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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2VP40-6FG676I by Xilinx

XC2VP40-6FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2VP40-7FG676C by Xilinx

XC2VP40-7FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XA3SD1800A-4FGG676I by Xilinx

XA3SD1800A-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

37440

519

409

4160

37440

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 37440 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

AEC-Q100

XA3SD1800A-4FGG676Q by Xilinx

XA3SD1800A-4FGG676Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

37440

519

409

4160

37440

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 37440 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

AEC-Q100

XA3SD3400A-4FGG676I by Xilinx

XA3SD3400A-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

53712

469

409

5968

53712

667 MHz

CMOS

Field Programmable Gate Arrays

5968 CLBS, 53712 Gates

1.2,1.2/3.3,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

AEC-Q100

XC3S1000-4FG320C by Xilinx

XC3S1000-4FG320C

Xilinx

Xilinx XC3S1000-4FG320C FPGA features 17280 logic cells, 1920 CLBs, and 1M equivalent gates. Operating at a max frequency of 630MHz, it's ideal for high-speed applications like signal processing and telecommunications due to its low combinatorial delay of 0.61ns. With a wide temperature range from 0-85°C, this FPGA offers versatile performance in various environments.

FPGA

17280

221

221

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S1000-5FG320C by Xilinx

XC3S1000-5FG320C

Xilinx

Xilinx XC3S1000-5FG320C FPGA offers 17280 logic cells, 1920 CLBs, and 1M equivalent gates. With a max clock frequency of 725 MHz, it is ideal for high-speed applications like telecommunications and signal processing. Operating temperature range from 0 to 85°C makes it versatile for various environments.

FPGA

17280

221

221

1920

1000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S1500-4FG320I by Xilinx

XC3S1500-4FG320I

Xilinx

The Xilinx XC3S1500-4FG320I FPGA features 29952 logic cells, 3328 CLBs, and a max clock frequency of 630 MHz. Ideal for applications requiring high-speed processing and complex logic functions in a compact form factor.

FPGA

29952

221

221

3328

1500000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S400-4FG320C by Xilinx

XC3S400-4FG320C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

221

221

896

400000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S400-4FG320I by Xilinx

XC3S400-4FG320I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

FPGA

8064

221

221

896

400000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S400-5FG320C by Xilinx

XC3S400-5FG320C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

221

221

896

400000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC2V1000-4BGG575C by Xilinx

XC2V1000-4BGG575C

Xilinx

XC2V1000-4BGG575C by Xilinx is a FPGA with 11520 logic cells, 1280 CLBs, and 1000000 equivalent gates. It operates at max frequency of 650 MHz, suitable for applications requiring high-speed processing like telecommunications and signal processing. With a max supply voltage of 1.575 V, it offers versatile programmability in a compact grid array package.

FPGA

11520

328

328

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1000-4BGG575I by Xilinx

XC2V1000-4BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 328;

FPGA

11520

328

328

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1000-4FGG256C by Xilinx

XC2V1000-4FGG256C

Xilinx

The Xilinx XC2V1000-4FGG256C is a FPGA with 11520 logic cells, 1280 CLBs, and 1000000 equivalent gates. It operates at a max clock frequency of 650 MHz and has a combinatorial delay of 0.44 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in electronic systems.

FPGA

11520

172

172

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-4FGG256I by Xilinx

XC2V1000-4FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

11520

172

172

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-4FGG456C by Xilinx

XC2V1000-4FGG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

324

324

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

456

S-PBGA-B456

e1

No

XC2V1000-4FGG456I by Xilinx

XC2V1000-4FGG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 1280;

FPGA

11520

324

324

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

456

S-PBGA-B456

e1

No

XC2V1000-5BGG575C by Xilinx

XC2V1000-5BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

328

328

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1000-5BGG575I by Xilinx

XC2V1000-5BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

11520

328

328

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1000-5FGG256C by Xilinx

XC2V1000-5FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

172

172

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-5FGG256I by Xilinx

XC2V1000-5FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.425 V;

FPGA

11520

172

172

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-5FGG456C by Xilinx

XC2V1000-5FGG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

324

324

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

456

S-PBGA-B456

e1

No

XC2V1000-5FGG456I by Xilinx

XC2V1000-5FGG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

11520

324

324

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

456

S-PBGA-B456

e1

No

XC2V1000-6BGG575C by Xilinx

XC2V1000-6BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

328

328

1280

1000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1000-6FGG256C by Xilinx

XC2V1000-6FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

172

172

1280

1000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-6FGG456C by Xilinx

XC2V1000-6FGG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

324

324

1280

1000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

456

S-PBGA-B456

e1

No

XC2V1500-4BGG575C by Xilinx

XC2V1500-4BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

392

392

1920

1500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1500-4BGG575I by Xilinx

XC2V1500-4BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.6 mm;

FPGA

17280

392

392

1920

1500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1500-4FGG676C by Xilinx

XC2V1500-4FGG676C

Xilinx

XC2V1500-4FGG676C by Xilinx is a CMOS FPGA with 17280 logic cells and 1920 CLBs. It operates at a max clock frequency of 650 MHz and is commonly used in applications requiring high-performance programmable logic solutions.

FPGA

17280

392

392

1920

1500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V1500-4FGG676I by Xilinx

XC2V1500-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B676;

FPGA

17280

392

392

1920

1500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V1500-5BGG575C by Xilinx

XC2V1500-5BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

392

392

1920

1500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1500-5BGG575I by Xilinx

XC2V1500-5BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Width: 31 mm;

FPGA

17280

392

392

1920

1500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1500-5FGG676C by Xilinx

XC2V1500-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

392

392

1920

1500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V1500-5FGG676I by Xilinx

XC2V1500-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

17280

392

392

1920

1500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V1500-6BGG575C by Xilinx

XC2V1500-6BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

392

392

1920

1500000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1500-6FGG676C by Xilinx

XC2V1500-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

392

392

1920

1500000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V2000-4BGG575C by Xilinx

XC2V2000-4BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

408

408

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V2000-4BGG575I by Xilinx

XC2V2000-4BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

24192

408

408

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V2000-4FGG676C by Xilinx

XC2V2000-4FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

456

456

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V2000-4FGG676I by Xilinx

XC2V2000-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

24192

456

456

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V2000-5BGG575C by Xilinx

XC2V2000-5BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

408

408

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V2000-5BGG575I by Xilinx

XC2V2000-5BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 2688;

FPGA

24192

408

408

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V2000-5FGG676C by Xilinx

XC2V2000-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

456

456

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V2000-5FGG676I by Xilinx

XC2V2000-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

24192

456

456

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V2000-6BGG575C by Xilinx

XC2V2000-6BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

408

408

2688

2000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V2000-6FGG676C by Xilinx

XC2V2000-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

456

456

2688

2000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V250-4FGG256C by Xilinx

XC2V250-4FGG256C

Xilinx

XC2V250-4FGG256C by Xilinx is a FPGA with 3456 logic cells, 384 CLBs, and 250000 equivalent gates. It operates at max frequency of 650 MHz and has 172 inputs/outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

FPGA

3456

172

172

384

250000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V250-4FGG256I by Xilinx

XC2V250-4FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

3456

172

172

384

250000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No