Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT48LC4M32B2TG-6A:L
Micron Technology
Micron Technology's MT48LC4M32B2TG-6A:L is a 4MX32 Synchronous DRAM with 3.3V supply voltage, operating at 0-70°C. It features self-refresh mode, 86 terminals in a small outline package, and offers fast access time of 5.4 ns. Ideal for applications requiring high-speed memory operations in commercial temperature environments.
FOUR BANK PAGE BURST
5.4 ns
AUTO/SELF REFRESH
R-PDSO-G86
e0
22.22 mm
134217728 bit
SYNCHRONOUS DRAM
32
1
86
4194304 words
4M
SYNCHRONOUS
70 Cel
0 Cel
4MX32
PLASTIC/EPOXY
TSOP2
RECTANGULAR
SMALL OUTLINE, THIN PROFILE
1.2 mm
YES
3.6 V
3 V
3.3
CMOS
COMMERCIAL
TIN LEAD
GULL WING
.5 mm
DUAL
10.16 mm
MT49H16M36BM-18:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
MULTI BANK PAGE BURST
15 ns
AUTO REFRESH
533 MHz
COMMON
R-PBGA-B144
e1
18.5 mm
603979776 bit
DDR DRAM
36
144
16777216 words
16M
16MX36
3-STATE
TBGA
BGA144,12X18,40/32
GRID ARRAY, THIN PROFILE
1.5/1.8,1.8,2.5
Not Qualified
2,4,8
.055 Amp
DRAMs
885 mA
1.9 V
1.7 V
1.8
TIN SILVER COPPER
BALL
1 mm
BOTTOM
11 mm
MT49H16M36BM-25:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
20 ns
400 MHz
700 mA
MT49H16M36BM-25E:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
NOT SPECIFIED
MT49H16M36BM-33:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
300 MHz
565 mA
Tin/Silver/Copper (Sn/Ag/Cu)
MT49H16M36FM-18:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; JESD-609 Code: e0;
Tin/Lead/Silver (Sn/Pb/Ag)
MT49H16M36FM-25:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words Code: 16M;
MT49H16M36FM-25E:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
TIN LEAD SILVER
MT49H32M18BM-18:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Organization: 32MX18;
18
33554432 words
32M
32MX18
830 mA
MT49H32M18BM-25:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
655 mA
MT49H32M18BM-25E:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
MT49H32M18BM-33:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.5/1.8,1.8,2.5;
530 mA
MT49H32M18FM-25:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Sequential Burst Length: 2,4,8;
MT49H32M18FM-25E:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MT49H32M18FM-33:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA144,12X18,40/32;
MT49H64M9BM-25:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Length: 18.5 mm;
9
67108864 words
64M
64MX9
MT49H64M9FM-25:B
MT49H64M9FM-25E:B
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
IS42S32400F-6BL
Integrated Silicon Solution
IS42S32400F-6BL by Integrated Silicon Solution is a 4MX32 Synchronous DRAM with 3.3V supply, 166 MHz clock frequency, and 70°C operating temp. Ideal for applications requiring high-speed memory access in commercial-grade devices.
166 MHz
1,2,4,8
R-PBGA-B90
13 mm
90
TFBGA
BGA90,9X15,32
GRID ARRAY, THIN PROFILE, FINE PITCH
4096
1,2,4,8,FP
.002 Amp
180 mA
.8 mm
8 mm
IS42S32400F-7TL
IS42S32400F-7TL by Integrated Silicon Solution is a 4MX32 DRAM with 3.3V supply, operating at 143MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in commercial temperature environments.
143 MHz
e3
3
TSSOP86,.46,20
260
160 mA
MATTE TIN
30
MT18JSF1G72PDZ-1G6E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Memory Width: 72;
DUAL BANK PAGE BURST
R-XDMA-N240
e4
133.35 mm
77309411328 bit
DDR DRAM MODULE
72
240
1073741824 words
1G
1GX72
UNSPECIFIED
DIMM
MICROELECTRONIC ASSEMBLY
30.5 mm
1.575 V
1.425 V
1.5
NO
GOLD
NO LEAD
MT18JSF1G72PZ-1G6D1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
SINGLE BANK PAGE BURST
MT18KSF51272AZ-1G4K1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Ports: 1;
AUTO/SELF REFRESH; WD-MAX; SEATED HGT-NOM
38654705664 bit
536870912 words
512M
512MX72
1.45 V
1.283 V
1.35
4 mm
MT16JTF51264HZ-1G4M1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Self Refresh: YES;
R-XZMA-N204
67.6 mm
34359738368 bit
64
204
512MX64
30.15 mm
ZIG-ZAG
MT16KTF51264HZ-1G4M1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Technology: CMOS;
MT18JSF51272PZ-1G6M1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.225 ns
800 MHz
R-XZMA-N240
DIMM240,40
8192
.216 Amp
Other Memory ICs
7830 mA
Gold (Au)
30.175 mm
MT8VDDF6464AY-40BJ1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
R-XDMA-N184
4294967296 bit
184
64MX64
25.53 mm
2.3 V
2.5
MT16HTS25664HY-667A1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
333 MHz
R-PDMA-N200
17179869184 bit
200
268435456 words
256M
256MX64
DIMM200,24
.112 Amp
2336 mA
.6 mm
MT16VDDF12864HY-40BJ1
.7 ns
200 MHz
8589934592 bit
134217728 words
128M
128MX64
2.6
.08 Amp
5520 mA
MT18HTF6472AY-53EB2
267 MHz
R-PDMA-N240
4831838208 bit
55 Cel
64MX72
3060 mA
MT4KTF12864HZ-1G6K1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Ports: 1;
AUTO/SELF REFRESH; WD-MAX
MATTE TIN OVER NICKEL
3.8 mm
MT16JTF51264AZ-1G4D1
667 MHz
.192 Amp
3176 mA
MT18HTF25672AZ-80EH1
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.4 ns
19327352832 bit
256MX72
.126 Amp
1953 mA
MT18HTF25672FDZ-667H1D6
1.5,1.8
4480 mA
MT18HTS25672RHZ-80EH1
Micron Technology's MT18HTS25672RHZ-80EH1 is a 256MX72 DRAM module with synchronous operation at 400 MHz clock frequency. It features self-refresh capability, operates at 1.8V, and has a memory density of 19.3 Gb. Ideal for applications requiring high-speed data processing in commercial temperature environments.
R-XZMA-N200
SYNCHRONOUS DRAM MODULE
3123 mA
MT18HVF25672PDZ-80EH1
4230 mA
MT18HVF25672PZ-80EH1
3780 mA
MT18JDF51272PDZ-1G4D1
.255 ns
3573 mA
MT18JSF51272AZ-1G4D1
3393 mA
MT18JSF51272AZ-1G6M1
DDR3 DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
DDR3 DRAM MODULE
MT18JSF51272PDZ-1G4D1
MT36HTF1G72PZ-667C1
.45 ns
SELF REFRESH; WD-MAX
MT36HTF1G72PZ-80EC1
MT36HTF25672PZ-667G1
2646 mA
MT36JSZF1G72PZ-1G4D1
.432 Amp
7200 mA
MT4HTF3264HZ-667G1
2147483648 bit
32MX64
.028 Amp
1400 mA
MT4HTF6464HZ-800H1
1760 mA
2.45 mm
MT72JSS2G72PZ-1G1D1
.3 ns
154618822656 bit
2147483648 words
2G
2GX72
.864 Amp
7130 mA
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