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XCV100-4CS144C

Xilinx

XCV100-4CS144C by Xilinx

Xilinx XCV100-4CS144C FPGA features 2700 logic cells, 600 CLBs, and 108904 gates. Operating at a max frequency of 250 MHz, it's ideal for applications requiring high-speed processing in electronics and telecommunications industries. With a package style of grid array and thin profile, it offers versatile integration options.

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Overview

Unleash the power of Xilinx's XCV100-4CS144C Field Programmable Gate Array, a cutting-edge solution that offers unmatched performance and flexibility. With 2700 logic cells and 600 CLBs, this FPGA is designed to meet the demands of today's most complex applications. Whether you're in the aerospace, automotive, or telecommunications industry, this versatile device delivers exceptional value and functionality. Trust Xilinx's expertise in semiconductor manufacturing to bring you a product that combines innovation with reliability. Upgrade your systems with the XCV100-4CS144C and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and reliability, ensuring the FPGA is sturdy and long-lasting.

No. of Logic Cells: 2700

With a high number of logic cells, this FPGA can handle complex calculations and processes efficiently.

Surface Mount: YES

Surface mounting allows for easy installation and saves space on a PCB.

Maximum Supply Voltage: 2.625 V

The FPGA operates efficiently within this specified maximum supply voltage, ensuring optimal performance.

No. of CLBs: 600

Having 600 Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing custom logic functions.

Technology Used: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the FPGA energy-efficient.

No. of Inputs: 94

With 94 input pins, this FPGA can handle a variety of input signals and data.

Package Shape: SQUARE

A square package shape is more space-efficient and allows for easier placement on a PCB.

Form Of Terminal: BALL

Ball terminals enable secure connections and are commonly used for reliable soldering in surface mount applications.

No. of Equivalent Gates: 108904

Having a large number of equivalent gates enables the FPGA to handle complex logic functions and calculations effectively.

Nominal Supply Voltage (V): 2.5

This specified nominal supply voltage provides stable and consistent power to the FPGA for reliable operation.

Power Supplies (V): 1.5/3.3, 2.5

Support for multiple power supply voltages allows for compatibility with various system configurations and requirements.

No. of Terminals: 144

Having 144 terminals provides ample connectivity options for interfacing with external devices and circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for flexible programming and reconfiguration, making it ideal for prototyping and customization.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers high density, compactness, and precision in mounting the FPGA on a PCB.

Minimum Supply Voltage: 2.375 V

Having a specified minimum supply voltage ensures that the FPGA operates reliably within a safe voltage range.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and extended use.

Pitch Of Terminal: 0.8 mm

The small pitch of the terminals allows for high-density mounting and efficient use of PCB space.

Maximum Combinatorial Delay of a CLB: 0.8 ns

A low maximum combinatorial delay ensures fast operation and response times for logic functions within the FPGA.

Organization: 600 CLBS, 108904 GATES

The well-organized structure of 600 CLBs and 108904 gates allows for efficient logic design and implementation in the FPGA.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this FPGA can function reliably even in cold environments.

Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)

Tin/Lead finishing on the terminals ensures good solderability and reliable connections during assembly.

Position Of Terminal: BOTTOM

Bottom terminals enable easier PCB layout and routing, simplifying the overall design process.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the FPGA requires standard handling procedures to prevent moisture-related issues.

Maximum Seated Height: 1.2 mm

The low maximum seated height of the FPGA allows for slim and compact device designs.

Width: 12 mm

With a width of 12mm, this FPGA is suitable for applications with space constraints.

Maximum Clock Frequency: 250 MHz

The high maximum clock frequency of 250 MHz enables fast processing and high-speed operation of the FPGA.

No. of Outputs: 94

With 94 output pins, this FPGA can drive multiple output signals and data efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures proper soldering and reliability during manufacturing processes.

Peak Reflow Temperature °C: 240

A peak reflow temperature of 240°C allows for secure and effective soldering of the FPGA onto the PCB.

Length: 12 mm

With a length of 12mm, this FPGA can fit into compact PCB layouts and designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCV100-4CS144C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

2700

No. of Inputs:

94

No. of Outputs:

94

No. of CLBs:

600

No. of Equivalent Gates:

108904

Maximum Clock Frequency:

250 MHz

CLB Maximum Delay:

0.8 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

600 CLBS, 108904 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies:

1.5/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

240 °C (464 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

12 mm

Width:

12 mm

Maximum Seated Height:

1.2 mm

Package Equivalence Code:

BGA144,13X13,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Pitch:

.8 mm

No. of Terminals:

144

Standards

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XCV100-4CS144C Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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