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10CL010ZM164I8G

Intel

10CL010ZM164I8G by Intel

Intel's 10CL010ZM164I8G FPGA features 10320 logic cells, 645 CLBs, and 176 inputs/outputs. With a package style of grid array and thin profile, it is ideal for industrial applications requiring high-performance programmable ICs with a wide operating temperature range from -40 to 100°C.

Median Price

$20.485

Lifecycle Status

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7

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Mouser Electronics

USA . 338 parts In-Stock

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DigiKey

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VNN

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Digiode

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Ampacity Inc.

Singapore . 1,627 parts In-Stock

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Vigor

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AZTECH Wire

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Microchip USA

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Semicontronic

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Corohmni

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Argo Parts USA

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Overview

Unleash the power of innovation with the 10CL010ZM164I8G by Intel. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Intel offers unmatched quality and reliability in every product. With 10320 logic cells and 645 CLBs, this FPGA provides endless possibilities for customization and optimization. Whether you're working on advanced robotics, IoT devices, or aerospace applications, the 10CL010ZM164I8G delivers exceptional performance and flexibility. Elevate your projects to new heights with Intel's cutting-edge technology, ensuring efficiency and success every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to external elements, making the product suitable for various environments.

No. of Logic Cells: 10320

Having a high number of logic cells allows for complex and advanced programming capabilities, making the FPGA suitable for demanding applications.

Surface Mount: YES

The surface mount feature ensures easy installation and integration into circuit boards, reducing assembly time and effort.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage allows for flexibility in powering the FPGA, accommodating a wide range of voltage requirements.

No. of CLBs: 645

The large number of Configurable Logic Blocks (CLBs) provides versatility in design and customization, making the FPGA suitable for a variety of applications.

No. of Inputs: 176

With a high number of inputs, the FPGA can process multiple signals simultaneously, enhancing its performance in data-intensive tasks.

Package Shape: SQUARE

The square shape of the package offers efficient use of space on circuit boards, optimizing layout and design flexibility.

Form Of Terminal: BALL

The use of ball terminals enables secure connections and efficient heat dissipation, ensuring reliable performance in high-stress environments.

No. of Terminals: 164

With a sufficient number of terminals, the FPGA can accommodate various connections and interfaces, making it versatile for different application requirements.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for flexibility in reprogramming and adapting to changing project requirements, making it a cost-effective choice for prototyping and development.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style promotes efficient signal routing and reduced electrical noise, enhancing the overall performance and reliability of the FPGA.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage requirement enables energy-efficient operation and extends the product's lifespan by reducing power consumption.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance allows the FPGA to operate reliably in harsh environments with elevated temperatures, ensuring long-term performance under stressful conditions.

Pitch Of Terminal: 0.5 mm

The small pitch of the terminals enables compact and space-saving designs, facilitating dense circuit board layouts and increasing overall system integration capabilities.

Organization: 645 CLBS

The organization of 645 Configurable Logic Blocks (CLBs) provides ample resources for designing complex logic functions and algorithms, making the FPGA suitable for high-performance computing tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance allows the FPGA to function reliably in cold environments, ensuring consistent performance in a wide range of temperature conditions.

Position Of Terminal: BOTTOM

The terminal position at the bottom of the package simplifies assembly and maintenance processes, enhancing the product's usability and accessibility during installation and troubleshooting.

Maximum Seated Height: 1.2 mm

The low maximum seated height allows for compact and slim designs, enabling the FPGA to be used in space-constrained applications without sacrificing performance or functionality.

Width: 8 mm

The compact width of the FPGA package enables efficient use of board space and facilitates streamlined circuit board layouts, optimizing system design and integration.

No. of Outputs: 176

The high number of outputs enables the FPGA to drive multiple external devices or circuits simultaneously, making it suitable for applications requiring complex signal processing and control.

Length: 8 mm

The compact length of the FPGA package contributes to space-saving designs and allows for versatile placement on circuit boards, enhancing overall system flexibility and scalability.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures the FPGA can maintain reliable performance in demanding industrial environments, making it suitable for rugged applications that require robust and durable components.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL010ZM164I8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

10320

No. of Inputs:

176

No. of Outputs:

176

No. of CLBs:

645

Organization:

645 CLBS

Additional Features:

-40 to 125 °C range is available as extended industrial

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1.2 mm

Package Equivalence Code:

BGA164,15X15,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

164

Standards

JESD-30 Code:

S-PBGA-B164

Trade Compliance

10CL010ZM164I8G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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