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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX100-N3CSG484C by Xilinx

XC6SLX100-N3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

338

338

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100T-N3FGG676C by Xilinx

XC6SLX100T-N3FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

376

376

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC6SLX25T-N3CSG324C by Xilinx

XC6SLX25T-N3CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

24051

190

190

1879

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6VLX75T-3FFG784C by Xilinx

XC6VLX75T-3FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

5820

1412 MHz

0.59 ns

CMOS

Field Programmable Gate Arrays

5820 CLBS

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC7A100T-1CSG324C by Xilinx

XC7A100T-1CSG324C

Xilinx

Xilinx XC7A100T-1CSG324C FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1098 MHz. Ideal for high-performance applications requiring fast processing speeds in compact designs with low power consumption.

FPGA

101440

300

300

7925

1098 MHz

1.27 ns

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

No

XC7A100T-1FGG484C by Xilinx

XC7A100T-1FGG484C

Xilinx

Xilinx XC7A100T-1FGG484C is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. Operating at max frequency of 1098 MHz, it's ideal for high-performance applications requiring fast combinatorial delay of 1.27 ns in a compact package style suitable for surface mount technology.

FPGA

101440

285

285

7925

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A100T-1FGG676C by Xilinx

XC7A100T-1FGG676C

Xilinx

Xilinx XC7A100T-1FGG676C is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. It operates b/w -40 to 85°C and is ideal for high-speed digital applications requiring programmable ICs in a grid array package.

FPGA

101440

300

300

7925

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A100T-2CSG324C by Xilinx

XC7A100T-2CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

101440

300

300

7925

1286 MHz

1.05 ns

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

No

XC7A100T-2FGG484C by Xilinx

XC7A100T-2FGG484C

Xilinx

Xilinx XC7A100T-2FGG484C FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.

FPGA

101440

285

285

7925

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A100T-2FGG676C by Xilinx

XC7A100T-2FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

101440

300

300

7925

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A100T-2FTG256C by Xilinx

XC7A100T-2FTG256C

Xilinx

Xilinx XC7A100T-2FTG256C is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1286 MHz. Ideal for high-speed applications requiring low profile grid array packages. Operating temp range: 0-85°C.

FPGA

101440

300

300

7925

1286 MHz

1.05 ns

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC7A100T-3CSG324E by Xilinx

XC7A100T-3CSG324E

Xilinx

Xilinx XC7A100T-3CSG324E is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1412 MHz. Ideal for high-performance applications requiring fast processing speeds in industries like telecommunications and aerospace. Package style: Grid Array, low profile, fine pitch.

FPGA

101440

300

300

7925

1412 MHz

0.94 ns

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

No

XC7A200T-1FBG484C by Xilinx

XC7A200T-1FBG484C

Xilinx

The Xilinx XC7A200T-1FBG484C is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

215360

285

285

16825

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A200T-1FBG676C by Xilinx

XC7A200T-1FBG676C

Xilinx

Xilinx XC7A200T-1FBG676C FPGA offers 215360 logic cells, 16825 CLBs, and 400 inputs/outputs. Ideal for high-performance applications requiring a max clock frequency of 1098 MHz. Package style is grid array with plastic/epoxy material and tin silver copper finishing.

FPGA

215360

400

400

16825

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A200T-1FFG1156C by Xilinx

XC7A200T-1FFG1156C

Xilinx

XC7A200T-1FFG1156C by Xilinx is a FPGA with 215360 logic cells, 16825 CLBs, and 1098 MHz max clock frequency. Ideal for applications requiring high-speed processing like telecommunications, networking equipment, and industrial automation due to its advanced programmable features.

FPGA

215360

500

500

16825

1098 MHz

1.27 ns

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.1 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC7A200T-1SBG484C by Xilinx

XC7A200T-1SBG484C

Xilinx

Xilinx XC7A200T-1SBG484C is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1098 MHz. It operates b/w -40 to 85 °C and is used in high-performance computing applications.

FPGA

215360

285

285

16825

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC7A200T-2FBG484C by Xilinx

XC7A200T-2FBG484C

Xilinx

Xilinx XC7A200T-2FBG484C FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

215360

285

285

16825

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A200T-2FBG676C by Xilinx

XC7A200T-2FBG676C

Xilinx

Xilinx XC7A200T-2FBG676C FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.

FPGA

215360

400

400

16825

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A200T-2FFG1156C by Xilinx

XC7A200T-2FFG1156C

Xilinx

Xilinx XC7A200T-2FFG1156C FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

215360

500

500

16825

1286 MHz

1.05 ns

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.1 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC7A200T-2SBG484C by Xilinx

XC7A200T-2SBG484C

Xilinx

Xilinx XC7A200T-2SBG484C FPGA offers 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable IC technology in a compact grid array package with fine pitch terminals.

FPGA

215360

285

285

16825

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC7A200T-3FFG1156E by Xilinx

XC7A200T-3FFG1156E

Xilinx

The Xilinx XC7A200T-3FFG1156E is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

215360

500

500

16825

1412 MHz

0.94 ns

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.1 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC4010D-5PQ160C by Xilinx

XC4010D-5PQ160C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;

FPGA

400

160

160

400

8000

133.3 MHz

4.5 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 8000 Gates

1120 flip-flops; typical gates = 8000-10000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack

QFP

Square

28 mm

28 mm

3.92 mm

QFP160,1.2SQ

Quad

Gull Wing

Tin Lead

.65 mm

160

S-PQFP-G160

e0

No

XC4010-5PQ208C by Xilinx

XC4010-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

400

160

160

400

8000

133.3 MHz

4.5 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 8000 Gates

1120 flip-flops; typical gates = 8000-10000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

3.92 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

208

S-PQFP-G208

e0

No

XC4013-5PQ208C by Xilinx

XC4013-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

133.3 MHz

4.5 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

1536 flip-flops; typical gates = 10000-13000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

3.92 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

208

S-PQFP-G208

e0

No

XC4013-6PQ240C by Xilinx

XC4013-6PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

90.9 MHz

6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

1536 flip-flops; typical gates = 10000-13000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

3.75 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

240

S-PQFP-G240

e0

No

XC3030-100PC44C by Xilinx

XC3030-100PC44C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

100

34

34

100

1500

100 MHz

7 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 1500 Gates

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

16.5862 mm

16.5862 mm

4.318 mm

LDCC44,.7SQ

Quad

J Bend

Tin Lead

1.27 mm

44

S-PQCC-J44

e0

No

XC3030-100PC68C by Xilinx

XC3030-100PC68C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

100

58

58

100

1500

100 MHz

7 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 1500 Gates

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

1

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

24.2316 mm

24.2316 mm

4.445 mm

LDCC68,1.0SQ

Quad

J Bend

Tin Lead

1.27 mm

68

S-PQCC-J68

e0

No

XC3030-100PC84C by Xilinx

XC3030-100PC84C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

100

74

74

100

1500

100 MHz

7 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 1500 Gates

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

29.3116 mm

29.3116 mm

5.08 mm

LDCC84,1.2SQ

Quad

J Bend

Tin Lead

1.27 mm

84

S-PQCC-J84

e0

No

XC3030-100PQ100C by Xilinx

XC3030-100PQ100C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;

FPGA

100

80

80

100

1500

100 MHz

7 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 1500 Gates

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack

QFP

Rectangular

20 mm

14 mm

2.87 mm

QFP100,.7X.9

Quad

Gull Wing

Tin Lead

.65 mm

100

R-PQFP-G100

e0

No

XC4003-6PC84C by Xilinx

XC4003-6PC84C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

238

61

61

100

2500

90.9 MHz

6 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2500 Gates

360 flip-flops; typical gates = 2500-3000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

29.3116 mm

29.3116 mm

5.08 mm

LDCC84,1.2SQ

Quad

J Bend

Tin Lead

1.27 mm

84

S-PQCC-J84

e0

No

XC4003-6PQ100C by Xilinx

XC4003-6PQ100C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;

FPGA

238

77

77

100

2500

90.9 MHz

6 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2500 Gates

360 flip-flops; typical gates = 2500-3000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack

QFP

Rectangular

20 mm

14 mm

2.87 mm

QFP100,.7X.9

Quad

Gull Wing

Tin Lead

.65 mm

100

R-PQFP-G100

e0

No

XC3042-100PC84C by Xilinx

XC3042-100PC84C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

144

74

74

144

2000

100 MHz

7 ns

CMOS

Field Programmable Gate Arrays

144 CLBS, 2000 Gates

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

29.3116 mm

29.3116 mm

5.08 mm

LDCC84,1.2SQ

Quad

J Bend

Tin Lead

1.27 mm

84

S-PQCC-J84

e0

No

XC3042-100PQ100C by Xilinx

XC3042-100PQ100C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;

FPGA

144

82

82

144

2000

100 MHz

7 ns

CMOS

Field Programmable Gate Arrays

144 CLBS, 2000 Gates

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack

QFP

Rectangular

20 mm

14 mm

2.87 mm

QFP100,.7X.9

Quad

Gull Wing

Tin Lead

.65 mm

100

R-PQFP-G100

e0

No

XC4005-5PC84C by Xilinx

XC4005-5PC84C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

196

112

112

196

4000

133.3 MHz

4.5 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 4000 Gates

616 flip-flops; typical gates = 4000-5000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

29.3116 mm

29.3116 mm

5.08 mm

LDCC84,1.2SQ

Quad

J Bend

Tin Lead

1.27 mm

84

S-PQCC-J84

e0

No

XC4005-5PQ160C by Xilinx

XC4005-5PQ160C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;

FPGA

196

112

112

196

4000

133.3 MHz

4.5 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 4000 Gates

616 flip-flops; typical gates = 4000-5000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack

QFP

Square

28 mm

28 mm

3.92 mm

QFP160,1.2SQ

Quad

Gull Wing

Tin Lead

.65 mm

160

S-PQFP-G160

e0

No

XC4005-5PQ208C by Xilinx

XC4005-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

196

112

112

196

4000

133.3 MHz

4.5 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 4000 Gates

616 flip-flops; typical gates = 4000-5000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

3.92 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

208

S-PQFP-G208

e0

No

XC3090-100PQ208C by Xilinx

XC3090-100PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

320

144

144

320

5000

100 MHz

7 ns

CMOS

Field Programmable Gate Arrays

320 CLBS, 5000 Gates

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

3.92 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

208

S-PQFP-G208

e0

No

XC4008-5PQ208C by Xilinx

XC4008-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

770

144

144

324

6500

133.3 MHz

4.5 ns

CMOS

Field Programmable Gate Arrays

324 CLBS, 6500 Gates

936 flip-flops; typical gates = 6500-8000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

3.92 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

208

S-PQFP-G208

e0

No

LCMXO3L-1300C-6BG256C by Lattice Semiconductor

LCMXO3L-1300C-6BG256C

Lattice Semiconductor

LCMXO3L-1300C-6BG256C by Lattice Semiconductor is a 160 CLBs FPGA with max supply voltage of 3.465V and nominal voltage of 2.5V. It features a grid array package style, suitable for applications requiring low profile and fine pitch requirements in electronics design and development.

FPGA

160

160 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-2100C-5BG256C by Lattice Semiconductor

LCMXO3L-2100C-5BG256C

Lattice Semiconductor

LCMXO3L-2100C-5BG256C by Lattice Semiconductor is a 264 CLB FPGA with max supply voltage of 3.465V, ideal for applications requiring low profile and fine pitch grid array packages. Operating temp range from 0 to 85°C makes it suitable for various electronic designs needing high performance in compact spaces.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-4300C-5BG256C by Lattice Semiconductor

LCMXO3L-4300C-5BG256C

Lattice Semiconductor

LCMXO3L-4300C-5BG256C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-6900C-5BG256C by Lattice Semiconductor

LCMXO3L-6900C-5BG256C

Lattice Semiconductor

LCMXO3L-6900C-5BG256C by Lattice Semiconductor is a 858 CLBs FPGA with max supply voltage of 3.465V, suitable for applications requiring low profile, fine pitch grid arrays. Operating temp range from 0 to 85°C, making it ideal for various industrial and commercial projects.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-6900C-6BG256C by Lattice Semiconductor

LCMXO3L-6900C-6BG256C

Lattice Semiconductor

LCMXO3L-6900C-6BG256C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. Featuring a grid array package style, it has 0.8mm terminal pitch and is suitable for applications requiring low profile, fine pitch ICs in electronics manufacturing.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

XCS30XL-5BG256C by Xilinx

XCS30XL-5BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCS40XL-5BG256C by Xilinx

XCS40XL-5BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCS05XL-5PC84C by Xilinx

XCS05XL-5PC84C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

100

77

77

100

2000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Maximum usable gates 5000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

29.3116 mm

29.3116 mm

5.08 mm

LDCC84,1.2SQ

Quad

J Bend

Tin Lead

1.27 mm

84

S-PQCC-J84

e0

No

XCS10XL-5PC84C by Xilinx

XCS10XL-5PC84C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

29.3116 mm

29.3116 mm

5.08 mm

LDCC84,1.2SQ

Quad

J Bend

Tin Lead

1.27 mm

84

S-PQCC-J84

e0

No

XCS05XL-5VQ100C by Xilinx

XCS05XL-5VQ100C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

100

77

77

100

2000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Maximum usable gates 5000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Tin/Lead

.5 mm

100

S-PQFP-G100

e0

No