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Micron Technology Other Function uPs,uCs & Peripheral ICs 11

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MTFC8GACAANA-4MIT by Micron Technology

MTFC8GACAANA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;

e1

260

CMOS

TIN SILVER COPPER

30

MICROPROCESSOR CIRCUIT

MTFC32GJVED-4MIT by Micron Technology

MTFC32GJVED-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: VFBGA; Package Shape: RECTANGULAR;

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

MTFC4GMVEA-4MIT by Micron Technology

MTFC4GMVEA-4MIT

Micron Technology

MTFC4GMVEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V, making it ideal for INDUSTRIAL applications requiring high performance in a compact GRID ARRAY package style.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B153

e1

13 mm

153

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

11.5 mm

MICROPROCESSOR CIRCUIT

MTFC64GJVDN-4MIT by Micron Technology

MTFC64GJVDN-4MIT

Micron Technology

MTFC64GJVDN-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.65V to 1.95V. This low profile, fine pitch GRID ARRAY package is ideal for industrial applications requiring high performance uPs and uCs.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.4 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

MTFC8GLVEA-4MIT by Micron Technology

MTFC8GLVEA-4MIT

Micron Technology

MTFC8GLVEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.65V to 1.95V. This IC has 153 terminals in a GRID ARRAY package suitable for industrial applications.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B153

e1

13 mm

153

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

11.5 mm

MICROPROCESSOR CIRCUIT

MTFC16GJDDQ-4MIT by Micron Technology

MTFC16GJDDQ-4MIT

Micron Technology

MTFC16GJDDQ-4MIT by Micron Technology is a rectangular, surface mount microprocessor circuit with 100 terminals. It operates at a voltage range of 2.7V to 3.6V and can withstand temperatures from -40°C to 85°C. This industrial-grade IC is suitable for various applications requiring low-profile, high-performance computing.

R-PBGA-B100

e1

18 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

260

1.4 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

14 mm

MICROPROCESSOR CIRCUIT

MTFC4GLDDQ-4MIT by Micron Technology

MTFC4GLDDQ-4MIT

Micron Technology

MTFC4GLDDQ-4MIT by Micron Technology is a CMOS MICROPROCESSOR CIRCUIT with 100 terminals in a GRID ARRAY, LOW PROFILE package. It operates b/w -40 to 85 °C with supply voltage range of 2.7V to 3.6V, making it ideal for industrial applications requiring high performance and reliability.

R-PBGA-B100

e1

18 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

260

1.4 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

14 mm

MICROPROCESSOR CIRCUIT

MTFC8GLDDQ-4MIT by Micron Technology

MTFC8GLDDQ-4MIT

Micron Technology

MTFC8GLDDQ-4MIT by Micron Technology is a CMOS MICROPROCESSOR CIRCUIT with 100 terminals in a GRID ARRAY, LOW PROFILE package. It operates b/w -40 to 85 °C with supply voltage range of 2.7V to 3.6V, making it ideal for industrial applications requiring high performance and reliability.

R-PBGA-B100

e1

18 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

260

1.4 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

14 mm

MICROPROCESSOR CIRCUIT

MTFC32GJDED-4MIT by Micron Technology

MTFC32GJDED-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: VFBGA; Package Shape: RECTANGULAR;

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

MTFC64GJDDN-4MIT by Micron Technology

MTFC64GJDDN-4MIT

Micron Technology

MTFC64GJDDN-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V, making it ideal for industrial applications requiring low profile, fine pitch GRID ARRAY package style.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.4 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

MTFC8GLDEA-4MIT by Micron Technology

MTFC8GLDEA-4MIT

Micron Technology

MTFC8GLDEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V. The package style is GRID ARRAY, very thin profile, fine pitch, making it suitable for industrial applications requiring high performance in compact spaces.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B153

e1

13 mm

153

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

11.5 mm

MICROPROCESSOR CIRCUIT