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74ABT377ADB,112

NXP Semiconductors

74ABT377ADB,112 by NXP Semiconductors

D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,269 parts In-Stock

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Anansix

USA . 1,714 parts In-Stock

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Digiode

USA . 1,582 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 604 parts In-Stock

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$0.167

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-

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$0.160

604

$0.167

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$0.160

Northwest PG Solutions

USA . 1,768 parts In-Stock

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$0.184

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$0.162

1,768

$0.184

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$0.162

Corohmni

South Africa . 150 parts In-Stock

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$11.962

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150

$11.962

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AZTECH Wire

Italy . 892 parts In-Stock

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$13.820

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892

$13.820

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Advanced Electronics

New Zealand . 36 parts In-Stock

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$34.933

100+ parts

$31.789

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$28.645

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36

$34.933

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$28.645

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One Stop Electronics

USA . 1,093 parts In-Stock

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$48.000

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QUARKTWIN TECHNOLOGY LTD

USA . 16,391 parts In-Stock

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Microchip USA

USA . 5,915 parts In-Stock

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UNI Independent Distributors

Spain . 5,131 parts In-Stock

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Corphita

USA . 2,169 parts In-Stock

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Technical Specifications

Latches & Flip-Flops 74ABT377ADB,112 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Additional Features:

WITH HOLD MODE

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

250 MHz

Trade Compliance

74ABT377ADB,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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