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Infineon Technologies Flash Memory 201

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
S25HL02GTDPBHV150 by Infineon Technologies

S25HL02GTDPBHV150

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V; Type: NOR TYPE;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

1.2 mm

SPI

.000045 Amp

110 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTDZBHB053 by Infineon Technologies

S25HL02GTDZBHB053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Memory Density: 2147483648 bit; Write Protection: HARDWARE;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

AEC-Q100

1.2 mm

SPI

.000655 Amp

110 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS02GTDZBHB053 by Infineon Technologies

S25HS02GTDZBHB053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Moisture Sensitivity Level (MSL): 3;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

1.8

AEC-Q100

1.2 mm

SPI

.00045 Amp

110 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S29GL064S90BHI040 by Infineon Technologies

S29GL064S90BHI040

Infineon Technologies

FLASH; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; No. of Words Code: 4M;

90 ns

8

YES

YES

YES

2

100000 Write/Erase Cycles

R-PBGA-B48

8.15 mm

67108864 bit

FLASH

16

1

128

48

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

3-STATE

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

8/16

PARALLEL

3

YES

TS 16949

1 mm

64K

.0001 Amp

80 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

.8 mm

BOTTOM

YES

NOR TYPE

6.15 mm

60 ms

HARDWARE/SOFTWARE

S25FL256SAGNFE001 by Infineon Technologies

S25FL256SAGNFE001

Infineon Technologies

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Functions: 1; Write Protection: HARDWARE/SOFTWARE;

4

133 MHz

20

100 Write/Erase Cycles

R-PDSO-N8

8 mm

268435456 bit

FLASH

8

1

8

33554432 words

32M

SYNCHRONOUS

125 Cel

-55 Cel

32MX8

3-STATE

PLASTIC/EPOXY

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

.8 mm

SPI

.0003 Amp

100 mA

3.6 V

2.7 V

3

YES

CMOS

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE/SOFTWARE

S29GL064S90FHI020 by Infineon Technologies

S29GL064S90FHI020

Infineon Technologies

S29GL064S90FHI020 by Infineon Technologies is a 64Mb NOR Flash Memory with 4MX16 organization, operating at 3V. It features hardware/software write protection, asynchronous operation, and 100000 Write/Erase cycles endurance. Ideal for applications requiring fast access times and high data density in a compact package.

90 ns

8

YES

YES

YES

20

100000 Write/Erase Cycles

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

128

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

3-STATE

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

8/16

PARALLEL

3

YES

1.4 mm

64K

.0002 Amp

60 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

60 ms

HARDWARE/SOFTWARE

S79FS01GSFABHB213 by Infineon Technologies

S79FS01GSFABHB213

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Programming Voltage (V): 1.8;

133 MHz

20

100000 Write/Erase Cycles

R-PBGA-B24

e1

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

260

1.8

AEC-Q100; TS 16949

1.2 mm

SPI

.0006 Amp

200 mA

2 V

1.7 V

1.8

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

NOR TYPE

6 mm

HARDWARE

S25FL256SAGNFE000 by Infineon Technologies

S25FL256SAGNFE000

Infineon Technologies

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Endurance: 100 Write/Erase Cycles; JESD-30 Code: R-PDSO-N8;

4

133 MHz

20

100 Write/Erase Cycles

R-PDSO-N8

8 mm

268435456 bit

FLASH

8

1

8

33554432 words

32M

SYNCHRONOUS

125 Cel

-55 Cel

32MX8

3-STATE

PLASTIC/EPOXY

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

.8 mm

SPI

.0003 Amp

100 mA

3.6 V

2.7 V

3

YES

CMOS

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE/SOFTWARE

S25FL256SAGNFE003 by Infineon Technologies

S25FL256SAGNFE003

Infineon Technologies

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-N8; Maximum Standby Current: .0003 Amp;

4

133 MHz

20

100 Write/Erase Cycles

R-PDSO-N8

8 mm

268435456 bit

FLASH

8

1

8

33554432 words

32M

SYNCHRONOUS

125 Cel

-55 Cel

32MX8

3-STATE

PLASTIC/EPOXY

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

.8 mm

SPI

.0003 Amp

100 mA

3.6 V

2.7 V

3

YES

CMOS

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE/SOFTWARE