Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT29F8G16ABACAWP:C
Micron Technology
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
25 ns
YES
NO
R-PDSO-G48
8589934592 bit
FLASH
16
4K
48
536870912 words
512M
70 Cel
0 Cel
512MX16
PLASTIC/EPOXY
TSSOP
TSSOP48,.8,20
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
2K
PARALLEL
3/3.3
3.3
Not Qualified
128K
.0001 Amp
Flash Memories
35 mA
CMOS
COMMERCIAL
GULL WING
.5 mm
DUAL
SLC NAND TYPE
MT29F16G08ADBCAH4:C
MT29F16G08ADBCAH4:C by Micron Technology is a 1.8V SLC NAND flash memory with 2GX8 organization, 4K page size, and 256K sector size. It operates b/w 0-70°C, has a max standby current of 0.00005A, and is suitable for commercial applications requiring fast access times and low power consumption.
30 ns
R-PBGA-B63
17179869184 bit
8
8K
63
2147483648 words
2G
2GX8
FBGA
BGA63,10X12,32
GRID ARRAY, FINE PITCH
1.8
256K
.00005 Amp
20 mA
BALL
.8 mm
BOTTOM
MT29F8G08ABACAH4:C
Micron Technology's MT29F8G08ABACAH4:C is a 3.3V SLC NAND flash memory with 1GX8 organization, 4K page size, and 256K sector size. It operates in asynchronous mode with a max temperature of 70°C. Ideal for applications requiring high-speed data storage and retrieval in commercial-grade environments.
11 mm
1
1073741824 words
1G
ASYNCHRONOUS
1GX8
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1 mm
3.6 V
2.7 V
9 mm
MT29F16G16ADBCAH4:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; Ready or Busy: YES;
1GX16
MT29F16G08ADACAH4:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; Command User Interface: YES;
MT29F8G08ABACAWP:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Memory Width: 8;
18.4 mm
1.2 mm
12 mm
MT29F16G16ADACAH4:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA63,10X12,32;
MT29F8G08ABBCAH4:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Access Time: 30 ns;
MT29F8G16ABACAH4:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Words: 536870912 words;
MT29F1G08ABBDAH4:D
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Command User Interface: YES;
1073741824 bit
1K
134217728 words
128M
128MX8
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.95 V
1.7 V
MT29F1G08ABBDAHC:D
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
13 mm
10.5 mm
MT29F1G16ABBDAH4:D
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm;
67108864 words
64M
64MX16
64K
MT29F1G16ABBDAHC:D
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Ready or Busy: YES;
SST39SF010A-70-4C-WHE-T
Microchip Technology
SST39SF010A-70-4C-WHE-T by Microchip is a NOR flash memory with 128Kx8 organization, operating at 5V. It offers 100000 Write/Erase cycles, 70ns access time, and supports asynchronous mode. Ideal for applications requiring fast data access and reliable non-volatile storage in commercial temperature environments.
70 ns
100
100000 Write/Erase Cycles
R-PDSO-G32
12.4 mm
1048576 bit
32
131072 words
128KX8
3-STATE
TSOP1
TSSOP32,.56,20
SMALL OUTLINE, THIN PROFILE
NOT SPECIFIED
5
5.5 V
4.5 V
NOR TYPE
8 mm
MT29F2G08ABBEAHC:E
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Type: SLC NAND TYPE;
2147483648 bit
268435456 words
256M
256MX8
MTFDDAK120MBP-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Memory Width: 8; Type: MLC NAND TYPE;
LENGTH_MAX
R-XSMA-X22
100.5 mm
1030792151040 bit
FLASH MODULE
22
128849018880 words
120G
120GX8
UNSPECIFIED
MICROELECTRONIC ASSEMBLY
7.2 mm
SINGLE
MLC NAND TYPE
69.85 mm
MTFDDAK240MBP-1AN16ABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; Command User Interface: NO;
R-XXFM-X22
100.45 mm
2061584302080 bit
257698037760 words
240G
240GX8
XFM
FLANGE MOUNT
7 mm
MTFDDAK240MBP-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Memory Width: 8;
MTFDDAK480MBP-1AN16ABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; Length: 100.45 mm;
4123168604160 bit
515396075520 words
480G
480GX8
MTFDDAK480MBP-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL; Package Body Material: UNSPECIFIED;
MTFDDAK800MBP-1AN16ABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; No. of Words Code: 800G;
6871947673600 bit
858993459200 words
800G
800GX8
MTFDDAK960MBP-1AN16ABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; Programming Voltage (V): 5;
8246337208320 bit
1030792151040 words
960G
960GX8
MTFDDAK960MBP-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V; Parallel or Serial: PARALLEL;
MT29F32G08AECCBH1-10:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm;
20 ns
R-PBGA-B100
18 mm
34359738368 bit
4294967296 words
4G
SYNCHRONOUS
4GX8
VBGA
BGA100,10X17,40
GRID ARRAY, VERY THIN PROFILE
2.7
512K
50 mA
MT29F32G08AFACAWP:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
MT29F32G08AFACAWP-Z:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; No. of Words Code: 4G;
MT29F32G08AECCBH1-10Z:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B100;
MT29F16G08ABACAWP-Z:C
Micron Technology's MT29F16G08ABACAWP-Z:C is a 3.3V SLC NAND flash memory with 2GX8 organization, 4K page size, and 512K sector size. It operates synchronously at temperatures b/w 0-70°C and has a max access time of 20ns. Ideal for applications requiring high-speed data storage in compact devices.
MT29F2G08ABBEAH4:ETR
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
e1
TIN SILVER COPPER
MT29F2G16ABDHC:DTR
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
128MX16
1.65 V
MT29F2G08AADWP:DTR
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Type: SLC NAND TYPE;
e3
MATTE TIN
MT29F1G08ABADAH4:DTR
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
MTFDHAL1T2MCF-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Operating Mode: SYNCHRONOUS; Organization: 1200GX8; No. of Words Code: 1.2T; Terminal Form: UNSPECIFIED;
SOLID STATE DRIVE
R-XXMA-X
1.2T
55 Cel
1200GX8
3.564 V
3.036 V
NAND TYPE
MTFDHAL1T6MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 55 Cel; Organization: 1600GX8; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Nominal Supply Voltage / Vsup (V): 3.3;
1.6T
1600GX8
MTFDHAL2T4MCF-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Style (Meter): MICROELECTRONIC ASSEMBLY; No. of Functions: 1; Maximum Operating Temperature: 55 Cel; Additional Features: SOLID STATE DRIVE;
2.4T
2400GX8
MTFDHAL3T2MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Nominal Supply Voltage / Vsup (V): 3.3; Additional Features: SOLID STATE DRIVE; Minimum Supply Voltage (Vsup): 3.036 V; Minimum Operating Temperature: 0 Cel;
3.2T
3200GX8
MTFDHAL800MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Additional Features: SOLID STATE DRIVE; Type: NAND TYPE; No. of Functions: 1; Maximum Operating Temperature: 55 Cel;
MTFDHAX1T2MCF-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Additional Features: SOLID STATE DRIVE; Memory Width: 8; Maximum Supply Voltage (Vsup): 3.564 V; Minimum Operating Temperature: 0 Cel;
MTFDHAX1T6MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 55 Cel; Minimum Supply Voltage (Vsup): 3.036 V; Organization: 1600GX8;
MTFDHAX2T4MCF-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; JESD-30 Code: R-XXMA-X; No. of Functions: 1; Memory Width: 8; Nominal Supply Voltage / Vsup (V): 3.3;
MTFDHAX3T2MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Operating Mode: SYNCHRONOUS; Type: NAND TYPE; No. of Functions: 1; Terminal Position: UNSPECIFIED;
MTFDHAX800MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Terminal Position: UNSPECIFIED; Technology: CMOS; Minimum Supply Voltage (Vsup): 3.036 V;
MT29F1G16ABBEAHC:E
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
MT29F128G08CBCCBH6-6R:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
R-PBGA-B152
137438953472 bit
152
17179869184 words
16G
SYNCHRONOUS/ASYNCHRONOUS
16GX8
14 mm
MT29F128G08CBECBH6-12:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Technology: CMOS;
MT29F1T08CUCCBH8-6R:C
MT29F1T08CUCCBH8-6R:C by Micron Technology is a Flash Memory with 128GX8 organization, 3.3V nominal voltage, and 1099511627776 bit memory density. It is used in applications requiring high-speed data storage and retrieval, such as smartphones, tablets, and solid-state drives (SSDs).
1099511627776 bit
137438953472 words
128G
128GX8
LBGA
GRID ARRAY, LOW PROFILE
1.4 mm
MT29F256G08CECCBH6-6R:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Type: MLC NAND TYPE;
274877906944 bit
34359738368 words
32G
32GX8
MT29F256G08CEECBH6-12:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
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