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LIFCL-40-7BG400C

Lattice Semiconductor

LIFCL-40-7BG400C by Lattice Semiconductor

LIFCL-40-7BG400C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It has 9750 CLBs, operates at 0-85°C, and supports 74 inputs/outputs. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

Median Price

$57.200

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 90 parts In-Stock

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$56.700

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Arrow

USA . 3 parts In-Stock

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$57.200

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$48.070

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Verical

USA . 3 parts In-Stock

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$57.200

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$48.070

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DigiKey

USA . 133 parts In-Stock

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$63.200

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$50.985

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Nova Conductors

Japan . 71 parts In-Stock

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$48.170

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Vyrian

USA . 8,409 parts In-Stock

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Chip Stock

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AZTECH Wire

Italy . 298 parts In-Stock

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$14.027

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Ampacity Inc.

Singapore . 70 parts In-Stock

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$45.730

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Continental Prestige Electronics

USA . 5,772 parts In-Stock

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$47.207

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Microchip USA

USA . 2,061 parts In-Stock

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$57.950

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$56.950

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$56.450

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$55.950

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$57.950

$56.950

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$55.950

Argo Parts USA

USA . 333 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$47.207

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$45.761

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$44.798

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$47.207

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$44.798

Overview

Unlock endless possibilities with the LIFCL-40-7BG400C by Lattice Semiconductor, a leading manufacturer in Field Programmable Gate Arrays (FPGA). This high-quality product offers 39,000 logic cells and 9,750 CLBs, perfect for a wide range of applications. With a low profile package body material and fine pitch package style, this FPGA provides flexibility and efficiency like never before. Experience unparalleled performance and reliability with the LIFCL-40-7BG400C, setting a new standard in programmable IC technology. Elevate your projects to new heights with this innovative solution from Lattice Semiconductor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FPGA easy to handle and resistant to damage.

No. of Logic Cells: 39000

With a large number of logic cells, this FPGA provides ample resources for complex programmable logic designs.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat generation in the device.

Technology Used: FDSOI

FDSOI technology offers advantages such as improved energy efficiency and higher performance compared to traditional CMOS technologies.

No. of Inputs: 74

Sufficient number of inputs for connecting various external signals and data sources.

Package Shape: SQUARE

Square shape helps in optimizing space on the PCB and facilitates efficient routing of connections.

Form Of Terminal: BALL

Ball terminals provide reliable electrical contacts and are suitable for high-density mounting applications.

No. of Terminals: 400

High number of terminals allows for increased connectivity options and flexibility in circuit design.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage enables operation in low-power applications with reduced energy consumption.

Maximum Operating Temperature: 85 °C

Wide temperature range ensures reliable operation in various environmental conditions.

Pitch Of Terminal: 0.8 mm

Close terminal pitch enables compact packaging and high interconnect density for enhanced functionality.

Minimum Operating Temperature: 0 °C

Operational at low temperatures, making it suitable for a wide range of applications and environments.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the device can withstand a moderate level of moisture exposure during storage and handling.

Maximum Seated Height: 1.7 mm

Low profile design allows for slim integration into compact electronic systems.

Width: 17 mm

Compact width facilitates space-saving placement on PCBs and efficient board layout.

No. of Outputs: 74

A balanced number of outputs for transmitting processed data and signals to external devices.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient and quick soldering processes during assembly and rework.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints and robust mechanical connections.

Length: 17 mm

Optimal length for compact system integration and efficient board layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LIFCL-40-7BG400C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

39000

No. of Inputs:

74

No. of Outputs:

74

No. of CLBs:

9750

Technology:

FDSOI

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.7 mm

Package Equivalence Code:

BGA400,20X20,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

400

Standards

JESD-30 Code:

S-PBGA-B400

Trade Compliance

LIFCL-40-7BG400C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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