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HEF4013BP-Q100U

NXP Semiconductors

HEF4013BP-Q100U by NXP Semiconductors

HEF4013BP-Q100U by NXP is a dual positive edge-triggered flip-flop with a 220 ns propagation delay and operates at temperatures from -40 °C to 125 °C. It supports power supplies of 5/15V and has a max frequency of 7 MHz, ideal for automotive applications. Packaged in a 14-terminal through-hole format, it ensures reliable performance in demanding environments.

Median Price

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3

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1k+

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Vyrian

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AZTECH Wire

Italy . 830 parts In-Stock

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$18.990

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Native Components

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Northwest PG Solutions

USA . 2,328 parts In-Stock

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Microchip USA

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Ampacity Inc.

Singapore . 550 parts In-Stock

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One Stop Electronics

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Component Stockers USA

USA . 673 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Unlock unparalleled reliability and performance with the HEF4013BP-Q100U from NXP Semiconductors, a leader in innovative solutions. Designed for automotive applications, this high-quality latch and flip-flop device boasts robust temperature resilience and superior efficiency. Experience the benefits of AEC-Q100 screening, ensuring your projects meet the highest standards. Elevate your designs with confidence, knowing NXP's commitment to excellence is backing your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 220 ns

With a propagation delay of 220 ns, this component provides a quick response time, enhancing the overall performance of the circuit.

No. of Functions: 2

The ability to perform two functions allows for greater versatility in applications, reducing the need for additional components.

Screening Level: AEC-Q100

Meeting the AEC-Q100 standard ensures high reliability and performance in automotive applications, making it a trusted choice.

Package Shape: RECTANGULAR

The rectangular shape is optimized for space efficiency and compatibility with various PCB layouts.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF enables effective signal processing, making it suitable for high-speed applications.

Power Supplies (V): 5/15

The dual power supply capability allows for flexibility in circuit design and compatibility with different system voltages.

No. of Terminals: 14

With 14 terminals, this product provides ample connections for complex circuit designs, enhancing its functionality.

Package Style (Meter): IN-LINE

The in-line package style simplifies integration into circuits and facilitates easier soldering on PCBs.

Maximum I (ol): 0.36 Amp

A maximum output current of 0.36 Amp allows for driving larger loads, increasing its application range.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product is capable of functioning in high-temperature environments, suitable for automotive applications.

Trigger Type: POSITIVE EDGE

Using a positive edge trigger allows for precise timing control in digital circuits, making it ideal for synchronous applications.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C ensures reliable performance in extreme weather conditions, making it ideal for outdoor applications.

Terminal Position: DUAL

The dual terminal position enhances routing efficiency and facilitates easier PCB assembly.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product adheres to strict standards, ensuring reliability in demanding conditions.

Maximum Frequency At Nominal Supply: 7000000 Hz

The ability to operate at a maximum frequency of 7 MHz ensures quick signal processing, making it suitable for high-speed applications.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, making it highly efficient.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, ensuring reliable performance in various applications.

Packing Method: TR

The TR packing method allows for easy handling and placement in automated systems, improving manufacturing efficiency.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard for many designs, facilitating compatibility with existing boards and expediting assembly.

Technical Specifications

Latches & Flip-Flops HEF4013BP-Q100U attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDIP-T14

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

7000000 Hz

Maximum I (ol):

.36 Amp

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TR

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

220 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

FF/Latches

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

HEF4013BP-Q100U Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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