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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2V40-5CSG144I by Xilinx

XC2V40-5CSG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Maximum Clock Frequency: 750 MHz;

FPGA

576

88

88

64

40000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2V40-6CSG144C by Xilinx

XC2V40-6CSG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

88

88

64

40000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2V80-4CSG144C by Xilinx

XC2V80-4CSG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1152

92

92

128

80000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

128 CLBS, 80000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2V80-4CSG144I by Xilinx

XC2V80-4CSG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;

FPGA

1152

92

92

128

80000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

128 CLBS, 80000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2V80-5CSG144C by Xilinx

XC2V80-5CSG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1152

92

92

128

80000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

128 CLBS, 80000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2V80-6CSG144C by Xilinx

XC2V80-6CSG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1152

92

92

128

80000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

128 CLBS, 80000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2S30-5CSG144C by Xilinx

XC2S30-5CSG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

972

92

92

216

30000

263 MHz

0.7 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

Maximum usable gates 30000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Silver Copper

.8 mm

144

S-PBGA-B144

e1

No

XC2S30-5CSG144I by Xilinx

XC2S30-5CSG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

972

92

92

216

30000

263 MHz

0.7 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Silver Copper

.8 mm

144

S-PBGA-B144

e1

No

XC2S30-6CSG144C by Xilinx

XC2S30-6CSG144C

Xilinx

The Xilinx XC2S30-6CSG144C is a FPGA with 972 logic cells, 216 CLBs, and 30000 equivalent gates. It operates at a max clock frequency of 263 MHz and has a max operating temperature of 85°C. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs.

FPGA

972

92

92

216

30000

263 MHz

0.6 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

Maximum usable gates 30000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Silver Copper

.8 mm

144

S-PBGA-B144

e1

No

XC3S50-4CPG132C by Xilinx

XC3S50-4CPG132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

89

89

192

50000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

192 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.5 mm

132

S-PBGA-B132

e1

No

XC3S50-4CPG132I by Xilinx

XC3S50-4CPG132I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE; Maximum Clock Frequency: 630 MHz;

FPGA

1728

89

89

192

50000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

192 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.5 mm

132

S-PBGA-B132

e1

No

XC3S50-5CPG132C by Xilinx

XC3S50-5CPG132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

89

89

192

50000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

192 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.5 mm

132

S-PBGA-B132

e1

No

XC3S250E-4CP132I by Xilinx

XC3S250E-4CP132I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

5508

92

85

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Lead

.5 mm

132

S-PBGA-B132

e0

No

XC3S250E-4CPG132C by Xilinx

XC3S250E-4CPG132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

5508

92

85

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

XC3S250E-4CPG132I by Xilinx

XC3S250E-4CPG132I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

5508

92

85

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

XC3S500E-4CP132I by Xilinx

XC3S500E-4CP132I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

10476

92

85

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Lead

.5 mm

132

S-PBGA-B132

e0

No

XC3S500E-5CPG132C by Xilinx

XC3S500E-5CPG132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

10476

92

85

1164

500000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

LIFCL-40-7MG289C by Lattice Semiconductor

LIFCL-40-7MG289C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 289; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9.5 mm

9.5 mm

1.2 mm

BGA289,17X17,20

Bottom

Ball

.5 mm

289

S-PBGA-B289

LIFCL-40-7MG289I by Lattice Semiconductor

LIFCL-40-7MG289I

Lattice Semiconductor

LIFCL-40-7MG289I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It features 9750 CLBs, 74 inputs/outputs, and operates b/w -40 to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact square grid array package.

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9.5 mm

9.5 mm

1.2 mm

BGA289,17X17,20

Bottom

Ball

.5 mm

289

S-PBGA-B289

LIFCL-40-8MG289C by Lattice Semiconductor

LIFCL-40-8MG289C

Lattice Semiconductor

LIFCL-40-8MG289C by Lattice Semiconductor is a 39000 logic cells FPGA with FDSOI technology. It operates at 0-85°C, has 9750 CLBs, and 74 inputs/outputs. Suitable for applications requiring high-density programmable ICs in compact form factors.

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9.5 mm

9.5 mm

1.2 mm

BGA289,17X17,20

Bottom

Ball

.5 mm

289

S-PBGA-B289

LIFCL-40-8MG289I by Lattice Semiconductor

LIFCL-40-8MG289I

Lattice Semiconductor

LIFCL-40-8MG289I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI tech. It operates at 0.95V to 1.05V, -40°C to 100°C, and has 9750 CLBs, 74 inputs/outputs for industrial applications in a thin profile grid array package.

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9.5 mm

9.5 mm

1.2 mm

BGA289,17X17,20

Bottom

Ball

.5 mm

289

S-PBGA-B289

LIFCL-40-9MG289C by Lattice Semiconductor

LIFCL-40-9MG289C

Lattice Semiconductor

LIFCL-40-9MG289C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It features 9750 CLBs, 74 inputs/outputs, and operates b/w -40 to 85°C. Ideal for applications requiring high-density programmable ICs in a compact grid array package.

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9.5 mm

9.5 mm

1.2 mm

BGA289,17X17,20

Bottom

Ball

.5 mm

289

S-PBGA-B289

LIFCL-40-9MG289I by Lattice Semiconductor

LIFCL-40-9MG289I

Lattice Semiconductor

LIFCL-40-9MG289I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It features 9750 CLBs, 74 inputs/outputs, and operates b/w -40 to 100°C. Ideal for industrial applications requiring high-density programmable ICs in a compact grid array package with 0.5mm terminal pitch.

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9.5 mm

9.5 mm

1.2 mm

BGA289,17X17,20

Bottom

Ball

.5 mm

289

S-PBGA-B289

XC6SLX16-N3CPG196I by Xilinx

XC6SLX16-N3CPG196I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

14579

106

106

1139

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

No

XC7S15-1CPGA196C by Xilinx

XC7S15-1CPGA196C

Xilinx

The Xilinx XC7S15-1CPGA196C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S15-1CPGA196I by Xilinx

XC7S15-1CPGA196I

Xilinx

XC7S15-1CPGA196I by Xilinx is a 12800 logic cell FPGA with 1000 CLBs and 100 inputs/outputs. Operating at up to 1098 MHz, it has a max supply voltage of 1.05 V and combinatorial delay of 1.27 ns. Ideal for industrial applications requiring high-speed processing in compact form factors.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S15-2CPGA196C by Xilinx

XC7S15-2CPGA196C

Xilinx

Xilinx XC7S15-2CPGA196C is a 12800 logic cell FPGA with 1000 CLBs, operating at max frequency of 1286 MHz. Suitable for applications requiring high-speed processing and low power consumption in electronics industry. Features include 0.5 mm terminal pitch, 1.05 ns combinatorial delay, and thin profile grid array package style.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S15-2CPGA196I by Xilinx

XC7S15-2CPGA196I

Xilinx

The Xilinx XC7S15-2CPGA196I is a 12800 logic cell FPGA with 1000 CLBs and 100 inputs/outputs. Operating at up to 1.05V, it offers a max clock frequency of 1286MHz. Ideal for industrial applications requiring high-speed processing in compact form factors.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S15-L1CPGA196I by Xilinx

XC7S15-L1CPGA196I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-1CPGA196C by Xilinx

XC7S6-1CPGA196C

Xilinx

The Xilinx XC7S6-1CPGA196C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-1CPGA196I by Xilinx

XC7S6-1CPGA196I

Xilinx

Xilinx XC7S6-1CPGA196I FPGA features 6000 logic cells, 469 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a grid array package style.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-2CPGA196C by Xilinx

XC7S6-2CPGA196C

Xilinx

XC7S6-2CPGA196C by Xilinx is a 6000 logic cell FPGA with a max clock frequency of 1286 MHz. It is used for applications requiring high-speed processing and programmable logic capabilities.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-2CPGA196I by Xilinx

XC7S6-2CPGA196I

Xilinx

The Xilinx XC7S6-2CPGA196I FPGA features 6000 logic cells, 469 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with fine pitch terminals.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-L1CPGA196I by Xilinx

XC7S6-L1CPGA196I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S15-1CPGA196Q by Xilinx

XC7S15-1CPGA196Q

Xilinx

The Xilinx XC7S15-1CPGA196Q is a 12800 logic cell FPGA with 1000 CLBs, 100 inputs/outputs, and a max clock frequency of 1098 MHz. It operates b/w -40 to 125 °C and is suitable for automotive applications due to its thin profile and fine pitch package style.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Matte Tin

.5 mm

196

S-PBGA-B196

e3

XC7S6-1CPGA196Q by Xilinx

XC7S6-1CPGA196Q

Xilinx

The Xilinx XC7S6-1CPGA196Q is a 6000 logic cell FPGA with 469 CLBs, 100 inputs/outputs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its thin profile, fine pitch grid array package style, and operating temperature range of -40 to 125°C.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Matte Tin

.5 mm

196

S-PBGA-B196

e3

ICE40HX4K-BG121TR by Lattice Semiconductor

ICE40HX4K-BG121TR

Lattice Semiconductor

ICE40HX4K-BG121TR by Lattice Semiconductor is a CMOS FPGA with 440 CLBs, operating at -40 to 100 °C. It has a max supply voltage of 1.26 V and uses PLASTIC/EPOXY material. Ideal for industrial applications requiring high performance in a compact GRID ARRAY package with 0.8 mm terminal pitch.

FPGA

440

CMOS

440 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9 mm

9 mm

1.1 mm

Bottom

Ball

Tin Silver Copper Nickel

.8 mm

121

S-PBGA-B121

e2

ICE40HX4K-BG121 by Lattice Semiconductor

ICE40HX4K-BG121

Lattice Semiconductor

ICE40HX4K-BG121 by Lattice Semiconductor is a 3520 logic cell FPGA with 440 CLBs, operating at max voltage of 1.26V. It features 93 inputs/outputs, 0.8mm terminal pitch, and -40 to 100°C temp range. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

3520

93

93

440

7.3 ns

CMOS

440 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9 mm

9 mm

1.1 mm

Bottom

Ball

Tin Silver Copper Nickel

.8 mm

121

S-PBGA-B121

e2

ICE40HX8K-BG121TR by Lattice Semiconductor

ICE40HX8K-BG121TR

Lattice Semiconductor

ICE40HX8K-BG121TR by Lattice Semiconductor is a CMOS-based FPGA with 7680 logic cells and 960 CLBs. It operates at a nominal voltage of 1.2V and can withstand temperatures up to 100°C. This programmable IC is commonly used in industrial applications requiring high-performance digital logic circuits.

FPGA

7680

93

93

960

7.3 ns

CMOS

960 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9 mm

9 mm

1.1 mm

Bottom

Ball

Tin Silver Copper Nickel

.8 mm

121

S-PBGA-B121

e2

ICE40HX8K-BG121 by Lattice Semiconductor

ICE40HX8K-BG121

Lattice Semiconductor

ICE40HX8K-BG121 by Lattice Semiconductor is a 1.2V FPGA with 7680 logic cells, 960 CLBs, and 93 inputs/outputs. It operates in industrial temperatures (-40 to 100 °C) and uses CMOS technology. Ideal for applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

7680

93

93

960

7.3 ns

CMOS

960 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

9 mm

9 mm

1.1 mm

Bottom

Ball

Tin Silver Copper Nickel

.8 mm

121

S-PBGA-B121

e2

10CL010YM164C6G by Intel

10CL010YM164C6G

Intel

Intel's 10CL010YM164C6G is a FPGA with 645 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. Ideal for applications requiring high-speed data processing in compact electronic systems due to its fine pitch grid array package style.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.2 mm

Bottom

Ball

.5 mm

164

S-PBGA-B164

10CL010YM164C8G by Intel

10CL010YM164C8G

Intel

Intel's 10CL010YM164C8G FPGA features 645 CLBs, operates at 1.15-1.25V, and has a max temp of 85°C. Ideal for applications requiring high-speed data processing in compact spaces due to its thin profile, fine pitch grid array package style with surface mount capability.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.2 mm

Bottom

Ball

.5 mm

164

S-PBGA-B164

10CL010YM164I7G by Intel

10CL010YM164I7G

Intel

Intel's 10CL010YM164I7G FPGA features 645 CLBs, operates at -40 to 100 °C, and has a max supply voltage of 1.25 V. Ideal for industrial applications requiring high performance in a compact form factor with fine pitch grid array package style.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.2 mm

Bottom

Ball

.5 mm

164

S-PBGA-B164

10CL010ZM164I8G by Intel

10CL010ZM164I8G

Intel

Intel's 10CL010ZM164I8G FPGA features 10320 logic cells, 645 CLBs, and 176 inputs/outputs. With a package style of grid array and thin profile, it is ideal for industrial applications requiring high-performance programmable ICs with a wide operating temperature range from -40 to 100°C.

FPGA

10320

176

176

645

645 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.2 mm

BGA164,15X15,20

Bottom

Ball

.5 mm

164

S-PBGA-B164

10CL016YM164C8G by Intel

10CL016YM164C8G

Intel

Intel's 10CL016YM164C8G FPGA features 963 CLBs, operates at 0-85°C, and has a max supply voltage of 1.25V. Ideal for applications requiring high flexibility and programmability in a compact form factor with a package style of GRID ARRAY, THIN PROFILE, FINE PITCH.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.2 mm

Bottom

Ball

.5 mm

164

S-PBGA-B164

10CL016YM164I7G by Intel

10CL016YM164I7G

Intel

Intel 10CL016YM164I7G is a FPGA with 963 CLBs, operating at -40 to 100 °C. It has a max supply voltage of 1.25 V and min of 1.15 V, suitable for industrial applications requiring high performance and programmable ICs in compact form factors with fine pitch grid array package style.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.2 mm

Bottom

Ball

.5 mm

164

S-PBGA-B164

LIF-MDF6000-6KMG80I by Lattice Semiconductor

LIF-MDF6000-6KMG80I

Lattice Semiconductor

LIF-MDF6000-6KMG80I by Lattice Semiconductor is a FPGA with 5936 logic cells, 742 CLBs, and 37 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 1.14-1.26V, and features a grid array package for industrial applications.

FPGA

5936

37

37

742

742 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

7 mm

7 mm

1.2 mm

BGA80,10X10,26

Bottom

Ball

.65 mm

80

S-PBGA-B80