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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2S200-6FGG456C by Xilinx

XC2S200-6FGG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

284

284

1176

200000

263 MHz

0.6 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

XC2S150-5FGG256C by Xilinx

XC2S150-5FGG256C

Xilinx

Xilinx XC2S150-5FGG256C FPGA features 3888 logic cells, 864 CLBs, and 150000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

3888

260

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

Maximum usable gates 150000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S100-5FGG256I by Xilinx

XC2S100-5FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

176

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S150-5FGG256I by Xilinx

XC2S150-5FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S200-5FGG256I by Xilinx

XC2S200-5FGG256I

Xilinx

Xilinx XC2S200-5FGG256I FPGA features 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC solutions. The package style is grid array with a square shape and surface mount capability.

FPGA

5292

284

284

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S200-5FGG456I by Xilinx

XC2S200-5FGG456I

Xilinx

Xilinx XC2S200-5FGG456I FPGA features 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC solutions. The package style is grid array with a square shape and PLASTIC/EPOXY material.

FPGA

5292

284

284

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

XC2S150-6FGG256C by Xilinx

XC2S150-6FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

150000

263 MHz

0.6 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

Maximum usable gates 150000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S100-5FGG256C by Xilinx

XC2S100-5FGG256C

Xilinx

Xilinx XC2S100-5FGG256C FPGA offers 2700 logic cells, 600 CLBs, and 100000 equivalent gates. Ideal for applications requiring high-speed processing with a max clock frequency of 263 MHz. Package style is grid array with plastic/epoxy material, suitable for surface mount configurations.

FPGA

2700

180

176

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S100-6FGG256C by Xilinx

XC2S100-6FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

176

600

100000

263 MHz

0.6 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S50-5FGG256I by Xilinx

XC2S50-5FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

176

176

384

50000

263 MHz

0.7 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2S150-5FGG456C by Xilinx

XC2S150-5FGG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

264

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

Maximum usable gates 150000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

XC2S150-6FGG456C by Xilinx

XC2S150-6FGG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

150000

263 MHz

0.6 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

Maximum usable gates 150000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

XC2S150-5FGG456I by Xilinx

XC2S150-5FGG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

XC2VP30-5FGG676I by Xilinx

XC2VP30-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 30816;

FPGA

30816

416

416

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP30-6FGG676C by Xilinx

XC2VP30-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

416

416

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP30-5FGG676C by Xilinx

XC2VP30-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

416

416

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V3000-4FGG676C by Xilinx

XC2V3000-4FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

32256

484

484

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V3000-4FGG676I by Xilinx

XC2V3000-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B676;

FPGA

32256

484

484

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V3000-5FGG676C by Xilinx

XC2V3000-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

32256

484

484

3584

3000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V3000-5FGG676I by Xilinx

XC2V3000-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

FPGA

32256

484

484

3584

3000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V3000-6FGG676C by Xilinx

XC2V3000-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

32256

484

484

3584

3000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP40-5FGG676C by Xilinx

XC2VP40-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP40-5FGG676I by Xilinx

XC2VP40-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

43632

416

416

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP40-6FGG676C by Xilinx

XC2VP40-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP40-6FGG676I by Xilinx

XC2VP40-6FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

43632

416

416

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP40-7FGG676C by Xilinx

XC2VP40-7FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XA3S1000-4FGG456I by Xilinx

XA3S1000-4FGG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

125 MHz

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

TQFP100,.63SQ

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

AEC-Q100

XA3S1000-4FGG456Q by Xilinx

XA3S1000-4FGG456Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

125 MHz

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

TQFP100,.63SQ

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

AEC-Q100

XC4VFX100-10FF1152C by Xilinx

XC4VFX100-10FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

94896

576

576

10544

1028 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX100-10FF1152I by Xilinx

XC4VFX100-10FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

94896

576

576

10544

1028 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX100-10FF1517C by Xilinx

XC4VFX100-10FF1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

94896

768

576

10544

1028 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin Lead

1 mm

1517

S-PBGA-B1517

e0

No

XC4VFX100-11FF1152C by Xilinx

XC4VFX100-11FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

94896

576

576

10544

1181 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX100-11FF1152I by Xilinx

XC4VFX100-11FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 576;

FPGA

94896

576

576

10544

1181 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX100-11FF1517C by Xilinx

XC4VFX100-11FF1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

94896

768

576

10544

1181 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin Lead

1 mm

1517

S-PBGA-B1517

e0

No

XC4VFX100-11FF1517I by Xilinx

XC4VFX100-11FF1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

94896

768

576

10544

1181 MHz

CMOS

Field Programmable Gate Arrays

10544 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin Lead

1 mm

1517

S-PBGA-B1517

e0

No

XC4VFX12-10FF668I by Xilinx

XC4VFX12-10FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA668,26X26,40;

FPGA

12312

320

320

1368

1028 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VFX140-10FF1517C by Xilinx

XC4VFX140-10FF1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

142128

768

768

15792

1028 MHz

CMOS

Field Programmable Gate Arrays

15792 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin Lead

1 mm

1517

S-PBGA-B1517

e0

No

XC4VFX20-10FF672C by Xilinx

XC4VFX20-10FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

19224

320

320

2136

1028 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX20-10FF672I by Xilinx

XC4VFX20-10FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

19224

320

320

2136

1028 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX20-11FF672C by Xilinx

XC4VFX20-11FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

19224

320

320

2136

1181 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX20-11FF672I by Xilinx

XC4VFX20-11FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

19224

320

320

2136

1181 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX40-10FF1152I by Xilinx

XC4VFX40-10FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 448;

FPGA

41904

448

448

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX40-10FF672C by Xilinx

XC4VFX40-10FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

41904

352

352

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX40-10FF672I by Xilinx

XC4VFX40-10FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

41904

352

352

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX60-10FF1152C by Xilinx

XC4VFX60-10FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

576

576

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX60-10FF1152I by Xilinx

XC4VFX60-10FF1152I

Xilinx

Xilinx XC4VFX60-10FF1152I FPGA features 56880 logic cells, 6320 CLBs, and a max clock frequency of 1028 MHz. Ideal for high-performance applications requiring fast processing speeds in a compact form factor. Suitable for various industries like telecommunications, aerospace, and automotive due to its advanced CMOS technology and programmable nature.

FPGA

56880

576

576

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX60-10FF672C by Xilinx

XC4VFX60-10FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

352

352

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX60-10FF672I by Xilinx

XC4VFX60-10FF672I

Xilinx

XC4VFX60-10FF672I by Xilinx is a FPGA with 56880 logic cells, 6320 CLBs, and 352 inputs/outputs. It operates at max frequency of 1028 MHz and supports industrial temperature range. Ideal for high-performance applications requiring fast processing speeds in compact designs.

FPGA

56880

352

352

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No