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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCV100-4CS144C by Xilinx

XCV100-4CS144C

Xilinx

Xilinx XCV100-4CS144C FPGA features 2700 logic cells, 600 CLBs, and 108904 gates. Operating at a max frequency of 250 MHz, it's ideal for applications requiring high-speed processing in electronics and telecommunications industries. With a package style of grid array and thin profile, it offers versatile integration options.

FPGA

2700

94

94

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV100-4CS144I by Xilinx

XCV100-4CS144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.2 mm;

FPGA

2700

94

94

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50-4CS144I by Xilinx

XCV50-4CS144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 2.625 V;

FPGA

1728

94

94

384

57906

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50-5CS144C by Xilinx

XCV50-5CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

94

94

384

57906

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50-6CS144C by Xilinx

XCV50-6CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

94

94

384

57906

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV100E-6CS144I by Xilinx

XCV100E-6CS144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

2700

94

94

600

32400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV100E-7CS144C by Xilinx

XCV100E-7CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

2700

94

94

600

32400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50E-6CS144C by Xilinx

XCV50E-6CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

94

94

384

20736

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 20736 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50E-6CS144I by Xilinx

XCV50E-6CS144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

1728

94

94

384

20736

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 20736 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50E-7CS144C by Xilinx

XCV50E-7CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

94

94

384

20736

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 20736 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50E-7CS144I by Xilinx

XCV50E-7CS144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA144,13X13,32;

FPGA

1728

94

94

384

20736

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 20736 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV50E-8CS144C by Xilinx

XCV50E-8CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

94

94

384

20736

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 20736 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XC2S15-5CS144C by Xilinx

XC2S15-5CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

432

96

92

96

15000

263 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XC2S15-6CS144C by Xilinx

XC2S15-6CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

432

96

92

96

15000

263 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

Maximum usable gates 15000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XC2S30-6CS144C by Xilinx

XC2S30-6CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

972

96

92

216

30000

263 MHz

0.6 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

Maximum usable gates 30000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS10XL-4CS144C by Xilinx

XCS10XL-4CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS10XL-5CS144C by Xilinx

XCS10XL-5CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS20XL-4CS144C by Xilinx

XCS20XL-4CS144C

Xilinx

Xilinx XCS20XL-4CS144C FPGA features 400 logic cells, 7000 gates, and a max clock frequency of 217 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and medical devices.

FPGA

400

160

160

400

7000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS20XL-5CS144C by Xilinx

XCS20XL-5CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS30XL-4CS280C by Xilinx

XCS30XL-4CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS30XL-5CS280C by Xilinx

XCS30XL-5CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS40XL-4CS280C by Xilinx

XCS40XL-4CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS40XL-5CS280C by Xilinx

XCS40XL-5CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XC2S15-5CS144I by Xilinx

XC2S15-5CS144I

Xilinx

Xilinx XC2S15-5CS144I FPGA features 432 logic cells, 96 CLBs, and 15000 equivalent gates. Operating at a max clock frequency of 263 MHz, it is ideal for applications requiring high-speed processing in compact designs. With a package style of grid array and thin profile, it offers versatility in various electronic systems.

FPGA

432

96

92

96

15000

263 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XC2S30-5CS144I by Xilinx

XC2S30-5CS144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; No. of Inputs: 96;

FPGA

972

96

92

216

30000

263 MHz

0.7 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XC3S100E-4CPG132C by Xilinx

XC3S100E-4CPG132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

2160

83

72

240

100000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

XC3S100E-4CPG132I by Xilinx

XC3S100E-4CPG132I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

2160

83

72

240

100000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

XC6SLX16-2CPG196C by Xilinx

XC6SLX16-2CPG196C

Xilinx

The Xilinx XC6SLX16-2CPG196C is a FPGA with 14579 logic cells, 1139 CLBs, and 100 inputs/outputs. It operates at max frequency of 667 MHz, suitable for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a package style of grid array and thin profile, it offers versatility in compact designs.

FPGA

14579

100

100

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX16-2CPG196I by Xilinx

XC6SLX16-2CPG196I

Xilinx

Xilinx XC6SLX16-2CPG196I FPGA features 14579 logic cells, 1139 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact package with a grid array style.

FPGA

14579

100

100

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX16-3CPG196C by Xilinx

XC6SLX16-3CPG196C

Xilinx

The Xilinx XC6SLX16-3CPG196C is a FPGA with 14579 logic cells, 1139 CLBs, and 100 inputs/outputs. It operates at max frequency of 862 MHz, suitable for high-speed applications like signal processing and telecommunications due to its low combinatorial delay of 0.21 ns. With a package style of grid array and thin profile, it offers versatile integration options in compact designs.

FPGA

14579

100

100

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX16-3CPG196I by Xilinx

XC6SLX16-3CPG196I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

14579

106

106

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX16-L1CPG196C by Xilinx

XC6SLX16-L1CPG196C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

14579

106

106

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX4-2CPG196C by Xilinx

XC6SLX4-2CPG196C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

3840

100

100

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX4-2CPG196I by Xilinx

XC6SLX4-2CPG196I

Xilinx

Xilinx XC6SLX4-2CPG196I FPGA features 3840 logic cells, 300 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a package style of grid array, thin profile, and fine pitch.

FPGA

3840

100

100

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX4-3CPG196C by Xilinx

XC6SLX4-3CPG196C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

3840

100

100

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX4-3CPG196I by Xilinx

XC6SLX4-3CPG196I

Xilinx

XC6SLX4-3CPG196I by Xilinx is a FPGA with 3840 logic cells, 300 CLBs, and 106 inputs/outputs. Operating at max frequency of 862 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range of -40 to 100°C.

FPGA

3840

106

106

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-2CPG196C by Xilinx

XC6SLX9-2CPG196C

Xilinx

XC6SLX9-2CPG196C by Xilinx is a CMOS-based FPGA with 9152 logic cells and 715 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-performance programmable ICs.

FPGA

9152

100

100

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-2CPG196I by Xilinx

XC6SLX9-2CPG196I

Xilinx

Xilinx XC6SLX9-2CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. It operates at -40 to 100 °C, suitable for industrial applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

9152

100

100

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-3CPG196C by Xilinx

XC6SLX9-3CPG196C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

9152

100

100

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-3CPG196I by Xilinx

XC6SLX9-3CPG196I

Xilinx

The Xilinx XC6SLX9-3CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at temperatures from -40 to 100 °C and is ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

9152

106

106

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-L1CPG196I by Xilinx

XC6SLX9-L1CPG196I

Xilinx

The Xilinx XC6SLX9-L1CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and 100 inputs/outputs. It operates at a voltage range of 0.95V to 1.05V and has a max combinatorial delay of 0.46ns per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

9152

100

100

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XA3S250E-4CPG132Q by Xilinx

XA3S250E-4CPG132Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

5508

92

85

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

AEC-Q100

XC2V250-4CSG144C by Xilinx

XC2V250-4CSG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

3456

92

92

384

250000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2V250-4CSG144I by Xilinx

XC2V250-4CSG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Organization: 384 CLBS, 250000 GATES;

FPGA

3456

92

92

384

250000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2V250-6CSG144C by Xilinx

XC2V250-6CSG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

3456

92

92

384

250000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2V40-4CSG144C by Xilinx

XC2V40-4CSG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

88

88

64

40000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2V40-4CSG144I by Xilinx

XC2V40-4CSG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Organization: 64 CLBS, 40000 GATES;

FPGA

576

88

88

64

40000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No

XC2V40-5CSG144C by Xilinx

XC2V40-5CSG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

88

88

64

40000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

144

S-PBGA-B144

e1

No