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74ABT16273DGG,118

NXP Semiconductors

74ABT16273DGG,118 by NXP Semiconductors

74ABT16273DGG,118 from NXP Semiconductors is a 16-function latch with a fast propagation delay of just 4 ns. It operates at a nominal voltage of 5V and supports max frequencies up to 150 MHz. Ideal for industrial applications, it features a compact SOIC package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Anansix

USA . 2,196 parts In-Stock

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Digiode

USA . 157 parts In-Stock

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Vyrian

USA . 134 parts In-Stock

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Northwest PG Solutions

USA . 704 parts In-Stock

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$3.058

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704

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One Stop Electronics

USA . 404 parts In-Stock

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$46.000

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$46.000

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QUARKTWIN TECHNOLOGY LTD

USA . 14,236 parts In-Stock

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UNI Independent Distributors

Spain . 7,867 parts In-Stock

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Microchip USA

USA . 3,881 parts In-Stock

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Corphita

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Native Components

USA . 173 parts In-Stock

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$2.697

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Overview

Unlock unparalleled performance and reliability with the 74ABT16273DGG,118 from NXP Semiconductors! This advanced latch and flip-flop solution is designed for high-speed applications, ensuring seamless data handling and efficiency. With a robust temperature range and compact footprint, it excels in industrial environments. Trust in NXP's commitment to quality and innovation, and elevate your projects with a component that delivers exceptional value and lasting benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and reliability, making this latch suitable for various industrial applications.

Propagation Delay At Nominal Supply: 4 ns

A low propagation delay of 4 ns allows for high-speed data processing, making this component ideal for fast digital circuits.

Surface Mount: YES

Being a surface mount device facilitates space-saving and easier integration within compact designs, enabling efficient PCB layout.

No. of Functions: 16

With 16 functions available, the product offers versatile operation, allowing it to handle multiple tasks efficiently.

Package Shape: RECTANGULAR

A rectangular package shape allows for easier packing and integration into existing systems while maintaining a standard design footprint.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with most digital logic circuits, ensuring widespread applicability.

Power Supplies (V): 5

Supports standard 5V power supplies, simplifying power management in system designs.

No. of Terminals: 48

The 48 terminals provide extensive connectivity options, enabling complex designs and enhanced signal handling capabilities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and thin profile is ideal for space-constrained applications, allowing for efficient layouts without sacrificing performance.

Maximum I (ol): 64 Amp

Supports a maximum output current of 64 Amps, making it suitable for high-current applications and ensuring reliable operation under load.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this component is suitable for industrial environments that may experience higher thermal conditions.

Trigger Type: POSITIVE EDGE

The positive edge triggering ensures precise timing control in digital circuits, improving synchronization in data transfer.

Minimum Operating Temperature: -40 °C

Able to operate down to -40 °C, this product is suitable for extreme environmental conditions, ensuring reliability in harsh climates.

Terminal Position: DUAL

The dual terminal positioning allows for better placement flexibility on circuit boards, optimizing design and layout.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, ensuring performance stability over a wider temperature range, which is crucial for many applications.

Maximum Frequency At Nominal Supply: 150000000 Hz

Operating at a maximum frequency of 150 MHz, this component can handle high-speed applications, enhancing performance in modern electronics.

Terminal Form: GULL WING

The gull-wing terminal form provides a reliable connection and easier soldering, facilitating effective assembly processes.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5 mm allows for denser component placements on PCBs, maximizing design efficiency and space utilization.

Technical Specifications

Latches & Flip-Flops 74ABT16273DGG,118 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G48

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

No. of Functions:

16

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

4 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

74ABT16273DGG,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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