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BGA Microprocessors 136

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
66AK2H14BAAW24 by Texas Instruments

66AK2H14BAAW24

Texas Instruments

The Texas Instruments 66AK2H14BAAW24 microprocessor features a 64-bit external data bus width, integrated cache, and low power mode. Ideal for applications requiring high-speed processing in a compact form factor with a max operating temperature of 85°C.

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1400 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H14BAAWA24 by Texas Instruments

66AK2H14BAAWA24

Texas Instruments

The Texas Instruments 66AK2H14BAAWA24 microprocessor features a 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for applications requiring high-speed processing and low power consumption. Suitable for use in various electronic devices due to its compact square package shape and grid array style with 1517 terminals.

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1400 rpm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H14BXAAW24 by Texas Instruments

66AK2H14BXAAW24

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1400 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

AM3358BGCZA80EP by Texas Instruments

AM3358BGCZA80EP

Texas Instruments

AM3358BGCZA80EP by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. Operating at speeds up to 800 rpm, it is ideal for industrial applications requiring low power mode and boundary scan capability. With a temperature range of -40 to 105 °C, this CMOS technology processor offers high performance in a grid array package.

28

32

YES

16

FIXED POINT

YES

S-PBGA-B324

e0

YES

3

324

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

220

800 rpm

1.144 V

1.056 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN LEAD

BALL

BOTTOM

20

MICROPROCESSOR, RISC

MPC8535AVJANGA by NXP Semiconductors

MPC8535AVJANGA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

16

32

YES

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

90 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.76 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

MPC8535BVJANGA by NXP Semiconductors

MPC8535BVJANGA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

16

32

YES

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.76 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

T4240NSE7PQB by NXP Semiconductors

T4240NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NSE7TTB by NXP Semiconductors

T4240NSE7TTB

NXP Semiconductors

NXP Semiconductors T4240NSE7TTB microprocessor features 64-bit external data bus, 16-bit address bus, and integrated cache. Ideal for applications requiring high processing speed and low power consumption. Package style is grid array with 1932 terminals in a square shape measuring 45mm x 45mm.

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NSN7PQB by NXP Semiconductors

T4240NSN7PQB

NXP Semiconductors

The NXP Semiconductors T4240NSN7PQB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and a max clock frequency of 133.3 MHz. Ideal for applications requiring high-speed processing such as networking equipment, servers, and industrial automation systems.

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NSN7QTB by NXP Semiconductors

T4240NSN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1667 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NSN7TTB by NXP Semiconductors

T4240NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NXE7PQB by NXP Semiconductors

T4240NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4240NXN7PQB by NXP Semiconductors

T4240NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Length: 45 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSE7PQB by NXP Semiconductors

T4241NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 64;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSE7QTB by NXP Semiconductors

T4241NSE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1667 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSE7TTB by NXP Semiconductors

T4241NSE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSN7PQB by NXP Semiconductors

T4241NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSN7QTB by NXP Semiconductors

T4241NSN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1667 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NSN7TTB by NXP Semiconductors

T4241NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXE7PQB by NXP Semiconductors

T4241NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXE7QTB by NXP Semiconductors

T4241NXE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Speed: 1667 rpm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1667 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXE7TTB by NXP Semiconductors

T4241NXE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.055 V;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXN7PQB by NXP Semiconductors

T4241NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1500 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXN7QTB by NXP Semiconductors

T4241NXN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Speed: 1667 rpm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1667 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4241NXN7TTB by NXP Semiconductors

T4241NXN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

3.33 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

AM5718AZBOXEM by Texas Instruments

AM5718AZBOXEM

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: MILITARY; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: SQUARE;

ALSO OPERATES AT 0.85 V TO 1.15 V AFTER AVS ENABLED

16

YES

32 MHz

32

FIXED POINT

NO

S-PBGA-B760

e0

23 mm

YES

3

1

760

8

125 Cel

-55 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

524288

AEC-Q100

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

MILITARY

TIN LEAD

BALL

BOTTOM

23 mm

MICROPROCESSOR, RISC

66AK2H05DAAW2 by Texas Instruments

66AK2H05DAAW2

Texas Instruments

The Texas Instruments 66AK2H05DAAW2 microprocessor features a max supply voltage of 1.05V, operating temperature range of 0-85°C, and terminal pitch of 1mm. Ideal for applications requiring high-performance computing in compact spaces with its rectangular package style and grid array shape.

R-PBGA-B1517

e1

40 mm

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

P1012NXE2HFB by NXP Semiconductors

P1012NXE2HFB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B689

e2

31 mm

YES

3

689

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.46 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

31 mm

MICROPROCESSOR, RISC

P5010NXN7TNB,557 by NXP Semiconductors

P5010NXN7TNB,557

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;

16

YES

166 MHz

64

FIXED POINT

YES

S-PBGA-B1295

37.5 mm

YES

1295

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3.53 mm

1800 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

BALL

1 mm

BOTTOM

37.5 mm

MICROPROCESSOR, RISC

P5020NSN1QMB,557 by NXP Semiconductors

P5020NSN1QMB,557

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

16

YES

166 MHz

64

FIXED POINT

YES

S-PBGA-B1295

37.5 mm

YES

1295

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3.53 mm

1600 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

BALL

1 mm

BOTTOM

37.5 mm

MICROPROCESSOR, RISC

P5020NXN7QMB,557 by NXP Semiconductors

P5020NXN7QMB,557

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;

16

YES

166 MHz

64

FIXED POINT

YES

S-PBGA-B1295

37.5 mm

YES

1295

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3.53 mm

1600 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

BALL

1 mm

BOTTOM

37.5 mm

MICROPROCESSOR, RISC

T2080NXE8MQLB by NXP Semiconductors

T2080NXE8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

64

NO

FIXED POINT

YES

S-PBGA-B896

NO

3

896

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA896(UNSPEC)

SQUARE

GRID ARRAY

250

1200 rpm

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

30

MICROPROCESSOR, RISC

T2080NXN8P1B by NXP Semiconductors

T2080NXN8P1B

NXP Semiconductors

T2080NXN8P1B by NXP Semiconductors is a 64-bit microprocessor with integrated cache. It is surface mountable and has 896 terminals in a grid array package style. This industrial-grade processor operates at temperatures ranging from -40 to 105°C and is suitable for various applications requiring high-speed processing.

64

NO

FIXED POINT

YES

S-PBGA-B896

e1

NO

3

896

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA896(UNSPEC)

SQUARE

GRID ARRAY

250

1533 rpm

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR, RISC

OSD3358-512M-IND by Octavo Systems

OSD3358-512M-IND

Octavo Systems

OSD3358-512M-IND by Octavo Systems is a microprocessor with 8-bit RAM and 28-bit address bus. It features a grid array package, operates in industrial temperature range (-40 to 85 °C), and has a supply voltage of 1.1V. Ideal for applications requiring high-speed processing in compact spaces.

64kbytes shared l3 ram also available

28

YES

16

FIXED POINT

NO

S-PBGA-B400

27 mm

NO

4

1

400

8

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,50

SQUARE

GRID ARRAY

245

65536

2.6 mm

1000 rpm

2000 mA

1.1 V

YES

CMOS

INDUSTRIAL

BALL

1.27 mm

BOTTOM

27 mm

MICROPROCESSOR, RISC

LX2080SC72029B by NXP Semiconductors

LX2080SC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SN71826B by NXP Semiconductors

LX2080SN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XC71826B by NXP Semiconductors

LX2080XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XC72029B by NXP Semiconductors

LX2080XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XE72232B by NXP Semiconductors

LX2080XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XN72029B by NXP Semiconductors

LX2080XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SN71826B by NXP Semiconductors

LX2120SN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SN72029B by NXP Semiconductors

LX2120SN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XC72029B by NXP Semiconductors

LX2120XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XN71826B by NXP Semiconductors

LX2120XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XN72029B by NXP Semiconductors

LX2120XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SC72029B by NXP Semiconductors

LX2160SC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SC72232B by NXP Semiconductors

LX2160SC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XE71826B by NXP Semiconductors

LX2160XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC