Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.
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EDY4016AABG-JD-F-D
Micron Technology
DDR4 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MULTI BANK PAGE BURST
AUTO/SELF REFRESH
R-PBGA-B96
13.5 mm
4294967296 bit
DDR4 DRAM
16
1
96
268435456 words
256M
SYNCHRONOUS
85 Cel
0 Cel
256MX16
PLASTIC/EPOXY
TFBGA
RECTANGULAR
GRID ARRAY, THIN PROFILE, FINE PITCH
1.2 mm
YES
1.26 V
1.14 V
1.2
CMOS
OTHER
BALL
.8 mm
BOTTOM
7.5 mm
MT18KSF1G72HZ-1G6P1
DDR3L DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Technology: CMOS;
DUAL BANK PAGE BURST
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
R-XZMA-N204
67.6 mm
77309411328 bit
DDR3L DRAM MODULE
72
204
1073741824 words
1G
70 Cel
1GX72
UNSPECIFIED
DIMM
MICROELECTRONIC ASSEMBLY
30.15 mm
1.45 V
1.283 V
1.35
NO
COMMERCIAL
NO LEAD
ZIG-ZAG
3.8 mm
MT18KSF1G72PZ-1G6P1
DDR3L DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
SINGLE BANK PAGE BURST
R-XDMA-N240
133.35 mm
240
30.5 mm
1 mm
DUAL
4 mm
MT46V32M16P-5BXIT:J
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
FOUR BANK PAGE BURST
.7 ns
R-PDSO-G66
e3
22.22 mm
536870912 bit
DDR1 DRAM
66
33554432 words
32M
-40 Cel
32MX16
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
2.7 V
2.5 V
2.6
INDUSTRIAL
MATTE TIN
GULL WING
.65 mm
10.16 mm
MT9KSF51272HZ-1G6P1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.35;
38654705664 bit
DDR DRAM MODULE
536870912 words
512M
512MX72
MT44K32M36RB-083F:A
DDR DRAM; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; No. of Ports: 1; Nominal Supply Voltage / Vsup (V): 1.35;
AUTO REFRESH
S-PBGA-B168
1207959552 bit
DDR DRAM
36
168
32MX36
TBGA
SQUARE
GRID ARRAY, THIN PROFILE
1.42 V
1.28 V
MT44K32M36RB-093E:A
Micron Technology's MT44K32M36RB-093E:A is a DDR DRAM with 32MX36 organization, operating at 1.35V. It features synchronous mode, multi-bank page burst access, and thin profile grid array package style. Ideal for high-density memory applications requiring fast data processing and low power consumption.
e1
260
TIN SILVER COPPER
30
MT44K32M36RB-093F:A
DDR DRAM; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 1.35; Terminal Position: BOTTOM;
MT44K32M36RB-107E:A
DDR DRAM; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Terminal Form: BALL; Maximum Seated Height: 1.2 mm;
MT44K64M18RB-083F:A
DDR DRAM; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; No. of Words: 67108864 words; Minimum Supply Voltage (Vsup): 1.28 V;
18
67108864 words
64M
64MX18
Tin/Silver/Copper (Sn/Ag/Cu)
MT44K64M18RB-093E:A
DDR DRAM; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Nominal Supply Voltage / Vsup (V): 1.35;
MT44K64M18RB-093F:A
DDR DRAM; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B168; No. of Words: 67108864 words;
MT44K64M18RB-107E:A
DDR DRAM; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 1.28 V; JESD-609 Code: e1;
MT8KTF51264AZ-1G9P1
Micron Technology's MT8KTF51264AZ-1G9P1 is a 512MX64 DDR3 DRAM with 64-bit memory width. Operating at 1.35V, it features synchronous mode and self-refresh capability. Ideal for commercial applications, this rectangular package has 240 terminals and supports single bank page burst access mode.
34359738368 bit
DDR3 DRAM
64
512MX64
2.7 mm
MTA72ASS8G72LZ-2G3A1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
AUTO/SELF REFRESH; WD-MAX
R-XDMA-N288
309237645312 bit
288
4294967296 words
4G
4GX72
31.4 mm
3.9 mm
MT48LC16M16A2P-6AAAT:G
MT48LC16M16A2P-6AAAT:G by Micron Technology is a 16MX16 Synchronous DRAM with 268MB memory density. It operates at 3.3V, has a max access time of 5.4ns, and is suitable for industrial applications requiring fast and reliable memory performance.
5.4 ns
R-PDSO-G54
268435456 bit
SYNCHRONOUS DRAM
54
16777216 words
16M
105 Cel
16MX16
TSOP2
SMALL OUTLINE, THIN PROFILE
AEC-Q100
3.6 V
3 V
3.3
EDB5432BEBH-1DAAT-F-D
LPDDR2 DRAM; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm; Organization: 16MX32;
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
R-PBGA-B134
11.5 mm
LPDDR2 DRAM
32
134
16MX32
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.3 V
10 mm
EDB5432BEBH-1DAUT-F-D
LPDDR2 DRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
125 Cel
NOT SPECIFIED
AUTOMOTIVE
EDB5432BEBH-1DIT-F-D
LPDDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
EDB5432BEPA-1DAAT-F-D
LPDDR2 DRAM; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm; Minimum Supply Voltage (Vsup): 1.14 V;
12 mm
.5 mm
EDB5432BEPA-1DIT-F-D
LPDDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; No. of Ports: 1;
EDB5432BEPA-1DIT-F-R
LPDDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
MT9KDF51272AZ-1G6P1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Organization: 512MX72;
18.9 mm
MTA9ASF1G72AZ-2G3A1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; JESD-30 Code: R-XDMA-N288;
MTA9ASF1G72PZ-2G3A1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Words Code: 1G;
IS42S16400J-6TLI-TR
Integrated Silicon Solution
IS42S16400J-6TLI-TR by Integrated Silicon Solution is a 4MX16 Synchronous DRAM with 166 MHz clock frequency. Operating at 3.3V, it offers a memory density of 67108864 bits and supports four bank page burst access mode. Ideal for industrial applications requiring fast data processing in compact systems.
166 MHz
COMMON
1,2,4,8
67108864 bit
3
4194304 words
4M
4MX16
3-STATE
TSOP54,.46,32
Not Qualified
4096
1,2,4,8,FP
.002 Amp
DRAMs
150 mA
MT8HTF12864AZ-667H1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.45 ns
333 MHz
8589934592 bit
134217728 words
128M
128MX64
DIMM240,40
1.8
8192
1480 mA
1.9 V
1.7 V
MT8JTF12864AZ-1G4G1
667 MHz
1.5
.096 Amp
3920 mA
1.575 V
1.425 V
EDY4016AABG-GX-F-D
DDR4 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: AUTO/SELF REFRESH;
EDF8164A3PK-JD-F-D
LPDDR3 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Access Mode: SINGLE BANK PAGE BURST; Operating Mode: SYNCHRONOUS;
AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY
S-PBGA-B216
LPDDR3 DRAM
216
.7 mm
.4 mm
EDF8164A3PK-JD-F-R
LPDDR3 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: .7 mm; Package Body Material: PLASTIC/EPOXY;
EDFA164A2PK-GD-F-D
LPDDR3 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B216; No. of Words: 268435456 words;
17179869184 bit
256MX64
EDFA164A2PK-JD-F-D
LPDDR3 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Organization: 256MX64; Memory Width: 64;
MT18KSF1G72PDZ-1G6P1
DDR3 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
MT49H32M9SJ-25:B
DDR DRAM; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm; Access Mode: MULTI BANK PAGE BURST;
R-PBGA-B144
18.5 mm
301989888 bit
9
144
32MX9
11 mm
MT49H8M36SJ-25:B
DDR DRAM; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; No. of Words Code: 8M;
8388608 words
8M
8MX36
MT49H8M36SJ-25E:B
DDR DRAM; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Functions: 1; Additional Features: AUTO REFRESH;
MT49H8M36SJ-25IT:B
DDR DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
MT18KSF1G72AZ-1G6P1
DDR3L DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.35;
1.235 V
MT40A1G16HBA-083E:A
Micron Technology's MT40A1G16HBA-083E:A is a DDR4 DRAM with 1GX16 organization, operating at 1.2V. It features synchronous mode, self-refresh capability, and single bank page burst access. Suitable for applications requiring high memory density and fast data processing in compact devices.
14 mm
1GX16
9.5 mm
MT40A1G4RH-075E:B
DDR4 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.14 V;
R-PBGA-B78
10.5 mm
4
78
1GX4
9 mm
MT40A1G4RH-083E:B
Micron Technology's MT40A1G4RH-083E:B is a DDR4 DRAM with 1GX4 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and a thin profile grid array package. Ideal for applications requiring high memory density and fast data access in a compact form factor.
95 Cel
MT40A256M16GE-062E:B
DDR4 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
MT40A256M16GE-062EIT:B
DDR4 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
MT40A256M16GE-075E:B
Micron Technology's MT40A256M16GE-075E:B is a DDR4 DRAM with 256MX16 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and a memory width of 16 bits. Ideal for applications requiring high-speed data processing in commercial-grade environments.
MT40A256M16GE-075EIT:B
Micron Technology's MT40A256M16GE-075EIT:B is a DDR4 DRAM with 256MX16 organization, operating at 1.2V. It features synchronous mode, self-refresh capability, and industrial temperature grade suitability. Ideal for applications requiring high memory density and multi-bank page burst access mode.
MT40A256M16GE-083E:B
Micron Technology's MT40A256M16GE-083E:B is a DDR4 DRAM with 256MX16 organization, operating at 1.2V. It features synchronous mode, self-refresh capability, and multi-bank page burst access for high-speed data processing applications in electronics.
MT40A2G4TRF-093E:A
DDR4 DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Terminal Form: BALL;
1067.2 MHz
8
2147483648 words
2G
2GX4
BGA78,6X13,32
.055 Amp
70 mA
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