMIC, METAL-SEALED COFIRED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.92 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

TUNGSTEN NICKEL GOLD

NO LEAD

.5 mm

QUAD

3 mm

TUSB214QRWBTQ1 by Texas Instruments

TUSB214QRWBTQ1

Texas Instruments

TUSB214QRWBTQ1 by Texas Instruments is a telecom interface IC with 12 terminals in a chip carrier package. It operates at temperatures ranging from -40 to 105°C, with a data rate of 480.24 Mbps. Ideal for industrial applications requiring a supply voltage of 3.3V and low supply current of 0.03mA.

480.24 Mbps

S-PQCC-N12

e4

1.6 mm

2

1

1

12

105 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

AEC-Q100

.4 mm

.03 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

30

1.6 mm

TUSB212QRWBRQ1 by Texas Instruments

TUSB212QRWBRQ1

Texas Instruments

TUSB212QRWBRQ1 by Texas Instruments is a telecom IC with 480.24 Mbps data rate, operating at -40 to 105°C. It features a 3.3V supply voltage, 0.03 mA supply current, and AEC-Q100 screening for industrial applications in automotive or telecommunications due to its compact chip carrier package design.

480.24 Mbps

S-PQCC-N12

e4

1.6 mm

2

1

1

12

105 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

AEC-Q100

.4 mm

.03 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

30

1.6 mm

TUSB214IRWBR by Texas Instruments

TUSB214IRWBR

Texas Instruments

TUSB214IRWBR by Texas Instruments is a telecom IC with data rate of 480.24 Mbps, operating at 3.3V. It features a quad terminal position, very thin profile chip carrier package style, and industrial temperature grade suitability. Ideal for telecom interface applications requiring low supply current and high-speed data transmission in compact designs.

480.24 Mbps

S-PQCC-N12

e4

1.6 mm

2

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

.4 mm

.03 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

30

1.6 mm

L80-M39 by Quectel Wireless Solutions

L80-M39

Quectel Wireless Solutions

L80-M39 by Quectel is a telecom interface IC with 1 function. It has a square package shape, 12 terminals, and a max operating temperature of 85°C. This IC is commonly used in industrial applications requiring reliable telecom circuitry.

S-XDMA-N12

16 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

SQUARE

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

7.05 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2.54 mm

DUAL

NOT SPECIFIED

16 mm

BGM15HA12E6327XTSA1 by Infineon Technologies

BGM15HA12E6327XTSA1

Infineon Technologies

BGM15HA12E6327XTSA1 by Infineon is a telecom interface IC with 12 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 2.8V, it's ideal for telecom circuit applications requiring surface mount technology.

R-PBCC-N12

e4

1.9 mm

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

.65 mm

2.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD NICKEL

NO LEAD

.4 mm

BOTTOM

1.1 mm

BGM15MA12E6327XTSA1 by Infineon Technologies

BGM15MA12E6327XTSA1

Infineon Technologies

BGM15MA12E6327XTSA1 by Infineon is a telecom IC with 12 terminals, operating temperature range of -40 to 85°C. It features a chip carrier package style, very thin profile, and no-lead terminal form. Ideal for telecom circuit applications with a nominal voltage of 2.8V and compact dimensions of 1.9mm x 1.1mm x 0.65mm.

R-PBCC-N12

1.9 mm

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

.65 mm

2.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.4 mm

BOTTOM

1.1 mm

HMC773ALC3BTR-R5 by Analog Devices

HMC773ALC3BTR-R5

Analog Devices

Analog Devices' HMC773ALC3BTR-R5 is a telecom IC with 12 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. With a very thin profile and no-lead terminal form, it's ideal for telecom interface applications.

S-XQCC-N12

2.9 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.9 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

2.9 mm

STHVDAC-253C7 by STMicroelectronics

STHVDAC-253C7

STMicroelectronics

STHVDAC-253C7 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates b/w -30 °C and 85 °C, with a nominal voltage of 3.3V and features a very thin profile grid array package. Ideal for compact telecom systems, it ensures efficient performance in limited spaces.

R-XBGA-B12

1.45 mm

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

BGA12,3X4,14

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.64 mm

3.3 V

YES

TELECOM CIRCUIT

BALL

.35 mm

BOTTOM

NOT SPECIFIED

1.1 mm

MRF24J40ME-I/RM by Microchip Technology

MRF24J40ME-I/RM

Microchip Technology

MRF24J40ME-I/RM by Microchip Technology is a telecom interface IC with 12 terminals and a rectangular package shape. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of 3.3V. This IC is commonly used in telecom circuits for various applications.

R-XDMA-N12

33.02 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

3.48 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2.54 mm

DUAL

22.86 mm

MRF24J40MET-I/RM by Microchip Technology

MRF24J40MET-I/RM

Microchip Technology

MRF24J40MET-I/RM by Microchip: Telecom IC with 12 terminals, 3.3V supply voltage, and -40 to 85°C operating temp. Ideal for industrial telecom applications due to TS 16949 screening level and no-lead terminal form. Compact rectangular package style with dual terminal position.

R-XDMA-N12

33.02 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

3.48 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2.54 mm

DUAL

22.86 mm