Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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HEF4013BP-Q100U
NXP Semiconductors
HEF4013BP-Q100U by NXP is a dual positive edge-triggered flip-flop with a 220 ns propagation delay and operates at temperatures from -40 °C to 125 °C. It supports power supplies of 5/15V and has a max frequency of 7 MHz, ideal for automotive applications. Packaged in a 14-terminal through-hole format, it ensures reliable performance in demanding environments.
R-PDIP-T14
50 pF
D FLIP-FLOP
7000000 Hz
.36 Amp
2
14
125 Cel
-40 Cel
PLASTIC/EPOXY
DIP
DIP14,.3
RECTANGULAR
IN-LINE
TR
5/15
Not Qualified
AEC-Q100
FF/Latches
NO
CMOS
AUTOMOTIVE
THROUGH-HOLE
2.54 mm
DUAL
POSITIVE EDGE
74ABT16273DGG,112
74ABT16273DGG,112 by NXP Semiconductors is a 16-function latch with a propagation delay of just 4 ns and operates at a nominal voltage of 5V. Its compact SOIC package supports surface mount applications. Ideal for high-speed digital circuits, it withstands temperatures from -40 °C to 85 °C.
R-PDSO-G48
150000000 Hz
64 Amp
16
48
85 Cel
TSSOP
TSSOP48,.3,20
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
5
YES
INDUSTRIAL
GULL WING
.5 mm
74LVC1G74GM,115
74LVC1G74GM,115 by NXP Semiconductors is a CMOS latch with a fast propagation delay of 5.9 ns and operates at a nominal voltage of 3.3V. It features an automotive temperature grade, supporting -40 °C to 125 °C. Ideal for high-speed applications, it handles up to 24A current.
R-PDSO-N8
175000000 Hz
24 Amp
1
8
SON
SOLCC8,.08,20
SMALL OUTLINE
260
3.3
NO LEAD
30
74LVTH16374ABX,518
74LVTH16374ABX,518 by NXP Semiconductors is a CMOS latch with a 5 ns propagation delay and operates at 3.3V. It features 16 functions, supports surface mount, and handles up to 64A output current. Ideal for high-speed digital applications in industrial environments.
60
3-STATE
SLGA60,8X12,20
74AHC1G79GW,165
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;
AHC/VHC/H/U/V
R-PDSO-G5
e3
2.05 mm
TRUE
15.5 ns
1.1 mm
5.5 V
2 V
TIN
.65 mm
1.25 mm
70 MHz
74LVC1G175GW,165
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
LVC/LCX/Z
R-PDSO-G6
2 mm
6
TSSOP6,.08
17 ns
1.65 V
2.7
200 MHz
74LVC1G79GW,165
TSSOP5/6,.08
12.5 ns
1.8
74LVC1G80GW,165
INVERTED
13 ns
SSTU32866EC/G,551
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
SSTU
R-PBGA-B96
13.5 mm
25
96
70 Cel
0 Cel
OPEN-DRAIN
LFBGA
GRID ARRAY, LOW PROFILE, FINE PITCH
1.8 ns
1.5 mm
1.9 V
1.7 V
COMMERCIAL
BALL
.8 mm
BOTTOM
5.5 mm
450 MHz
SSTUA32866EC/G,518
32866
COMPLEMENTARY
SSTUB32868ET/G,518
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 176; Package Code: TFBGA; Package Shape: RECTANGULAR;
32868
R-PBGA-B176
15 mm
28
176
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
3 ns
1.15 mm
6 mm
SSTUG32866EC/G,518
1.5 ns
550 MHz
SSTUG32866EC/S,518
D FLIP-FLOP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;
OTHER
SSTUG32868ET/G,518
SSTUG32868ET/S,518
D FLIP-FLOP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 176; Package Code: TFBGA; Package Shape: RECTANGULAR;
SSTUH32866EC/G,518
SSTUH32866EC/G,551
SSTUM32866EC/S,518
BGA96,6X16,32
Other Logic ICs
SSTUP32866EC/G,518
74ALVCH16841DGG:11
D LATCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G56
D LATCH
10
56
TSSOP56,.3,20
74ABT16273DL,112
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: SSOP; Package Shape: RECTANGULAR;
ABT
e4
15.875 mm
SSOP
SSOP48,.4
SMALL OUTLINE, SHRINK PITCH
4 ns
2.8 mm
4.5 V
BICMOS
NICKEL PALLADIUM GOLD
.635 mm
7.5 mm
240 MHz
74ABT16273DL,118
74ABT16821ADGG,112
BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;
14 mm
BUS DRIVER
160000000 Hz
19 mA
3.7 ns
1.2 mm
6.1 mm
74ABT16821ADGG,118
74ABT16821ADL,518
BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR;
18.425 mm
SSOP56,.4
74ABT273AD,112
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G20
12.8 mm
250000000 Hz
20
SOP
SOP20,.4
30 mA
4.8 ns
2.65 mm
Nickel/Palladium/Gold (Ni/Pd/Au)
1.27 mm
250 MHz
74ABT273AD,118
74ABT273ADB,112
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;
7.2 mm
SSOP20,.3
5.3 mm
74ABT273ADB,118
74ABT273AN,112
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
R-PDIP-T20
26.73 mm
DIP20,.3
4.2 mm
7.62 mm
74ABT273APW,112
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
6.5 mm
TSSOP20,.25
4.4 mm
74ABT273APW,118
74ABT377AD,112
WITH HOLD MODE
4.9 ns
74ABT377AD,118
74ABT377ADB,112
74ABT377ADB,118
74ABT377AN,112
74ABT377APW,112
74ABT377APW,118
74ABT74N,112
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
19.025 mm
20 Amp
.05 mA
150 MHz
74AHC259D,118
D LATCH; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
AHC
R-PDSO-G16
9.9 mm
8 Amp
SOP16,.25
2/5.5
18.5 ns
1.75 mm
LOW LEVEL
3.9 mm
74AHCT259D,112
AHCT/VHCT
TUBE
12 ns
74AHCT259D,118
74AHCT259PW,112
D LATCH; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
5 mm
TSSOP16,.25
74HC107N,652
J-K FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
HC/UH
J-K FLIP-FLOP
20000000 Hz
4 Amp
2/6
48 ns
6 V
NEGATIVE EDGE
60 MHz
74HC109N,652
J-KBAR FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
R-PDIP-T16
21.6 mm
J-KBAR FLIP-FLOP
DIP16,.3
BULK
265 ns
4.7 mm
4.5
24 MHz
74HC112N,652
J-K FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
74HC174N,652
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
50 ns
20 MHz
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