Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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HEF4013BP,652
NXP Semiconductors
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
4000/14000/40000
R-PDIP-T14
e4
19.025 mm
50 pF
D FLIP-FLOP
7000000 Hz
1
2
14
85 Cel
-40 Cel
COMPLEMENTARY
PLASTIC/EPOXY
DIP
DIP14,.3
RECTANGULAR
IN-LINE
BULK
5/15
220 ns
Not Qualified
4.2 mm
FF/Latches
15 V
3 V
5
NO
CMOS
INDUSTRIAL
NICKEL PALLADIUM GOLD
THROUGH-HOLE
2.54 mm
DUAL
POSITIVE EDGE
7.62 mm
7 MHz
HEF40174BP,652
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
R-PDIP-T16
e3
21.6 mm
5000000 Hz
.36 Amp
6
16
TRUE
DIP16,.3
155 ns
4.7 mm
MATTE TIN
5 MHz
HEF40174BT,652
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G16
9.9 mm
SOP
SOP16,.25
SMALL OUTLINE
260
1.75 mm
YES
Nickel/Palladium/Gold (Ni/Pd/Au)
GULL WING
1.27 mm
30
3.9 mm
HEF40174BT,653
TR
HEF40175BP,652
4
160 ns
HEF4027BP,652
HEF4027BP,652 by NXP Semiconductors is a CMOS latch with 2 functions and 2 bits. It operates at a nominal voltage of 5V and has a max frequency of 4MHz. Ideal for industrial applications requiring positive edge triggering, it comes in an in-line package style with 16 terminals.
J-K FLIP-FLOP
4000000 Hz
210 ns
4 MHz
HEF4043BP,652
R-S LATCH; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
R-S LATCH
3-STATE
180 ns
HIGH LEVEL
HEF4044BT,652
R-S LATCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
185 ns
LOW LEVEL
HEF4044BT,653
HSTL16918DGG,512
D LATCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR;
HSTL
R-PDSO-G48
12.5 mm
D LATCH
9
48
70 Cel
0 Cel
TSSOP
TSSOP48,.3,20
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
3.3
5.2 ns
1.2 mm
3.45 V
3.15 V
COMMERCIAL
.5 mm
6.1 mm
N74F112D,602
J-K FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
F/FAST
80000000 Hz
20 Amp
21 mA
7.5 ns
5.5 V
4.5 V
TTL
NEGATIVE EDGE
80 MHz
N74F112D,623
N74F112N,602
J-K FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
245
40
N74F174N,602
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
45 mA
11 ns
N74F175AD,602
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
125000000 Hz
31 mA
9 ns
125 MHz
N74F175AD,623
N74F175AN,602
TUBE
N74F259D,602
NXP Semiconductors' N74F259D,602 is a TTL latch with 16 terminals and 5V supply voltage. It features a propagation delay of 10ns, low-level trigger type, and operates b/w 0-70°C. Ideal for applications requiring fast data storage and retrieval in commercial-grade environments.
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
75 mA
10 ns
N74F259D,623
NXP Semiconductors' N74F259D,623 is a TTL latch with 16 terminals and 10 ns propagation delay. Operating b/w 0-70°C, it has a supply voltage range of 4.5-5.5V and can handle up to 50 pF load capacitance. Ideal for applications requiring low-level trigger type in commercial temperature grade environments.
N74F259N,602
D LATCH; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
N74F273AD,602
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G20
12.8 mm
8
20
SOP20,.4
43 mA
2.65 mm
7.5 mm
N74F273AD,623
NXP Semiconductors' N74F273AD,623 is an 8-bit latch with a 5V supply voltage and 10ns propagation delay. It features positive edge triggering, operates at temperatures from 0 to 70°C, and has a max frequency of 125MHz. Ideal for applications requiring fast data storage and retrieval in commercial-grade environments.
N74F273AN,602
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
R-PDIP-T20
26.73 mm
DIP20,.3
N74F399N,602
FOUR 2:1 MUX FOLLOWED BY REGISTER
90000000 Hz
34 mA
Multiplexer/Demultiplexers
90 MHz
N74F5074D,602
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
WITH METASTABLE IMMUNE CHARACTERISTICS; MAX OUTPUT SKEW = 1.5NS
R-PDSO-G14
8.65 mm
SOP14,.25
30 mA
6.5 ns
N74F5074D,623
SSTU32866EC/G,557
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
SSTU
R-PBGA-B96
13.5 mm
25
96
OPEN-DRAIN
LFBGA
BGA96,6X16,32
GRID ARRAY, LOW PROFILE, FINE PITCH
1.8
1.8 ns
1.5 mm
Other Logic ICs
1.9 V
1.7 V
BALL
.8 mm
BOTTOM
5.5 mm
450 MHz
SSTUB32868ET/S,518
D FLIP-FLOP; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: BALL; No. of Terminals: 176; Package Code: TFBGA; Package Shape: RECTANGULAR;
32868
R-PBGA-B176
15 mm
28
176
TFBGA
BGA176,8X22,25
GRID ARRAY, THIN PROFILE, FINE PITCH
3 ns
1.15 mm
2 V
COMMERCIAL EXTENDED
.65 mm
6 mm
SSTUH32866EC/G,557
SSTV16859DGG,118
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TSSOP; Package Shape: RECTANGULAR;
SSTV
R-PDSO-G64
17 mm
13
64
TSSOP64,.32,20
2.5,2.5/3.3
2.8 ns
2.7 V
2.3 V
2.5
200 MHz
74AHC259D-Q100J
D LATCH; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
AHC/VHC/H/U/V
8 Amp
125 Cel
2/5.5
19 ns
AEC-Q100
AUTOMOTIVE
74AHCT259D-Q100J
AHCT/VHCT/VT
13 ns
74AHCT259PW-Q100J
D LATCH; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
5 mm
TSSOP16,.25
1.1 mm
4.4 mm
74HC74N-Q100U
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
HC/UH
20000000 Hz
4 Amp
2/6
265 ns
6 V
24 MHz
SSTV16857DGG,118
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR;
74AUP1G374GW-Q100,125
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
AUP/ULP/V
R-PDSO-G6
2 mm
21.6 ns
3.6 V
.8 V
1.1
1.25 mm
510 MHz
HEF4027BT-Q100,118
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
15 MHz
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