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COMMERCIAL Flash Memory 249

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
MT29F512G08CKCCBH7-6R:C by Micron Technology

MT29F512G08CKCCBH7-6R:C

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Density: 549755813888 bit;

R-PBGA-B152

18 mm

549755813888 bit

FLASH

8

1

152

68719476736 words

64G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

64GX8

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

PARALLEL

3.3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

MT29F512G08CKECBH7-12:C by Micron Technology

MT29F512G08CKECBH7-12:C

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

R-PBGA-B152

18 mm

549755813888 bit

FLASH

8

1

152

68719476736 words

64G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

64GX8

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

PARALLEL

3.3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

MT29F64G08CFACAWP-Z:C by Micron Technology

MT29F64G08CFACAWP-Z:C

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;

R-PDSO-G48

18.4 mm

68719476736 bit

FLASH

8

1

48

8589934592 words

8G

ASYNCHRONOUS

70 Cel

0 Cel

8GX8

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

260

3.3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

DUAL

30

MLC NAND TYPE

12 mm

MT29F32G08CBACAWP-Z:C by Micron Technology

MT29F32G08CBACAWP-Z:C

Micron Technology

Micron Technology's MT29F32G08CBACAWP-Z:C is a 3.3V MLC NAND Flash Memory with 4GX8 organization, operating in commercial temperature grade. It features 48 terminals, 0.5mm pitch, and offers 34359738368-bit memory density. Ideal for applications requiring high-speed data storage and retrieval in compact devices.

R-PDSO-G48

18.4 mm

34359738368 bit

FLASH

8

1

48

4294967296 words

4G

ASYNCHRONOUS

70 Cel

0 Cel

4GX8

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

260

3.3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

DUAL

30

MLC NAND TYPE

12 mm

MT29F64G08CFACBWP-12Z:C by Micron Technology

MT29F64G08CFACBWP-12Z:C

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;

R-PDSO-G48

18.4 mm

68719476736 bit

FLASH

8

1

48

8589934592 words

8G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

8GX8

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

260

3.3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

DUAL

30

MLC NAND TYPE

12 mm

MT29F2G16ABAEAWP:ETR by Micron Technology

MT29F2G16ABAEAWP:ETR

Micron Technology

Micron Technology's MT29F2G16ABAEAWP:ETR is a 3.3V SLC NAND flash memory with 128Mx16 organization and 2147483648-bit memory density. Operating in asynchronous mode, it has a temperature range of 0-70°C and is suitable for commercial applications requiring high-speed parallel memory access.

R-PDSO-G48

18.4 mm

2147483648 bit

FLASH

16

1

48

134217728 words

128M

ASYNCHRONOUS

70 Cel

0 Cel

128MX16

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

NOT SPECIFIED

3.3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

DUAL

NOT SPECIFIED

SLC NAND TYPE

12 mm

SQF-SMSM4-128G-SBC by Advantech

SQF-SMSM4-128G-SBC

Advantech

Advantech's SQF-SMSM4-128G-SBC is a 128GX8 MLC NAND flash module with 137.44TB memory density. It operates in commercial temperature range of 0-70°C, ideal for microelectronic assemblies requiring high-speed serial memory solutions. Measuring 30x50.8 mm, it offers 52 terminals and NO LEAD terminal form for compact designs.

R-XSMA-N52

50.8 mm

1099511627776 bit

FLASH MODULE

8

1

52

137438953472 words

128G

70 Cel

0 Cel

128GX8

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

SERIAL

4.2 mm

NO

CMOS

COMMERCIAL

NO LEAD

SINGLE

MLC NAND TYPE

30 mm

SQF-SMSM4-256G-SBC by Advantech

SQF-SMSM4-256G-SBC

Advantech

Advantech SQF-SMSM4-256G-SBC Flash Memory features 256GX8 organization, MLC NAND type, and 2199023255552 bit memory density. Ideal for commercial applications requiring high-speed serial memory with a compact MICROELECTRONIC ASSEMBLY package.

R-XSMA-N52

50.8 mm

2199023255552 bit

FLASH MODULE

8

1

52

274877906944 words

256G

70 Cel

0 Cel

256GX8

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

SERIAL

4.2 mm

NO

CMOS

COMMERCIAL

NO LEAD

SINGLE

MLC NAND TYPE

30 mm

SQF-SMSM2-64G-SBC by Advantech

SQF-SMSM2-64G-SBC

Advantech

Advantech's SQF-SMSM2-64G-SBC is a 64GX8 MLC NAND flash module with 52 terminals. It operates b/w 0-70°C, measures 30x50.8 mm, and has a memory density of 549755813888 bits. Ideal for commercial applications requiring high-speed serial memory solutions.

R-XSMA-N52

50.8 mm

549755813888 bit

FLASH MODULE

8

1

52

68719476736 words

64G

70 Cel

0 Cel

64GX8

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

SERIAL

4.2 mm

NO

CMOS

COMMERCIAL

NO LEAD

SINGLE

MLC NAND TYPE

30 mm