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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LCMXO3L-6900C-5BG400I by Lattice Semiconductor

LCMXO3L-6900C-5BG400I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

6900

335

335

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

XC3S400A-4FG400C by Xilinx

XC3S400A-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S400A-4FG400I by Xilinx

XC3S400A-4FG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S400A-4FGG400C by Xilinx

XC3S400A-4FGG400C

Xilinx

Xilinx XC3S400A-4FGG400C FPGA features 8064 logic cells, 896 CLBs, and 400000 equivalent gates. With a max clock frequency of 667 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. The package style is grid array with a square shape and plastic/epoxy material.

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S400A-4FGG400I by Xilinx

XC3S400A-4FGG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S400A-5FGG400C by Xilinx

XC3S400A-5FGG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S700A-4FG400C by Xilinx

XC3S700A-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

311

248

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S700A-4FG400I by Xilinx

XC3S700A-4FG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

311

248

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S700A-4FGG400I by Xilinx

XC3S700A-4FGG400I

Xilinx

Xilinx XC3S700A-4FGG400I FPGA features 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. It operates at a max clock frequency of 667 MHz with a combinatorial delay of 0.71 ns per CLB. Ideal for industrial applications requiring high-speed processing and programmable IC solutions.

FPGA

13248

311

248

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S700A-5FGG400C by Xilinx

XC3S700A-5FGG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

311

248

1472

700000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S400AN-4FG400C by Xilinx

XC3S400AN-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S400AN-4FG400I by Xilinx

XC3S400AN-4FG400I

Xilinx

The Xilinx XC3S400AN-4FG400I is a FPGA with 8064 logic cells, 896 CLBs, and 400000 equivalent gates. It operates at max clock frequency of 667 MHz and has a combinatorial delay of 0.71 ns per CLB. Ideal for industrial applications requiring high-speed processing and programmable logic capabilities.

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S400AN-4FGG400I by Xilinx

XC3S400AN-4FGG400I

Xilinx

Xilinx XC3S400AN-4FGG400I FPGA offers 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. The package style is grid array with a square shape and ball terminals, making it suitable for surface mount assembly.

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S400AN-5FGG400C by Xilinx

XC3S400AN-5FGG400C

Xilinx

Xilinx XC3S400AN-5FGG400C is a FPGA with 8064 logic cells, 896 CLBs, and 400000 gates. It operates at max frequency of 770 MHz and has 311 inputs and 248 outputs. Ideal for high-performance applications requiring fast processing speeds in electronics and telecommunications industries.

FPGA

8064

311

248

896

400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XA3S1200E-4FGG400Q by Xilinx

XA3S1200E-4FGG400Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

232

2168

1200000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XA3S1600E-4FGG400I by Xilinx

XA3S1600E-4FGG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

232

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XA3S1600E-4FGG400Q by Xilinx

XA3S1600E-4FGG400Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

232

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XC3S1200E-4FG400C by Xilinx

XC3S1200E-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

232

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S1200E-4FG400I by Xilinx

XC3S1200E-4FG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

132

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S1200E-4FGG400C by Xilinx

XC3S1200E-4FGG400C

Xilinx

XC3S1200E-4FGG400C by Xilinx is a CMOS-based FPGA with 19512 logic cells and 1200000 equivalent gates. It operates at a max clock frequency of 572 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.

FPGA

19512

304

232

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S1200E-4FGG400I by Xilinx

XC3S1200E-4FGG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

132

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S1200E-5FG400C by Xilinx

XC3S1200E-5FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

132

2168

1200000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S1200E-5FGG400C by Xilinx

XC3S1200E-5FGG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

132

2168

1200000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S1600E-4FG400C by Xilinx

XC3S1600E-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

232

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S1600E-4FG400I by Xilinx

XC3S1600E-4FG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

132

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S1600E-4FGG400C by Xilinx

XC3S1600E-4FGG400C

Xilinx

Xilinx XC3S1600E-4FGG400C is a FPGA with 33192 logic cells, 3688 CLBs, and 1600000 equivalent gates. It operates at a max frequency of 572 MHz and has 304 inputs and 232 outputs. Ideal for applications requiring high-speed processing such as telecommunications and networking systems.

FPGA

33192

304

232

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S1600E-4FGG400I by Xilinx

XC3S1600E-4FGG400I

Xilinx

Xilinx XC3S1600E-4FGG400I is a FPGA with 33192 logic cells, 3688 CLBs, and 1600000 equivalent gates. It operates at max frequency of 572 MHz, suitable for industrial applications requiring high-speed processing and programmable ICs in a compact package style.

FPGA

33192

304

132

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S1600E-5FGG400C by Xilinx

XC3S1600E-5FGG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

132

3688

1600000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XA3S400A-4FGG400Q by Xilinx

XA3S400A-4FGG400Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

LCMXO3D-9400HC-5BG400C by Lattice Semiconductor

LCMXO3D-9400HC-5BG400C

Lattice Semiconductor

LCMXO3D-9400HC-5BG400C by Lattice Semiconductor is a FPGA with 9400 logic cells, 1175 CLBs, and 335 inputs/outputs. It operates b/w -40 to 85°C and has a max supply voltage of 3.465V. Ideal for applications requiring high-speed processing in compact designs.

FPGA

9400

335

335

1175

7 ns

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

BGA400,20X20,32

Bottom

Ball

.8 mm

400

S-PBGA-B400

LCMXO3D-9400HC-5BG400I by Lattice Semiconductor

LCMXO3D-9400HC-5BG400I

Lattice Semiconductor

LCMXO3D-9400HC-5BG400I by Lattice Semiconductor is a FPGA with 9400 logic cells, 1175 CLBs, and 335 inputs/outputs. Operating at 2.375V to 3.465V, it's ideal for industrial applications requiring low profile and fine pitch grid array packages.

FPGA

9400

335

335

1175

7 ns

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

BGA400,20X20,32

Bottom

Ball

.8 mm

400

S-PBGA-B400

LCMXO3D-9400HC-6BG400C by Lattice Semiconductor

LCMXO3D-9400HC-6BG400C

Lattice Semiconductor

LCMXO3D-9400HC-6BG400C by Lattice Semiconductor is a FPGA with 9400 logic cells, 1175 CLBs, and 335 inputs/outputs. It operates b/w -40 to 85°C and has a max delay of 6.7 ns per CLB. Ideal for applications requiring high-speed processing in compact spaces.

FPGA

9400

335

335

1175

6.7 ns

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

BGA400,20X20,32

Bottom

Ball

.8 mm

400

S-PBGA-B400

LCMXO3D-9400ZC-2BG400C by Lattice Semiconductor

LCMXO3D-9400ZC-2BG400C

Lattice Semiconductor

LCMXO3D-9400ZC-2BG400C by Lattice Semiconductor is a FPGA with 9400 logic cells, 1175 CLBs, and 335 inputs/outputs. It operates b/w 0-85°C, has a supply voltage range of 2.375-3.465V, and features a grid array package for applications in electronics design and prototyping.

FPGA

9400

335

335

1175

7 ns

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

BGA400,20X20,32

Bottom

Ball

.8 mm

400

S-PBGA-B400

LIFCL-40-7BG400C by Lattice Semiconductor

LIFCL-40-7BG400C

Lattice Semiconductor

LIFCL-40-7BG400C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It has 9750 CLBs, operates at 0-85°C, and supports 74 inputs/outputs. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

BGA400,20X20,32

Bottom

Ball

.8 mm

400

S-PBGA-B400

LIFCL-40-8BG400C by Lattice Semiconductor

LIFCL-40-8BG400C

Lattice Semiconductor

LIFCL-40-8BG400C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It features 9750 CLBs, 74 inputs/outputs, and operates b/w -40 to 85°C. Ideal for applications requiring high-performance computing in compact spaces.

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

BGA400,20X20,32

Bottom

Ball

.8 mm

400

S-PBGA-B400

LIFCL-40-9BG400C by Lattice Semiconductor

LIFCL-40-9BG400C

Lattice Semiconductor

LIFCL-40-9BG400C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates at 0-85°C, has 9750 CLBs, and supports a max supply voltage of 1.05V. Ideal for applications requiring high-performance computing in compact spaces.

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

BGA400,20X20,32

Bottom

Ball

.8 mm

400

S-PBGA-B400

LIFCL-40-9BG400I by Lattice Semiconductor

LIFCL-40-9BG400I

Lattice Semiconductor

LIFCL-40-9BG400I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It has 9750 CLBs, operates at 1.05V, and offers 74 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs in a low-profile grid array package.

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

BGA400,20X20,32

Bottom

Ball

.8 mm

400

S-PBGA-B400

LCMXO3LF-6900C-5BG400C by Lattice Semiconductor

LCMXO3LF-6900C-5BG400C

Lattice Semiconductor

LCMXO3LF-6900C-5BG400C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 400 terminals. Ideal for applications requiring low profile, fine pitch grid arrays in electronics operating b/w 0-85°C.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LCMXO3LF-6900C-5BG400I by Lattice Semiconductor

LCMXO3LF-6900C-5BG400I

Lattice Semiconductor

LCMXO3LF-6900C-5BG400I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 6900 logic cells, 858 CLBs, and 335 inputs/outputs. It operates b/w -40 to 100 °C and has a max supply voltage of 3.465 V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

6900

335

335

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LCMXO3LF-6900C-6BG400C by Lattice Semiconductor

LCMXO3LF-6900C-6BG400C

Lattice Semiconductor

LCMXO3LF-6900C-6BG400C by Lattice Semiconductor is a FPGA with 858 CLBs, operating voltage of 2.375V to 3.465V, and temp range of 0-85°C. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LCMXO3LF-6900C-6BG400I by Lattice Semiconductor

LCMXO3LF-6900C-6BG400I

Lattice Semiconductor

LCMXO3LF-6900C-6BG400I by Lattice Semiconductor is a FPGA with 6900 logic cells, 858 CLBs, and 335 inputs/outputs. It operates b/w -40 to 100 °C and has a package style of GRID ARRAY for applications requiring high-performance programmable ICs in compact form factors.

FPGA

6900

335

335

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LCMXO3L-9400C-5BG400C by Lattice Semiconductor

LCMXO3L-9400C-5BG400C

Lattice Semiconductor

LCMXO3L-9400C-5BG400C by Lattice Semiconductor is a FPGA with 1175 CLBs, operating voltage of 2.375V to 3.465V, and temp range of 0°C to 85°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

T35F400C4 by Efinix

T35F400C4

Efinix

Efinix T35F400C4 FPGA features 31680 logic cells, 230 inputs/outputs, and operates at a max supply voltage of 1.25V. Ideal for applications requiring high-performance computing in compact form factors with a square package and 0.8mm terminal pitch.

FPGA

31680

230

230

SMIC

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Square

16 mm

16 mm

Bottom

Ball

.8 mm

400

S-PBGA-B400

LFMXO5-25-9BBG400I by Lattice Semiconductor

LFMXO5-25-9BBG400I

Lattice Semiconductor

LFMXO5-25-9BBG400I by Lattice Semiconductor is a 25000 Logic Cells FPGA with FDSOI tech. It has 3125 CLBs, 252 inputs/outputs, and operates b/w -40 to 100 °C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

25000

252

252

3125

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

.8 mm

400

S-PBGA-B400

LFMXO5-25-7BBG400C by Lattice Semiconductor

LFMXO5-25-7BBG400C

Lattice Semiconductor

LFMXO5-25-7BBG400C by Lattice Semiconductor is a 25000 Logic Cells FPGA with FDSOI technology. It has 3125 CLBs, 252 Inputs/Outputs, and operates b/w -40 to 85 °C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

25000

252

252

3125

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

.8 mm

400

S-PBGA-B400

LFMXO5-25-8BBG400C by Lattice Semiconductor

LFMXO5-25-8BBG400C

Lattice Semiconductor

LFMXO5-25-8BBG400C by Lattice Semiconductor is a FPGA with 25000 logic cells, FDSOI technology, and 3125 CLBs. It operates at 0-85°C, has 252 inputs/outputs, and uses a grid array package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

25000

252

252

3125

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

.8 mm

400

S-PBGA-B400

LFMXO5-25-8BBG400I by Lattice Semiconductor

LFMXO5-25-8BBG400I

Lattice Semiconductor

LFMXO5-25-8BBG400I by Lattice Semiconductor is a 25000 logic cells FPGA with FDSOI technology. It has 3125 CLBs, 252 inputs/outputs, and operates b/w -40 to 100 °C. Ideal for applications requiring low profile, fine pitch grid array packages in plastic/epoxy material.

FPGA

25000

252

252

3125

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

.8 mm

400

S-PBGA-B400

LFMXO5-25-9BBG400C by Lattice Semiconductor

LFMXO5-25-9BBG400C

Lattice Semiconductor

LFMXO5-25-9BBG400C by Lattice Semiconductor is a 25000 logic cell FPGA with FDSOI technology. It features 3125 CLBs, 252 inputs/outputs, and operates b/w -40 to 85 °C. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

25000

252

252

3125

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

.8 mm

400

S-PBGA-B400