Loading...
Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX16-2CPG196C by Xilinx

XC6SLX16-2CPG196C

Xilinx

The Xilinx XC6SLX16-2CPG196C is a FPGA with 14579 logic cells, 1139 CLBs, and 100 inputs/outputs. It operates at max frequency of 667 MHz, suitable for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a package style of grid array and thin profile, it offers versatility in compact designs.

FPGA

14579

100

100

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX16-2CPG196I by Xilinx

XC6SLX16-2CPG196I

Xilinx

Xilinx XC6SLX16-2CPG196I FPGA features 14579 logic cells, 1139 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact package with a grid array style.

FPGA

14579

100

100

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX16-3CPG196C by Xilinx

XC6SLX16-3CPG196C

Xilinx

The Xilinx XC6SLX16-3CPG196C is a FPGA with 14579 logic cells, 1139 CLBs, and 100 inputs/outputs. It operates at max frequency of 862 MHz, suitable for high-speed applications like signal processing and telecommunications due to its low combinatorial delay of 0.21 ns. With a package style of grid array and thin profile, it offers versatile integration options in compact designs.

FPGA

14579

100

100

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX16-3CPG196I by Xilinx

XC6SLX16-3CPG196I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

14579

106

106

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX16-L1CPG196C by Xilinx

XC6SLX16-L1CPG196C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

14579

106

106

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX4-2CPG196C by Xilinx

XC6SLX4-2CPG196C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

3840

100

100

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX4-2CPG196I by Xilinx

XC6SLX4-2CPG196I

Xilinx

Xilinx XC6SLX4-2CPG196I FPGA features 3840 logic cells, 300 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a package style of grid array, thin profile, and fine pitch.

FPGA

3840

100

100

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX4-3CPG196C by Xilinx

XC6SLX4-3CPG196C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

3840

100

100

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX4-3CPG196I by Xilinx

XC6SLX4-3CPG196I

Xilinx

XC6SLX4-3CPG196I by Xilinx is a FPGA with 3840 logic cells, 300 CLBs, and 106 inputs/outputs. Operating at max frequency of 862 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range of -40 to 100°C.

FPGA

3840

106

106

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-2CPG196C by Xilinx

XC6SLX9-2CPG196C

Xilinx

XC6SLX9-2CPG196C by Xilinx is a CMOS-based FPGA with 9152 logic cells and 715 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-performance programmable ICs.

FPGA

9152

100

100

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-2CPG196I by Xilinx

XC6SLX9-2CPG196I

Xilinx

Xilinx XC6SLX9-2CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. It operates at -40 to 100 °C, suitable for industrial applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

9152

100

100

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-3CPG196C by Xilinx

XC6SLX9-3CPG196C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

9152

100

100

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-3CPG196I by Xilinx

XC6SLX9-3CPG196I

Xilinx

The Xilinx XC6SLX9-3CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at temperatures from -40 to 100 °C and is ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

9152

106

106

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-L1CPG196I by Xilinx

XC6SLX9-L1CPG196I

Xilinx

The Xilinx XC6SLX9-L1CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and 100 inputs/outputs. It operates at a voltage range of 0.95V to 1.05V and has a max combinatorial delay of 0.46ns per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

9152

100

100

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX16-N3CPG196I by Xilinx

XC6SLX16-N3CPG196I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

14579

106

106

1139

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

No

XC7S15-1CPGA196C by Xilinx

XC7S15-1CPGA196C

Xilinx

The Xilinx XC7S15-1CPGA196C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S15-1CPGA196I by Xilinx

XC7S15-1CPGA196I

Xilinx

XC7S15-1CPGA196I by Xilinx is a 12800 logic cell FPGA with 1000 CLBs and 100 inputs/outputs. Operating at up to 1098 MHz, it has a max supply voltage of 1.05 V and combinatorial delay of 1.27 ns. Ideal for industrial applications requiring high-speed processing in compact form factors.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S15-2CPGA196C by Xilinx

XC7S15-2CPGA196C

Xilinx

Xilinx XC7S15-2CPGA196C is a 12800 logic cell FPGA with 1000 CLBs, operating at max frequency of 1286 MHz. Suitable for applications requiring high-speed processing and low power consumption in electronics industry. Features include 0.5 mm terminal pitch, 1.05 ns combinatorial delay, and thin profile grid array package style.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S15-2CPGA196I by Xilinx

XC7S15-2CPGA196I

Xilinx

The Xilinx XC7S15-2CPGA196I is a 12800 logic cell FPGA with 1000 CLBs and 100 inputs/outputs. Operating at up to 1.05V, it offers a max clock frequency of 1286MHz. Ideal for industrial applications requiring high-speed processing in compact form factors.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S15-L1CPGA196I by Xilinx

XC7S15-L1CPGA196I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-1CPGA196C by Xilinx

XC7S6-1CPGA196C

Xilinx

The Xilinx XC7S6-1CPGA196C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-1CPGA196I by Xilinx

XC7S6-1CPGA196I

Xilinx

Xilinx XC7S6-1CPGA196I FPGA features 6000 logic cells, 469 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a grid array package style.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-2CPGA196C by Xilinx

XC7S6-2CPGA196C

Xilinx

XC7S6-2CPGA196C by Xilinx is a 6000 logic cell FPGA with a max clock frequency of 1286 MHz. It is used for applications requiring high-speed processing and programmable logic capabilities.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-2CPGA196I by Xilinx

XC7S6-2CPGA196I

Xilinx

The Xilinx XC7S6-2CPGA196I FPGA features 6000 logic cells, 469 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with fine pitch terminals.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S6-L1CPGA196I by Xilinx

XC7S6-L1CPGA196I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e1

XC7S15-1CPGA196Q by Xilinx

XC7S15-1CPGA196Q

Xilinx

The Xilinx XC7S15-1CPGA196Q is a 12800 logic cell FPGA with 1000 CLBs, 100 inputs/outputs, and a max clock frequency of 1098 MHz. It operates b/w -40 to 125 °C and is suitable for automotive applications due to its thin profile and fine pitch package style.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Matte Tin

.5 mm

196

S-PBGA-B196

e3

XC7S15-1FTGB196C by Xilinx

XC7S15-1FTGB196C

Xilinx

The Xilinx XC7S15-1FTGB196C is a 12800 logic cell FPGA with 1000 CLBs and 100 inputs/outputs. Operating at up to 1098 MHz, it has a combinatorial delay of 1.27 ns and supports a max supply voltage of 1.05 V. Ideal for applications requiring high-speed processing in compact form factors like telecommunications equipment and industrial automation systems.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S15-1FTGB196Q by Xilinx

XC7S15-1FTGB196Q

Xilinx

The Xilinx XC7S15-1FTGB196Q is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and wide operating temperature range from -40°C to 125°C.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S15-2FTGB196C by Xilinx

XC7S15-2FTGB196C

Xilinx

Xilinx XC7S15-2FTGB196C FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. Package style: GRID ARRAY, LOW PROFILE, FINE PITCH.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S15-2FTGB196I by Xilinx

XC7S15-2FTGB196I

Xilinx

The Xilinx XC7S15-2FTGB196I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and low power consumption. The package style is grid array, low profile, fine pitch with matte tin finishing for optimal performance.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S15-L1FTGB196I by Xilinx

XC7S15-L1FTGB196I

Xilinx

Xilinx XC7S15-L1FTGB196I FPGA offers 12800 logic cells, 1000 CLBs, and 100 inputs. Ideal for industrial applications requiring high combinatorial delay tolerance and operating temperatures ranging from -40 to 100°C. Package style: grid array, with matte tin finishing on bottom terminals.

FPGA

12800

100

100

1000

1.27 ns

1000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-1FTGB196C by Xilinx

XC7S25-1FTGB196C

Xilinx

Xilinx XC7S25-1FTGB196C is a 23360 logic cell FPGA with 1825 CLBs, 150 inputs/outputs, and max clock freq of 1098 MHz. Ideal for high-speed applications requiring low power consumption and compact design. Package style: grid array, low profile, fine pitch.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-1FTGB196Q by Xilinx

XC7S25-1FTGB196Q

Xilinx

Xilinx XC7S25-1FTGB196Q is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. Ideal for automotive applications due to its low profile grid array package and wide temperature range (-40 to 125 °C).

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-2FTGB196I by Xilinx

XC7S25-2FTGB196I

Xilinx

Xilinx XC7S25-2FTGB196I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-L1FTGB196I by Xilinx

XC7S25-L1FTGB196I

Xilinx

The Xilinx XC7S25-L1FTGB196I is a FPGA with 23360 logic cells, 1825 CLBs, and operates at a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its low profile grid array package style.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-1FTGB196C by Xilinx

XC7S50-1FTGB196C

Xilinx

Xilinx XC7S50-1FTGB196C FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-1FTGB196I by Xilinx

XC7S50-1FTGB196I

Xilinx

XC7S50-1FTGB196I by Xilinx is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing, it operates b/w -40 to 100 °C with low profile grid array packaging.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-1FTGB196Q by Xilinx

XC7S50-1FTGB196Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-2FTGB196C by Xilinx

XC7S50-2FTGB196C

Xilinx

Xilinx XC7S50-2FTGB196C FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, networking devices, and industrial automation systems.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-2FTGB196I by Xilinx

XC7S50-2FTGB196I

Xilinx

Xilinx XC7S50-2FTGB196I FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 1mm pitch terminals.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-L1FTGB196I by Xilinx

XC7S50-L1FTGB196I

Xilinx

Xilinx XC7S50-L1FTGB196I FPGA features 52160 logic cells, 4075 CLBs, and 100 inputs/outputs. With a max supply voltage of 0.98V and operating temperature range of -40 to 100°C, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The package style is grid array with matte tin finishing on bottom terminals.

FPGA

52160

100

100

4075

1.27 ns

4075 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S6-1CPGA196Q by Xilinx

XC7S6-1CPGA196Q

Xilinx

The Xilinx XC7S6-1CPGA196Q is a 6000 logic cell FPGA with 469 CLBs, 100 inputs/outputs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its thin profile, fine pitch grid array package style, and operating temperature range of -40 to 125°C.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Matte Tin

.5 mm

196

S-PBGA-B196

e3

XC7S6-1FTGB196Q by Xilinx

XC7S6-1FTGB196Q

Xilinx

The Xilinx XC7S6-1FTGB196Q is a FPGA with 6000 logic cells, 469 CLBs, and operates at a max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and wide temperature range from -40°C to 125°C.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S6-2FTGB196C by Xilinx

XC7S6-2FTGB196C

Xilinx

The Xilinx XC7S6-2FTGB196C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S6-2FTGB196I by Xilinx

XC7S6-2FTGB196I

Xilinx

Xilinx XC7S6-2FTGB196I FPGA offers 6000 logic cells, 469 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style is grid array, low profile, fine pitch.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

LFD2NX-40-9BG196C by Lattice Semiconductor

LFD2NX-40-9BG196C

Lattice Semiconductor

LFD2NX-40-9BG196C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w 0-85°C, has 92 inputs/outputs, and uses a plastic/epoxy package. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

39000

92

92

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Square

12 mm

12 mm

Bottom

Ball

.8 mm

196

S-PBGA-B196

LFD2NX-40-8BG196I by Lattice Semiconductor

LFD2NX-40-8BG196I

Lattice Semiconductor

LFD2NX-40-8BG196I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 92 inputs/outputs, and uses 0.95-1.05 V supply voltage. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package with 196 terminals.

FPGA

39000

92

92

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Square

12 mm

12 mm

Bottom

Ball

.8 mm

196

S-PBGA-B196

LFD2NX-40-7BG196C by Lattice Semiconductor

LFD2NX-40-7BG196C

Lattice Semiconductor

LFD2NX-40-7BG196C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w 0-85 °C, has 92 inputs/outputs, and uses 0.95-1.05 V supply voltage. Ideal for applications requiring high-performance programmable ICs in a compact square package with surface mount capability.

FPGA

39000

92

92

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Square

12 mm

12 mm

Bottom

Ball

.8 mm

196

S-PBGA-B196