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LFMXO5-25-8BBG400C

Lattice Semiconductor

LFMXO5-25-8BBG400C by Lattice Semiconductor

LFMXO5-25-8BBG400C by Lattice Semiconductor is a FPGA with 25000 logic cells, FDSOI technology, and 3125 CLBs. It operates at 0-85°C, has 252 inputs/outputs, and uses a grid array package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.

Median Price

$85.800

Lifecycle Status

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4

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DigiKey

USA . 60 parts In-Stock

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$69.190

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Nova Conductors

Japan . 100 parts In-Stock

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$79.980

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Vyrian

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AZTECH Wire

Italy . 283 parts In-Stock

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Ampacity Inc.

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Semicontronic

India . 122 parts In-Stock

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$64.642

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Microchip USA

USA . 2,949 parts In-Stock

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Netroflash

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Continental Prestige Electronics

USA . 685 parts In-Stock

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Argo Parts USA

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Overview

Looking to enhance your electronic design projects? Look no further than the LFMXO5-25-8BBG400C FPGA by Lattice Semiconductor. With 25000 logic cells and 3125 CLBs, this versatile programmable IC offers unparalleled flexibility and performance. Whether you're working on IoT devices, automotive applications, or industrial automation, this FPGA delivers the power and efficiency you need. Trust in Lattice Semiconductor's reputation for quality and innovation, and let the LFMXO5-25-8BBG400C take your projects to the next level. Upgrade your designs today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a common and durable material for package bodies, ensuring reliability and longevity.

No. of Logic Cells: 25000

Having 25,000 logic cells provides ample capacity for complex programmable logic designs.

Surface Mount: YES

Surface mount capability makes the FPGA easy to install on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.05 V

Operates at a low maximum supply voltage for power efficiency and reduced heat generation.

No. of CLBs: 3125

With 3,125 configurable logic blocks, this FPGA offers flexibility for designing various digital circuits.

Technology Used: FDSOI

FDSOI technology provides low power consumption and high performance, making the FPGA suitable for battery-powered devices.

No. of Inputs: 252

Having 252 inputs allows for a wide range of external signals to be processed by the FPGA.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The fine pitch of the grid array package style enables high-density mounting on PCBs, ideal for space-constrained applications.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for operation in a wide voltage range, accommodating different power sources.

Maximum Operating Temperature: 85 °C

The FPGA can operate at high temperatures, suitable for industrial and automotive applications.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals enables dense routing of signals, improving signal integrity and reducing signal crosstalk.

Maximum Seated Height: 1.7 mm

The low seated height makes the FPGA suitable for slim and compact electronic devices.

Width: 17 mm

Compact width dimensions allow for efficient use of PCB real estate when integrating the FPGA into a design.

No. of Outputs: 252

Having 252 outputs enables the FPGA to drive multiple external devices or components simultaneously.

Length: 17 mm

The compact length of the FPGA contributes to space-saving designs without compromising on functionality.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFMXO5-25-8BBG400C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

25000

No. of Inputs:

252

No. of Outputs:

252

No. of CLBs:

3125

Technology:

FDSOI

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.7 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

400

Standards

JESD-30 Code:

S-PBGA-B400

Trade Compliance

LFMXO5-25-8BBG400C Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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