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Infineon Technologies Flash Memory 201

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
S26HL02GTFGBHM040 by Infineon Technologies

S26HL02GTFGBHM040

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Maximum Supply Voltage (Vsup): 3.6 V;

133 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

125 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HL02GTFGBHM043 by Infineon Technologies

S26HL02GTFGBHM043

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM; Moisture Sensitivity Level (MSL): 3;

133 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

125 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHB053 by Infineon Technologies

S26HS02GTFPBHB053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; Package Style (Meter): GRID ARRAY;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS02GTFPBHV053 by Infineon Technologies

S28HS02GTFPBHV053

Infineon Technologies

S28HS02GTFPBHV053 by Infineon Technologies is a NOR type Flash Memory with 2GX1 organization and 166 MHz clock frequency. Operating at -40 to 105 °C, it has a memory density of 2147483648 bits. Suitable for applications requiring high-speed synchronous operation in electronic devices.

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHV033 by Infineon Technologies

S28HS01GTGZBHV033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Memory Density: 1073741824 bit; Organization: 1GX1;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

105 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHM050 by Infineon Technologies

S26HS02GTFPBHM050

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; Maximum Clock Frequency (fCLK): 166 MHz;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

125 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHB033 by Infineon Technologies

S28HS01GTGZBHB033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Organization: 1GX1; JESD-30 Code: S-PBGA-B24; Technology: CMOS;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

3

1

24

1073741824 words

SYNCHRONOUS

105 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

GRID ARRAY

1.8

AEC-Q100

SPI

2 V

1.7 V

1.8

CMOS

BOTTOM

NOR TYPE

S28HS01GTGZBHV030 by Infineon Technologies

S28HS01GTGZBHV030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Maximum Supply Voltage (Vsup): 2 V;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

105 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHM033 by Infineon Technologies

S28HS01GTGZBHM033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Screening Level: AEC-Q100; Serial Bus Type: SPI;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

125 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHM030 by Infineon Technologies

S28HS01GTGZBHM030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM; Package Style (Meter): GRID ARRAY;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

125 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHI033 by Infineon Technologies

S28HS01GTGZBHI033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY; Maximum Clock Frequency (fCLK): 200 MHz;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHM043 by Infineon Technologies

S26HS02GTFPBHM043

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Programming Voltage (V): 1.8; No. of Functions: 1;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

125 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHM040 by Infineon Technologies

S26HS02GTFPBHM040

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Screening Level: AEC-Q100;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

125 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHA033 by Infineon Technologies

S28HS01GTGZBHA033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 2 V; Memory Density: 1073741824 bit;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHB030 by Infineon Technologies

S28HS01GTGZBHB030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM; Serial Bus Type: SPI;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

105 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

SPI

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHI030 by Infineon Technologies

S28HS01GTGZBHI030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Memory Width: 1; Operating Mode: SYNCHRONOUS;

200 MHz

S-PBGA-B24

1073741824 bit

FLASH

1

3

1

24

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

SPI

2 V

1.7 V

1.8

YES

CMOS

BOTTOM

NOR TYPE

S25HS02GTFABHV150 by Infineon Technologies

S25HS02GTFABHV150

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 1.8; Terminal Form: BALL;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHB043 by Infineon Technologies

S26HS02GTFPBHB043

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Memory Width: 1; Minimum Operating Temperature: -40 Cel;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHB050 by Infineon Technologies

S26HS02GTFPBHB050

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Memory Density: 2147483648 bit;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HL02GTFGBHB053 by Infineon Technologies

S26HL02GTFGBHB053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES; Programming Voltage (V): 3;

133 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HS02GTFPBHB040 by Infineon Technologies

S26HS02GTFPBHB040

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 1.8; Memory Density: 2147483648 bit;

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S26HL02GTFGBHB040 by Infineon Technologies

S26HL02GTFGBHB040

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency (fCLK): 133 MHz; Maximum Operating Temperature: 105 Cel;

133 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS02GTFPBHV050 by Infineon Technologies

S28HS02GTFPBHV050

Infineon Technologies

S28HS02GTFPBHV050 by Infineon Technologies is a NOR type Flash Memory with 2GX1 organization, operating at up to 166 MHz clock frequency. It has a memory density of 2147483648 bits and operates on a nominal voltage of 1.8V. This synchronous flash memory is suitable for applications requiring high-speed data storage and retrieval in electronic devices.

166 MHz

S-PBGA-B24

2147483648 bit

FLASH

1

3

1

24

2147483648 words

2G

SYNCHRONOUS

105 Cel

-40 Cel

2GX1

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

NOR TYPE

S28HS01GTGZBHA030 by Infineon Technologies

S28HS01GTGZBHA030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Output Characteristics: 3-STATE; Minimum Operating Temperature: -40 Cel;

200 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

3-STATE

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00016 Amp

173 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TDPBHB013 by Infineon Technologies

S25HS512TDPBHB013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Package Equivalence Code: BGA24,5X5,40; Maximum Seated Height: 1 mm;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TDPBHI013 by Infineon Technologies

S25HS512TDPBHI013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Surface Mount: YES;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TDSBHV013 by Infineon Technologies

S25HS512TDSBHV013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 2 V; Terminal Pitch: 1 mm;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TFABHV013 by Infineon Technologies

S25HS512TFABHV013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Serial Bus Type: SPI; Maximum Supply Voltage (Vsup): 2 V;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTDPMHB010 by Infineon Technologies

S25HL01GTDPMHB010

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V; Maximum Operating Temperature: 105 Cel;

133 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTDPMHB013 by Infineon Technologies

S25HL01GTDPMHB013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Endurance: 2560000 Write/Erase Cycles; Minimum Supply Voltage (Vsup): 2.7 V;

133 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTDPMHI010 by Infineon Technologies

S25HL01GTDPMHI010

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Surface Mount: YES;

133 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTDPMHI013 by Infineon Technologies

S25HL01GTDPMHI013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .00056 Amp; Terminal Position: DUAL;

133 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTFABHA030 by Infineon Technologies

S25HL01GTFABHA030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; No. of Functions: 1; Parallel or Serial: SERIAL;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTFABHB030 by Infineon Technologies

S25HL01GTFABHB030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Serial Bus Type: SPI;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTFABHV030 by Infineon Technologies

S25HL01GTFABHV030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; No. of Functions: 1; Technology: CMOS;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTFABHV033 by Infineon Technologies

S25HL01GTFABHV033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Terminal Form: BALL; No. of Functions: 1;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTFAMHI013 by Infineon Technologies

S25HL01GTFAMHI013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Maximum Clock Frequency (fCLK): 166 MHz;

166 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTFAMHV010 by Infineon Technologies

S25HL01GTFAMHV010

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL; Memory Width: 8;

166 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTFAMHV013 by Infineon Technologies

S25HL01GTFAMHV013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Write Protection: HARDWARE; Organization: 128MX8;

166 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL512TDPMHV013 by Infineon Technologies

S25HL512TDPMHV013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V; Maximum Clock Frequency (fCLK): 133 MHz;

133 MHz

25

1280000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

536870912 bit

FLASH

8

3

1

16

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

2.65 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL512TDPNHV013 by Infineon Technologies

S25HL512TDPNHV013

Infineon Technologies

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; No. of Functions: 1;

133 MHz

25

1280000 Write/Erase Cycles

R-XDSO-N8

8 mm

536870912 bit

FLASH

8

3

1

8

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

.8 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE

S25HL512TFABHI010 by Infineon Technologies

S25HL512TFABHI010

Infineon Technologies

Infineon's S25HL512TFABHI010 is a 64MX8 NOR flash memory with 536MB density. Operating at 166MHz, it offers 1280000 write/erase cycles and SPI serial bus type for applications requiring high endurance and fast data transfer. With a low standby current of 0.00034A, it suits devices needing reliable non-volatile memory solutions.

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TFABHM010 by Infineon Technologies

S25HL512TFABHM010

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Type: NOR TYPE; No. of Functions: 1;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TFABHV013 by Infineon Technologies

S25HL512TFABHV013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Terminal Form: BALL; No. of Words Code: 64M;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TFANHI013 by Infineon Technologies

S25HL512TFANHI013

Infineon Technologies

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3; Maximum Supply Voltage (Vsup): 3.6 V;

166 MHz

25

1280000 Write/Erase Cycles

R-XDSO-N8

8 mm

536870912 bit

FLASH

8

3

1

8

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX8

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

.8 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE

S25HL512TFANHM013 by Infineon Technologies

S25HL512TFANHM013

Infineon Technologies

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Write Protection: HARDWARE;

166 MHz

25

1280000 Write/Erase Cycles

R-XDSO-N8

8 mm

536870912 bit

FLASH

8

3

1

8

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

AEC-Q100

.8 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE

S25HS01GTDPBHA030 by Infineon Technologies

S25HS01GTDPBHA030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Organization: 128MX8; Surface Mount: YES;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00051 Amp

72 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS01GTFABHA030 by Infineon Technologies

S25HS01GTFABHA030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Length: 8 mm; Maximum Clock Frequency (fCLK): 166 MHz;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00051 Amp

72 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE