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N74F273AD,623

NXP Semiconductors

N74F273AD,623 by NXP Semiconductors

NXP Semiconductors' N74F273AD,623 is an 8-bit latch with a 5V supply voltage and 10ns propagation delay. It features positive edge triggering, operates at temperatures from 0 to 70°C, and has a max frequency of 125MHz. Ideal for applications requiring fast data storage and retrieval in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 6,502 parts In-Stock

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Digiode

USA . 2,306 parts In-Stock

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Inventory MP

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Bristol Electronics

USA . 1,567 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Anansix

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AZTECH Wire

Italy . 325 parts In-Stock

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$17.883

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Ampacity Inc.

Singapore . 283 parts In-Stock

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$26.000

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One Stop Electronics

USA . 851 parts In-Stock

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UNI Independent Distributors

Spain . 6,462 parts In-Stock

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Corphita

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Aranea Global

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Overview

Discover the innovative N74F273AD,623 by NXP Semiconductors, a cutting-edge solution in the Latches & Flip-Flops category. Boasting top-quality construction and advanced technology, this product offers unmatched reliability and performance. With a wide range of applications, from industrial to consumer electronics, this versatile component ensures seamless operation and efficiency. Elevate your projects with the value and benefits that only NXP Semiconductors can deliver. Upgrade to excellence today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the latch or flip-flop.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and improving overall circuit reliability.

No. of Bits: 8

Suitable for applications requiring an 8-bit data storage capability.

Nominal Supply Voltage / Vsup (V): 5

Common voltage level for digital circuits, ensuring compatibility with other components.

Propagation Delay (tpd): 10 ns

Fast response time ensures quick and efficient operation of the latch or flip-flop.

Trigger Type: POSITIVE EDGE

Triggering on the positive edge of the input signal is well-suited for certain applications where this type of triggering is required.

Maximum Frequency At Nominal Supply: 125000000 Hz

High maximum frequency capability allows for high-speed operation in demanding applications.

Technology: TTL

TTL technology is well-established and reliable for digital circuits, ensuring stable performance.

Technical Specifications

Latches & Flip-Flops N74F273AD,623 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

125000000 Hz

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

43 mA

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

125 MHz

Trade Compliance

N74F273AD,623 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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