Loading...
Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC4VSX35-12FF668C by Xilinx

XC4VSX35-12FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

34560

448

448

3840

1205 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VSX55-10FF1148C by Xilinx

XC4VSX55-10FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

55296

640

640

6144

1028 MHz

CMOS

Field Programmable Gate Arrays

6144 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VSX55-10FF1148I by Xilinx

XC4VSX55-10FF1148I

Xilinx

XC4VSX55-10FF1148I by Xilinx is a FPGA with 55296 logic cells, 6144 CLBs, and 640 inputs/outputs. Operating at max frequency of 1028 MHz, it's ideal for high-performance applications requiring advanced programmable ICs in compact form factors. The package style is grid array with dimensions of 35mm x 35mm and a low supply voltage range from 1.14V to 1.26V.

FPGA

55296

640

640

6144

1028 MHz

CMOS

Field Programmable Gate Arrays

6144 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VSX55-11FF1148C by Xilinx

XC4VSX55-11FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

55296

640

640

6144

1205 MHz

CMOS

Field Programmable Gate Arrays

6144 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VSX55-11FF1148I by Xilinx

XC4VSX55-11FF1148I

Xilinx

XC4VSX55-11FF1148I by Xilinx is a FPGA with 55296 logic cells, 6144 CLBs, and 640 inputs/outputs. Operating at max clock frequency of 1205 MHz, it's ideal for high-speed applications like signal processing and telecommunications due to its advanced CMOS technology.

FPGA

55296

640

640

6144

1205 MHz

CMOS

Field Programmable Gate Arrays

6144 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VSX55-12FF1148C by Xilinx

XC4VSX55-12FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

55296

640

640

6144

1205 MHz

CMOS

Field Programmable Gate Arrays

6144 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX15-10FF668C by Xilinx

XC4VLX15-10FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

13824

320

320

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX15-10FF668I by Xilinx

XC4VLX15-10FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

13824

320

320

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX15-11FF668C by Xilinx

XC4VLX15-11FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

13824

320

320

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX25-10FF668C by Xilinx

XC4VLX25-10FF668C

Xilinx

XC4VLX25-10FF668C by Xilinx is a FPGA with 24192 logic cells, 2688 CLBs, and 448 inputs/outputs. It operates at max frequency of 1028 MHz and supports CMOS technology. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

24192

448

448

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX25-10FF668I by Xilinx

XC4VLX25-10FF668I

Xilinx

XC4VLX25-10FF668I by Xilinx is a FPGA with 24192 logic cells, 2688 CLBs, and 448 inputs/outputs. Operating at max frequency of 1028 MHz, it's ideal for high-speed applications like telecommunications and signal processing due to its advanced CMOS technology.

FPGA

24192

448

448

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX25-11FF668C by Xilinx

XC4VLX25-11FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX25-11FF668I by Xilinx

XC4VLX25-11FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 24192;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX25-12FF668C by Xilinx

XC4VLX25-12FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC2V1000-4FFG896C by Xilinx

XC2V1000-4FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

1280

1000000

650 MHz

0.44 ns

CMOS

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V1000-4FFG896I by Xilinx

XC2V1000-4FFG896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;

FPGA

1280

1000000

650 MHz

0.44 ns

CMOS

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V1000-5FFG896C by Xilinx

XC2V1000-5FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

1280

1000000

750 MHz

0.39 ns

CMOS

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V1000-6FFG896C by Xilinx

XC2V1000-6FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

1280

1000000

820 MHz

0.35 ns

CMOS

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V1500-4FFG896C by Xilinx

XC2V1500-4FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

1920

1500000

650 MHz

0.44 ns

CMOS

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V1500-6FFG896C by Xilinx

XC2V1500-6FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

1920

1500000

820 MHz

0.35 ns

CMOS

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V2000-4FFG896C by Xilinx

XC2V2000-4FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

624

624

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V2000-5FFG896C by Xilinx

XC2V2000-5FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

624

624

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V2000-5FFG896I by Xilinx

XC2V2000-5FFG896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B896;

FPGA

2688

2000000

750 MHz

0.39 ns

CMOS

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V2000-6FFG896C by Xilinx

XC2V2000-6FFG896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

624

624

2688

2000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

896

S-PBGA-B896

e1

No

XC2V3000-4FFG1152C by Xilinx

XC2V3000-4FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

32256

720

720

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V3000-4FFG1152I by Xilinx

XC2V3000-4FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.5,1.5/3.3,3.3;

FPGA

32256

720

720

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V3000-5FFG1152C by Xilinx

XC2V3000-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

3584

3000000

750 MHz

0.39 ns

CMOS

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V3000-5FFG1152I by Xilinx

XC2V3000-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

3584

3000000

750 MHz

0.39 ns

CMOS

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V3000-6FFG1152C by Xilinx

XC2V3000-6FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

3584

3000000

820 MHz

0.35 ns

CMOS

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-4FFG1152C by Xilinx

XC2V4000-4FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

51840

824

824

5760

4000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-4FFG1152I by Xilinx

XC2V4000-4FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

51840

824

824

5760

4000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-5FFG1152C by Xilinx

XC2V4000-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

51840

824

824

5760

4000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-5FFG1152I by Xilinx

XC2V4000-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Organization: 5760 CLBS, 4000000 GATES;

FPGA

51840

824

824

5760

4000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-6FFG1152C by Xilinx

XC2V4000-6FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

51840

824

824

5760

4000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V4000-6FFG1517C by Xilinx

XC2V4000-6FFG1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

51840

912

912

5760

4000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1517

S-PBGA-B1517

e1

No

XC2V6000-4FFG1152C by Xilinx

XC2V6000-4FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

824

824

8448

6000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V6000-4FFG1152I by Xilinx

XC2V6000-4FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.5;

FPGA

76032

824

824

8448

6000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V6000-4FFG1517C by Xilinx

XC2V6000-4FFG1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

1104

1104

8448

6000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1517

S-PBGA-B1517

e1

No

XC2V6000-4FFG1517I by Xilinx

XC2V6000-4FFG1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

76032

1104

1104

8448

6000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1517

S-PBGA-B1517

e1

No

XC2V6000-5FFG1152C by Xilinx

XC2V6000-5FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

824

824

8448

6000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V6000-5FFG1152I by Xilinx

XC2V6000-5FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Organization: 8448 CLBS, 6000000 GATES;

FPGA

76032

824

824

8448

6000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V6000-5FFG1517C by Xilinx

XC2V6000-5FFG1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

1104

1104

8448

6000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1517

S-PBGA-B1517

e1

No

XC2V6000-5FFG1517I by Xilinx

XC2V6000-5FFG1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

76032

1104

1104

8448

6000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1517

S-PBGA-B1517

e1

No

XC2V6000-6FFG1152C by Xilinx

XC2V6000-6FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

824

824

8448

6000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V6000-6FFG1517C by Xilinx

XC2V6000-6FFG1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

1104

1104

8448

6000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1517

S-PBGA-B1517

e1

No

XC2V8000-4FFG1152C by Xilinx

XC2V8000-4FFG1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

11648

8000000

650 MHz

0.44 ns

CMOS

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V8000-4FFG1152I by Xilinx

XC2V8000-4FFG1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

11648

8000000

650 MHz

0.44 ns

CMOS

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1152

S-PBGA-B1152

e1

No

XC2V8000-4FFG1517C by Xilinx

XC2V8000-4FFG1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

104832

1108

1108

11648

8000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1517

S-PBGA-B1517

e1

No