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LCMXO3L-6900C-5BG256C

Lattice Semiconductor

LCMXO3L-6900C-5BG256C by Lattice Semiconductor

LCMXO3L-6900C-5BG256C by Lattice Semiconductor is a 858 CLBs FPGA with max supply voltage of 3.465V, suitable for applications requiring low profile, fine pitch grid arrays. Operating temp range from 0 to 85°C, making it ideal for various industrial and commercial projects.

Median Price

$19.165

Lifecycle Status

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5

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1k+

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Mouser Electronics

USA . 127 parts In-Stock

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$18.250

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$16.790

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DigiKey

USA . 99 parts In-Stock

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$20.080

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$16.170

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Nova Conductors

Japan . 50 parts In-Stock

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$13.984

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Vyrian

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Chip Stock

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AZTECH Wire

Italy . 683 parts In-Stock

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$9.967

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Aranea Global

USA . 500 parts In-Stock

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$13.704

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$13.156

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Continental Prestige Electronics

USA . 119 parts In-Stock

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$13.960

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$11.560

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Microchip USA

USA . 1,675 parts In-Stock

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$14.345

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Ampacity Inc.

Singapore . 124 parts In-Stock

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$15.510

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Advanced Electronics

New Zealand . 22 parts In-Stock

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$16.797

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$15.453

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$14.480

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Aztec Data Supply Inc.

USA . 106 parts In-Stock

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$35.691

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Corohmni

South Africa . 392 parts In-Stock

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Argo Parts USA

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Overview

Unlock the power of cutting-edge technology with the LCMXO3L-6900C-5BG256C by Lattice Semiconductor. As a leading manufacturer in the field, Lattice Semiconductor delivers top-quality Field Programmable Gate Arrays (FPGA) that are revolutionizing industries worldwide. With its advanced features and exceptional performance, this FPGA offers endless possibilities for applications in telecommunications, automotive, defense, and more. Experience unparalleled value, benefits, and advantages with the LCMXO3L-6900C-5BG256C, setting new standards in innovation and efficiency.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the FPGA lightweight and durable, making it easier to handle and less prone to damage during handling and shipping.

Surface Mount YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage 3.465 V

The high maximum supply voltage of 3.465 V provides flexibility and compatibility with a wide range of power supply systems, ensuring reliable performance.

No. of CLBs 858

With 858 configurable logic blocks (CLBs), this FPGA offers ample resources for complex logic operations and designs, making it suitable for a variety of applications.

Package Shape SQUARE

The square package shape allows for efficient use of PCB real estate, optimizing the layout and design of the overall system.

Nominal Supply Voltage (V) 2.5

The nominal supply voltage of 2.5 V is a common and standard voltage level, ensuring compatibility with a wide range of power sources and systems.

No. of Terminals 256

With 256 terminals, this FPGA offers ample connectivity options for interfacing with other components and devices, enabling versatile and robust system integration.

Programmable IC Type FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable gate array (FPGA), this IC type allows for reconfigurability and flexibility in designing and implementing custom logic functions, making it ideal for prototyping and rapid development.

Package Style (Meter) GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances the thermal performance and signal integrity of the FPGA, making it suitable for high-speed and compact applications.

Minimum Supply Voltage 2.375 V

The low minimum supply voltage of 2.375 V ensures efficient power consumption and compatibility with low-power applications, promoting energy efficiency.

Maximum Operating Temperature 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in demanding environmental conditions, making it suitable for industrial and automotive applications.

Pitch Of Terminal 0.8 mm

The small pitch of 0.8 mm between terminals allows for high-density packaging and interconnectivity, enabling compact and efficient PCB layouts.

Organization 858 CLBS

The organization of 858 CLBs provides ample resources for implementing complex logic functions and algorithms, enabling versatile and high-performance applications.

Minimum Operating Temperature 0 °C

The low minimum operating temperature of 0°C ensures reliable performance even in cold environments, making it suitable for outdoor and industrial applications.

Finishing Of Terminal Used TIN SILVER COPPER

The use of tin, silver, and copper as terminal finishing materials ensures excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the connections.

Position Of Terminal BOTTOM

Having the terminals positioned at the bottom facilitates easy and efficient PCB mounting and soldering, simplifying the assembly process and reducing production time.

Moisture Sensitivity Level (MSL) 3

With a moisture sensitivity level of 3, this FPGA is suitable for standard surface mount assembly processes, ensuring proper handling and storage to prevent moisture-related issues.

Maximum Seated Height 1.7 mm

The low maximum seated height of 1.7 mm allows for compact and slim designs, saving space and enabling the integration of the FPGA into space-constrained applications.

Width 14 mm

The width of 14 mm provides a compact form factor for the FPGA, making it suitable for applications where space is limited or where a smaller footprint is required.

Maximum Time At Peak Reflow Temperature (s) 30

The short maximum time of 30 seconds at peak reflow temperature ensures efficient and reliable soldering during the assembly process, reducing the risk of thermal damage to the FPGA.

Peak Reflow Temperature °C 260

The high peak reflow temperature of 260°C allows for reliable soldering and mounting of the FPGA on the PCB, ensuring strong and robust connections in high-temperature environments.

Length 14 mm

The length of 14 mm contributes to the overall compactness and efficiency of the FPGA, making it suitable for applications where size and space constraints are important considerations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO3L-6900C-5BG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of CLBs:

858

Organization:

858 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

LCMXO3L-6900C-5BG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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